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Yaman Manaserh
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Journal Articles

Performance Analysis of Liquid-to-Air Heat Exchanger of High-Power Density Racks

Ali Heydari, Ahmad R. Gharaibeh, Mohammad Tradat, Qusai Soud, Yaman Manaserh, Vahideh Radmard, Bahareh Eslami, Jeremy Rodriguez, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041102.
Paper No: EP-24-1007
https://doi.org/10.1115/1.4065537
Published Online: June 17, 2024
View Article titled, Performance Analysis of Liquid-to-Air Heat Exchanger of High-Power Density Racks
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Topics: Coolants, Cooling, Data centers, Density, Heat, Heat exchangers, Temperature, Fluids, Stress, Cooling systems
Journal Articles

Experimental and Numerical Investigation of Single-Phase Liquid Cooling for Heterogeneous Integration Multichip Module

Ahmad R. Gharaibeh, Qusai Soud, Yaman Manaserh, Mohammad Tradat, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041101.
Paper No: EP-24-1006
https://doi.org/10.1115/1.4065446
Published Online: May 24, 2024
View Article titled, Experimental and Numerical Investigation of Single-Phase Liquid Cooling for Heterogeneous Integration Multichip Module
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Topics: Computer simulation, Cooling, Flow (Dynamics), Heat, Heat sinks, Multi-chip modules, Pressure drop, Temperature, Fluids, Coolants
Proceedings Papers

Experimental and Numerical Investigation of Single-Phase Liquid Cooling for Heterogeneous Integration Multi-Chip Module

Ahmad R. Gharaibeh, Qusai Soud, Yaman Manaserh, Mohammad Tradat, Bahgat Sammakia
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112452
https://doi.org/10.1115/IPACK2023-112452
View Paper titled, Experimental and Numerical Investigation of Single-Phase Liquid Cooling for Heterogeneous Integration Multi-Chip Module
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Topics: Cooling, Heat sinks, Multi-chip modules
Proceedings Papers

Performance Analysis of Liquid-to-Air Heat Exchangers of High-Power Density Racks

Ali Heydari, Ahmad R. Gharaibeh, Mohammad Tradat, Qusai Soud, Yaman Manaserh, Vahideh Radmard, Bahareh Eslami, Bahgat Sammakia, Jeremy Rodriguez
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A017, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112404
https://doi.org/10.1115/IPACK2023-112404
View Paper titled, Performance Analysis of Liquid-to-Air Heat Exchangers of High-Power Density Racks
Open the PDF for Performance Analysis of Liquid-to-Air Heat Exchangers of High-Power Density Racks in another window
Topics: Cooling, Data centers, Density, Heat, Heat exchangers
Proceedings Papers

Liquid to Air Cooling for High Heat Density Liquid Cooled Data Centers

Ali Heydari, Vahideh Radmard, Bahareh Eslami, Mohammad I. Tradat, Yaman Manaserh, Harold Miyamura, Uschas Chowdhury, Pardeep Shahi, Kevin Dave Hall, Bahgat Sammakia, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A005, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97386
https://doi.org/10.1115/IPACK2022-97386
View Paper titled, Liquid to Air Cooling for High Heat Density Liquid Cooled Data Centers
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Topics: Cooling, Data centers, Density, Heat, Heat exchangers
Proceedings Papers

Direct-to-Chip Two-Phase Cooling for High Heat Flux Processors

Ali Heydari, Yaman Manaserh, Ahmad Abubakar, Carol Caceres, Harold Miyamura, Alfonso Ortega, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97047
https://doi.org/10.1115/IPACK2022-97047
View Paper titled, Direct-to-Chip Two-Phase Cooling for High Heat Flux Processors
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Topics: Cooling, Heat flux
Proceedings Papers

Liquid Cooling Utilizing a Hybrid Microchannel/Multi-Jet Heat Sink: A Component Level Study of Commercial Product

Cong Hiep Hoang, Mohammad Tradat, Yaman Manaserh, Bharath Ramakrisnan, Srikanth Rangarajan, Yaser Hadad, Scott Schiffres, Bahgat Sammakia
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A008, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2627
https://doi.org/10.1115/IPACK2020-2627
View Paper titled, Liquid Cooling Utilizing a Hybrid Microchannel/Multi-Jet Heat Sink: A Component Level Study of Commercial Product
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Topics: Cooling, Fins, Heat sinks, Microchannels, Pressure drop, Thermal resistance