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Proceedings Papers

Modeling and Prediction of Sub-Micrometer Heat Transfer During Thermomechanical Data Storage

William P. King, Juan G. Santiago, Thomas W. Kenny, Kenneth E. Goodson
Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 583-588, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0324
https://doi.org/10.1115/IMECE1999-0324
View Paper titled, Modeling and Prediction of Sub-Micrometer Heat Transfer During Thermomechanical Data Storage
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Topics: Data storage systems, Heat transfer, Modeling, Thermomechanics, Polymers, Cantilevers, Temperature, Atomic force microscopy, Heat, Phonons
Journal Articles

Reduced Order Design Optimization of Liquid Cooled Heat Sinks

Aniket Ajay Lad, Kai A. James, William P. King, Nenad Miljkovic
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041105.
Paper No: EP-21-1112
https://doi.org/10.1115/1.4052400
Published Online: October 6, 2021
View Article titled, Reduced Order Design Optimization of Liquid Cooled Heat Sinks
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Topics: Design, Flow (Dynamics), Optimization, Pressure drop, Heat sinks
Journal Articles

Springboard Droplet Bouncing on Flexible Superhydrophobic Substrates

Patricia B. Weisensee, Junjiao Tian, Nenad Miljkovic, William P. King
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Photo Gallery
J. Heat Mass Transfer. February 2017, 139(2): 020902.
Paper No: HT-16-1711
https://doi.org/10.1115/1.4035572
Published Online: January 6, 2017
View Article titled, Springboard Droplet Bouncing on Flexible Superhydrophobic Substrates
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Topics: Drops, Cantilevers, Imaging, Membranes, Oscillations, Shapes, Stiffness, Water
Journal Articles

Droplet Impingement and Vapor Layer Formation on Hot Hydrophobic Surfaces

Ji Yong Park, Andrew Gardner, William P. King, David G. Cahill
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. September 2014, 136(9): 092902.
Paper No: HT-13-1249
https://doi.org/10.1115/1.4027856
Published Online: June 27, 2014
View Article titled, Droplet Impingement and Vapor Layer Formation on Hot Hydrophobic Surfaces
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Topics: Drops, Temperature, Vapors, Water, Heat transfer
Journal Articles

Thermomechanical Modeling of Scanning Joule Expansion Microscopy Imaging of Single-Walled Carbon Nanotube Devices

Jizhou Song, Chaofeng Lu, Xu Xie, Yuhang Li, Yihui Zhang, Kyle L. Grosse, Simon Dunham, Yonggang Huang, William P. King, John A. Rogers
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research-Article
J. Appl. Mech. July 2013, 80(4): 040907.
Paper No: JAM-13-1030
https://doi.org/10.1115/1.4024175
Published Online: May 31, 2013
View Article titled, Thermomechanical Modeling of Scanning Joule Expansion Microscopy Imaging of Single-Walled Carbon Nanotube Devices
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Topics: Imaging, Joules, Microscopy, Modeling, Single-walled carbon nanotubes, Single-walled nanotubes, Temperature, Temperature distribution, Thermal expansion, Thermomechanics
Proceedings Papers

Measurements of Microjet Cooling and Phase Change Characteristics Using Microcantilever Heaters

Jungchul Lee, Hanif Hunter, Fabian Goericke, Nisarga Naik, Mark Allen, Ari Glezer, William P. King
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 163-169, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33291
https://doi.org/10.1115/IPACK2007-33291
View Paper titled, Measurements of Microjet Cooling and Phase Change Characteristics Using Microcantilever Heaters
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Topics: Boiling, Cooling, Flow (Dynamics), Flux (Metallurgy), Heat, Microcantilevers, Critical heat flux, Metrology, Micromachining, Microscale devices
Proceedings Papers

Heat Transfer Between a Heated Microcantilever and the Substrate

Keunhan Park, Graham L. W. Cross, Zhuomin M. Zhang, William P. King
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 805-815, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32536
https://doi.org/10.1115/HT2007-32536
View Paper titled, Heat Transfer Between a Heated Microcantilever and the Substrate
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Topics: Heat transfer, Thermometers, Cantilevers, Temperature, Atomic force microscopy, Displacement, Heating, Nanoscale heat transfer, Nanoscale phenomena, Platinum
Proceedings Papers

Characterization of Heated Atomic Force Microscope Cantilevers in Air and Vacuum

Jungchul Lee, Tanya L. Wright, Mark Abel, Erik Sunden, Alexei Marchenkov, Samuel Graham, William P. King
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1767-1772, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73456
https://doi.org/10.1115/IPACK2005-73456
View Paper titled, Characterization of Heated Atomic Force Microscope Cantilevers in Air and Vacuum
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Topics: Atomic force microscopy, Cantilevers, Temperature measurement, Vacuum
Proceedings Papers

Self-Assembly for Three Dimensional Integration of Functional Electrical Components

Andrew H. Cannon, Yueming Hua, Clifford L. Henderson, William P. King
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1943-1948, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73325
https://doi.org/10.1115/IPACK2005-73325
View Paper titled, Self-Assembly for Three Dimensional Integration of Functional Electrical Components
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Topics: Electrical components, Microelectronic devices, Packaging, Self-assembly
Proceedings Papers

Transport in Thermal Dip Pen Nanolithography

Brent A. Nelson, Tanya L. Wright, William P. King, Paul E. Sheehan, Lloyd J. Whitman
Proc. ASME. NANO2004, Design, Synthesis, and Applications, 125-126, September 22–24, 2004
Publisher: American Society of Mechanical Engineers
Paper No: NANO2004-46074
https://doi.org/10.1115/NANO2004-46074
View Paper titled, Transport in Thermal Dip Pen Nanolithography
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Topics: Nanolithography, Inks, Atomic force microscopy, Resolution (Optics), Cathode ray oscilloscopes, Contamination, Electron beams, Imaging, Lithography, Manufacturing
Journal Articles

Experimental Investigation on the Heat Transfer Between a Heated Microcantilever and a Substrate

Keunhan Park, Graham L. W. Cross, Zhuomin M. Zhang, William P. King
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. October 2008, 130(10): 102401.
https://doi.org/10.1115/1.2953238
Published Online: August 8, 2008
View Article titled, Experimental Investigation on the Heat Transfer Between a Heated Microcantilever and a Substrate
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Topics: Cantilevers, Heat transfer, Temperature, Thermometers, Temperature distribution
Journal Articles

A Compact Approach to On-Chip Interconnect Heat Conduction Modeling Using the Finite Element Method

Siva P. Gurrum, Yogendra K. Joshi, William P. King, Koneru Ramakrishna, Martin Gall
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031001.
https://doi.org/10.1115/1.2957318
Published Online: July 29, 2008
View Article titled, A Compact Approach to On-Chip Interconnect Heat Conduction Modeling Using the Finite Element Method
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Topics: Finite element methods, Heat conduction, Metals, Modeling, Simulation, Temperature, Chain, Finite element analysis, Thermal conductivity, Clocks
Proceedings Papers

Comparison of Piezoresistive and Thermal Detection Approaches to Atomic Force Microscopy Topography Measurement

William P. King, Thomas W. Kenny, Kenneth E. Goodson
Proc. ASME. IMECE2002, Microelectromechanical Systems, 111-116, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-33295
https://doi.org/10.1115/IMECE2002-33295
View Paper titled, Comparison of Piezoresistive and Thermal Detection Approaches to Atomic Force Microscopy Topography Measurement
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Topics: Atomic force microscopy, Cantilevers, Resolution (Optics), Electrical conductance, Noise (Sound), Shapes, Signals, Temperature, Thermal conductivity
Proceedings Papers

Resolution Limits of Nanoscale Thermal Processing With the Atomic Force Microscope

William P. King, Kenneth E. Goodson
Proc. ASME. IMECE2002, Heat Transfer, Volume 5, 277-282, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-33854
https://doi.org/10.1115/IMECE2002-33854
View Paper titled, Resolution Limits of Nanoscale Thermal Processing With the Atomic Force Microscope
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Topics: Atomic force microscopy, Nanoscale phenomena, Resolution (Optics), Temperature, Cantilevers, Heat conduction, Silicon, Clusters (Chemistry), Design, Manufacturing
Journal Articles

Size Effect on the Thermal Conductivity of Thin Metallic Films Investigated by Scanning Joule Expansion Microscopy

Siva P. Gurrum, William P. King, Yogendra K. Joshi, Koneru Ramakrishna
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. August 2008, 130(8): 082403.
https://doi.org/10.1115/1.2928014
Published Online: May 30, 2008
View Article titled, Size Effect on the Thermal Conductivity of Thin Metallic Films Investigated by Scanning Joule Expansion Microscopy
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Topics: Metals, Temperature, Thermal conductivity, Metallic films, Joules, Microscopy, Size effect, Heating
Proceedings Papers

Temperature-Dependence of Water Bridge Formation in Atomic Force Microscopy

Brent A. Nelson, Mark A. Poggi, Lawrence A. Bottomley, William P. King
Proc. ASME. IMECE2003, Microelectromechanical Systems, 629-636, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-41762
https://doi.org/10.1115/IMECE2003-41762
View Paper titled, Temperature-Dependence of Water Bridge Formation in Atomic Force Microscopy
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Topics: Adhesion, Aqueducts, Atomic force microscopy, Nanolithography, Temperature, Temperature effects
Proceedings Papers

A Novel Compact Method for Thermal Modeling of On-Chip Interconnects Based on the Finite Element Method

Siva P. Gurrum, Yogendra K. Joshi, William P. King, Koneru Ramakrishna
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 441-445, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-41596
https://doi.org/10.1115/IMECE2003-41596
View Paper titled, A Novel Compact Method for Thermal Modeling of On-Chip Interconnects Based on the Finite Element Method
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Topics: Finite element methods, Heating, Joules, Modeling, Temperature, Engineering simulation, Simulation, Storage, Current density, Design
Proceedings Papers

Transport During Hot Embossing Micro-Manufacturing Studied via Stylus Profilometry and SEM

Harry D. Rowland, Joseph L. Charest, Tanya L. Wright, William P. King
Proc. ASME. IMECE2003, Heat Transfer, Volume 3, 169-176, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-41838
https://doi.org/10.1115/IMECE2003-41838
View Paper titled, Transport During Hot Embossing Micro-Manufacturing Studied via Stylus Profilometry and SEM
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Topics: Embossing, Micromanufacturing, Stress, Polymers, Silicon, Temperature, Glass transition, Manufacturing, Micromachining, Nanomanufacturing
Proceedings Papers

Improved Modeling of Non-Continuum Heat Transfer During Topographical Imaging With a Heated Atomic Force Microscope Cantilever

Nathan D. Masters, Wenjing Ye, William P. King
Proc. ASME. IMECE2004, Microelectromechanical Systems, 165-172, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-60046
https://doi.org/10.1115/IMECE2004-60046
View Paper titled, Improved Modeling of Non-Continuum Heat Transfer During Topographical Imaging With a Heated Atomic Force Microscope Cantilever
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Topics: Atomic force microscopy, Cantilevers, Heat transfer, Imaging, Modeling, Design, Data storage systems, Density, Heat conduction, Kinetic theory
Proceedings Papers

Nanoscale Inking, Melting, and Soldering With a Heated Atomic Force Microscope Cantilever Tip

William P. King, Brent A. Nelson, Tanya L. Wright, Paul A. Sheehan, Lloyd J. Whitman
Proc. ASME. IMECE2004, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 509-510, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-59126
https://doi.org/10.1115/IMECE2004-59126
View Paper titled, Nanoscale Inking, Melting, and Soldering With a Heated Atomic Force Microscope Cantilever Tip
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Topics: Atomic force microscopy, Cantilevers, Melting, Nanoscale phenomena, Soldering, Nanolithography, Manufacturing, Temperature, Contamination, Design