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Journal Articles

Heat Transfer Characteristics of High Heat Generating Integrated Circuit Chips Cooled Using Liquid Cold Plate—A Combined Numerical and Experimental Study

Naveen G. Patil, Tapano Kumar Hotta
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. February 2021, 13(1): 011019.
Paper No: TSEA-19-1623
https://doi.org/10.1115/1.4047564
Published Online: August 5, 2020
... Email: naveenpatil.g@vit.ac.in Email: tapano.hotta@vit.ac.in 15 12 2019 07 06 2020 07 06 2020 05 08 2020 electronic cooling forced convection heat transfer enhancement high heat-generating element IC chips liquid cold plate SMPS board thermal management...
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Topics: Heat, Temperature, Water, Reynolds number, Integrated circuits