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Journal Articles

Compressive Experimental Analysis and Constitutive Model of Sintered Nano-Silver

Gong He, Wang Tongyang, Zhu Jianqun, Li Shujin, Yao Yao
Journal: Journal of Applied Mechanics
Article Type: Research Papers
J. Appl. Mech. March 2023, 90(3): 031004.
Paper No: JAM-22-1343
DOI: https://doi.org/10.1115/1.4056253
Published Online: December 2, 2022
View Article titled, Compressive Experimental Analysis and Constitutive Model of Sintered Nano-Silver
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Topics: Constitutive equations, Damage, Silver
Proceedings Papers

Modeling and Cycle Parameter Matching of a High-Speed Variable Cycle Turbofan-Ramjet Engine

Yao Yao, Xiaobo Zhang, Mingyang Zhang, Zhanxue Wang
Proc. ASME. GT2022, Volume 1: Aircraft Engine; Ceramics and Ceramic Composites, V001T01A006, June 13–17, 2022
Paper No: GT2022-80505
DOI: https://doi.org/10.1115/GT2022-80505
View Paper titled, Modeling and Cycle Parameter Matching of a High-Speed Variable Cycle Turbofan-Ramjet Engine
Click here to open pdf in another window PDF for Modeling and Cycle Parameter Matching of a High-Speed Variable Cycle Turbofan-Ramjet Engine
Topics: Cycles, Engines, Modeling, Ramjets, Turbofans
Journal Articles

Modeling and Cycle Parameter Matching of a High-Speed Variable Cycle Turbofan-Ramjet Engine

Yao Yao, Xiao-Bo Zhang, Mingyang Zhang, Zhanxue Wang
Journal: Journal of Engineering for Gas Turbines and Power
Article Type: Research-Article
J. Eng. Gas Turbines Power. October 2022, 144(10): 101003.
Paper No: GTP-22-1276
DOI: https://doi.org/10.1115/1.4055214
Published Online: August 25, 2022
View Article titled, Modeling and Cycle Parameter Matching of a High-Speed Variable Cycle Turbofan-Ramjet Engine
Click here to open pdf in another window PDF for Modeling and Cycle Parameter Matching of a High-Speed Variable Cycle Turbofan-Ramjet Engine
Topics: Engines, Simulation models, Ramjets, Modeling
Proceedings Papers

Investigation on Tool Performance in Ultrasonic Vibration Assisted Cutting SiC f /SiC Ceramic Matrix Composites

Yi-feng Xiong, Wen-hu Wang, Yao-yao Shi, Rui-song Jiang, Bo Huang, Cong Liu, Xiao-fen Liu, Xiao-xiang Zhu
Proc. ASME. IMECE2021, Volume 3: Advanced Materials: Design, Processing, Characterization, and Applications, V003T03A060a, November 1–5, 2021
Paper No: IMECE2021-72527
DOI: https://doi.org/10.1115/IMECE2021-72527
View Paper titled, Investigation on Tool Performance in Ultrasonic Vibration Assisted Cutting SiC f /SiC Ceramic Matrix Composites
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Topics: Composite materials, Cutting, Silicon carbide ceramics, Vibration
Journal Articles

A Review of Recent Research on the Mechanical Behavior of Lead-Free Solders

Yao Yao, Xu Long, Leon M. Keer
Journal: Applied Mechanics Reviews
Article Type: Review Articles
Appl. Mech. Rev. July 2017, 69(4): 040802.
Paper No: AMR-17-1013
DOI: https://doi.org/10.1115/1.4037462
Published Online: August 16, 2017
View Article titled, A Review of Recent Research on the Mechanical Behavior of Lead-Free Solders
Click here to open pdf in another window PDF for A Review of Recent Research on the Mechanical Behavior of Lead-Free Solders
Topics: Creep, Damage, Electrodiffusion, Fatigue, Fatigue life, Lead-free solders, Solder joints, Solders, Stress, Temperature
Journal Articles

Development of a Variable Stiffness Over Tube Based on Low-Melting-Point-Alloy for Endoscopic Surgery

Ruzhen Zhao, Yao Yao, Yun Luo
Journal: Journal of Medical Devices
Article Type: Research-Article
J. Med. Devices. June 2016, 10(2): 021002.
Paper No: MED-15-1173
DOI: https://doi.org/10.1115/1.4032813
Published Online: May 12, 2016
View Article titled, Development of a Variable Stiffness Over Tube Based on Low-Melting-Point-Alloy for Endoscopic Surgery
Click here to open pdf in another window PDF for Development of a Variable Stiffness Over Tube Based on Low-Melting-Point-Alloy for Endoscopic Surgery
Topics: Stiffness, Surgery, Endoscopic devices
Proceedings Papers

Numerical Analysis to Lead Free Solder/Intermetallic Interconnect With Application of Wiedemann-Franz-Lorenz Relation

Yao Yao, Jared Fry, Morris Fine, Leon Keer
Proc. ASME. IMECE2012, Volume 3: Design, Materials and Manufacturing, Parts A, B, and C, 1275-1284, November 9–15, 2012
Paper No: IMECE2012-88634
DOI: https://doi.org/10.1115/IMECE2012-88634
View Paper titled, Numerical Analysis to Lead Free Solder/Intermetallic Interconnect With Application of Wiedemann-Franz-Lorenz Relation
Click here to open pdf in another window PDF for Numerical Analysis to Lead Free Solder/Intermetallic Interconnect With Application of Wiedemann-Franz-Lorenz Relation
Topics: Intermetallic compounds, Lead-free solders, Numerical analysis, Solders, Fracture (Materials), Thermal conductivity, Tin, Electric current, Electrical conductivity, Materials properties
Proceedings Papers

Cohesive Fracture Mechanics Based Finite Element Analysis to the Performance of Lead Free Solders in BGA Packaging Under Drop Impact

Yao Yao
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 757-765, November 9–15, 2012
Paper No: IMECE2012-88629
DOI: https://doi.org/10.1115/IMECE2012-88629
View Paper titled, Cohesive Fracture Mechanics Based Finite Element Analysis to the Performance of Lead Free Solders in BGA Packaging Under Drop Impact
Click here to open pdf in another window PDF for Cohesive Fracture Mechanics Based Finite Element Analysis to the Performance of Lead Free Solders in BGA Packaging Under Drop Impact
Topics: Ball-Grid-Array packaging, Finite element analysis, Fracture mechanics, Lead-free solders, Solders, Alloys, Packaging, Electronic packaging, Failure, Fracture (Materials)