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Keywords: electronics cooling
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. August 2022, 14(8): 081013.
Paper No: TSEA-21-1294
Published Online: February 8, 2022
... the temperature along the sample line for the cases where the thin film side walls are thermally insulated and where they are held at constant temperature. thin films heat spreaders diamond graphene integrated circuit thermal management electronics cooling conjugate heat transfer forced convection...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. February 2022, 14(2): 021002.
Paper No: TSEA-21-1006
Published Online: June 18, 2021
... cycle characterized by flow conditions similar to Couette flow. Email: 160100001@iitb.ac.in Email: kshankar@iitb.ac.in 05 01 2021 03 05 2021 05 05 2021 18 06 2021 convective heat transfer flow agitation electronics cooling numerical modeling electronic cooling...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. June 2021, 13(3): 031003.
Paper No: TSEA-20-1302
Published Online: September 17, 2020
... 2020 17 09 2020 flow maldistribution thermal resistance manifold configuration temperature distribution uniformity electronics cooling branched manifold forced convection heat exchangers heat transfer enhancement micro/nanoscale heat transfer As the world is shifting toward...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. April 2020, 12(2): 021003.
Paper No: TSEA-18-1342
Published Online: August 31, 2019
... transfer electronics cooling coefficient of performance genetic algorithm MOGA-CFD energy efficiency heat transfer enhancement 03 07 2018 12 06 2019 12 06 2019 28 06 2019 Contributed by the Heat Transfer Division of ASME for publication in the J ournal of T hermal S...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Thermal Sci. Eng. Appl. December 2019, 11(6): 061007.
Paper No: TSEA-18-1343
Published Online: May 13, 2019
... received March 9, 2019; published online May 13, 2019. Assoc. Editor: Samuel Sami. 03 07 2018 09 03 2019 10 03 2019 liquid cooled heatsink design unit cell approximation water cooling electronics cooling Thermal management of server electronics within data centers has...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Thermal Sci. Eng. Appl. June 2019, 11(3): 034501.
Paper No: TSEA-17-1462
Published Online: January 29, 2019
... online January 29, 2019. Assoc. Editor: Gamal Refaie-Ahmed. 29 11 2017 11 11 2018 nanofluid boron nitride heat transfer enhancement forced convection electronics cooling liquid cooling Transistor number density in microprocessors has been increasing to meet the consumer...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Thermal Sci. Eng. Appl. March 2013, 5(1): 011006.
Paper No: TSEA-12-1102
Published Online: February 22, 2013
.... synthetic jet microchannel heat transfer enhancement heat sink electronics cooling Liquid microchannel cooling has shown considerable promise for electronic devices requiring high heat flux removal [ 1–3 ]. For many single-phase microchannel cooling applications where the channel flow is laminar...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. September 2012, 4(3): 031009.
Published Online: July 16, 2012
... setup and potentially for larger applications. 27 11 2011 18 04 2012 16 07 2012 16 07 2012 system pressure electronics cooling pumped refrigerant loop critical heat flux premature dry out thermal storage An FTS Maxicool RC100 was used to remove heat from a PRL...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. December 2011, 3(4): 041003.
Published Online: October 24, 2011
... flow boiling microevaporators refrigerant electronics cooling data centers green energy exergy Reduction of primary energy consumption is strongly required to mitigate global warming caused by fossil fuel consumption. To achieve this objective, the use of waste heat thermal energy...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. September 2011, 3(3): 031009.
Published Online: August 12, 2011
... Technologies ,” Heat Transfer Eng. , 28 ( 4 ), pp. 258 – 281 . 10.1080/01457630601117799 5 Ndao , S. , Peles , Y. , and Jensen , M. K. , 2009 , “Multi-Objective Thermal Design Optimization and Comparative Analysis of Electronics Cooling Technologies,” Int. J. Heat Mass Transfer...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. September 2009, 1(3): 031006.
Published Online: March 16, 2010
... alumina nanoparticle suspension over using the base fluid alone. In fact, there is an optimal volume fraction (1%) for this nanofluid and electronics cooling system combination that maximizes the heat dissipated. However, we find that this benefit decreases as the volume fraction, and hence the viscosity...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. June 2009, 1(2): 021003.
Published Online: November 4, 2009
... 2008 07 09 2009 04 11 2009 04 11 2009 cooling heat sinks insulated gate bipolar transistors integrated circuit packaging thermal resistance VC heat dissipation thermal characteristic power module electronics cooling Integrated packaging technology has...