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Yong-Kyu Yoon
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Proceedings Papers

Pt Heater/Sensor Microarray for Distributed Fluidic Cooling Assessment

Yong-Kyu Yoon, Mark G. Allen
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 669-675, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/MEMS-23894
https://doi.org/10.1115/IMECE2001/MEMS-23894
View Paper titled, Pt Heater/Sensor Microarray for Distributed Fluidic Cooling Assessment
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Topics: Cooling, Microelectromechanical systems, Sensors, Temperature, Heating, Lasers, Platinum, Cavities, Design, Heat
Proceedings Papers

A MEMS Active Cooling Substrate for Microelectronics Thermal Management

Yong Wang, Guang Yuan, Yong-Kyu Yoon, Mark G. Allen, Sue Ann Bidstrup
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 461-463, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-42799
https://doi.org/10.1115/IMECE2003-42799
View Paper titled, A MEMS Active Cooling Substrate for Microelectronics Thermal Management
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Topics: Cooling, Microelectromechanical systems, Microelectronic devices, Thermal management, Jets, Convection, Electrical wires, Electronic systems, Energy consumption, Heat
Proceedings Papers

Fabrication of Micromachined Mold Masters for 3-D, High-Aspect-Ratio Cell Culturing Scaffolds

Yanzhu Zhao, Xiaosong Wu, Yong-Kyu Yoon, Jung-Hwan Park, Stephen J. Kennedy, Zvi Schwartz, Barbara D. Boyan, Mark G. Allen
Proc. ASME. IMECE2005, Microelectromechanical Systems, 169-175, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-81991
https://doi.org/10.1115/IMECE2005-81991
View Paper titled, Fabrication of Micromachined Mold Masters for 3-D, High-Aspect-Ratio Cell Culturing Scaffolds
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Topics: Manufacturing, Micromachining, Bone, Semiconductor wafers, Etching, Hydrogels, Molding, Plasma desorption mass spectrometry, Silicon
Journal Articles

Optimization of Synthetic Jet Fluidic Structures in Printed Wiring Boards

Yong Wang, Guang Yuan, Yong-Kyu Yoon, Mark G. Allen, Sue Ann Bidstrup
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 353–359.
https://doi.org/10.1115/1.2351900
Published Online: February 20, 2006
View Articletitled, Optimization of Synthetic Jet Fluidic Structures in Printed Wiring Boards
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Topics: Cooling, Dimensions, Heat transfer, Jets, Printed circuit boards, Diaphragms (Mechanical devices), Diaphragms (Structural), Thermal management, Flow (Dynamics), Fluid mechanics