1-6 of 6
Tomohide Yabuki
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Unileg Thermoelectric Module Comprised by Coated Halide-Perovskite Thin Film

Shrikant Saini, Ajay Kumar Baranwal, Tomohide Yabuki, Shuzi Hayase, Koji Miyazaki
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. July 2020, 142(7): 074502.
Paper No: HT-19-1562
https://doi.org/10.1115/1.4047360
Published Online: June 10, 2020
View Article titled, Unileg Thermoelectric Module Comprised by Coated Halide-Perovskite Thin Film
Open the PDF for Unileg Thermoelectric Module Comprised by Coated Halide-Perovskite Thin Film in another window
Topics: Thin films, Electrical conductivity, Temperature, Thermal conductivity
Proceedings Papers

Uni-Leg Thermoelectric Module Comprised by Coated Hybrid-Perovskite Thin Film

Shrikant Saini, Ajay Kumar Baranwal, Tomohide Yabuki, Shuzi Hayase, Koji Miyazaki
Proc. ASME. MNHMT2019, ASME 2019 6th International Conference on Micro/Nanoscale Heat and Mass Transfer, V001T06A003, July 8–10, 2019
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2019-4162
https://doi.org/10.1115/MNHMT2019-4162
View Paper titled, Uni-Leg Thermoelectric Module Comprised by Coated Hybrid-Perovskite Thin Film
Open the PDF for Uni-Leg Thermoelectric Module Comprised by Coated Hybrid-Perovskite Thin Film in another window
Topics: Thin films, Electrical conductivity, Flexible electronics, Thermal conductivity, Energy conversion, Glass, Spin coating, Temperature, Thermal energy
Proceedings Papers

Contribution of Microlayer Evaporation to Bubble Growth in Pool Saturated Boiling of Water

Tomohide Yabuki, Takuya Saitoh, Osamu Nakabeppu
Proc. ASME. ICNMM2013, ASME 2013 11th International Conference on Nanochannels, Microchannels, and Minichannels, V001T04A013, June 16–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2013-73211
https://doi.org/10.1115/ICNMM2013-73211
View Paper titled, Contribution of Microlayer Evaporation to Bubble Growth in Pool Saturated Boiling of Water
Open the PDF for Contribution of Microlayer Evaporation to Bubble Growth in Pool Saturated Boiling of Water in another window
Topics: Boiling, Bubbles, Evaporation, Water, Heat transfer, Heat flux, Microelectromechanical systems, Sensors, Temperature, Temperature measurement
Proceedings Papers

Heat Transfer Characteristics of Isolated Bubble Nucleate Boiling of Water

Tomohide Yabuki, Osamu Nakabeppu
Proc. ASME. AJTEC2011, ASME/JSME 2011 8th Thermal Engineering Joint Conference, T10196, March 13–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: AJTEC2011-44519
https://doi.org/10.1115/AJTEC2011-44519
View Paper titled, Heat Transfer Characteristics of Isolated Bubble Nucleate Boiling of Water
Open the PDF for Heat Transfer Characteristics of Isolated Bubble Nucleate Boiling of Water in another window
Topics: Bubbles, Heat transfer, Nucleate boiling, Water, Temperature, Evaporation, Heat, Heat flux, Microelectromechanical systems, Sensors
Proceedings Papers

Study on Heat Transfer Mechanism of Isolated Bubble Nucleate Boiling With MEMS Sensors

Tomohide Yabuki, Osamu Nakabeppu
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 1, 515-521, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22794
https://doi.org/10.1115/IHTC14-22794
View Paper titled, Study on Heat Transfer Mechanism of Isolated Bubble Nucleate Boiling With MEMS Sensors
Open the PDF for Study on Heat Transfer Mechanism of Isolated Bubble Nucleate Boiling With MEMS Sensors in another window
Topics: Bubbles, Heat transfer, Microelectromechanical systems, Nucleate boiling, Sensors, Temperature measurement
Proceedings Papers

Approach to Heat Transfer Mechanism Beneath Boiling Bubble With MEMS Sensor

Tomohide Yabuki, Osamu Nakabeppu
Proc. ASME. MNHMT2009, ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 2, 41-47, December 18–21, 2009
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2009-18244
https://doi.org/10.1115/MNHMT2009-18244
View Paper titled, Approach to Heat Transfer Mechanism Beneath Boiling Bubble With MEMS Sensor
Open the PDF for Approach to Heat Transfer Mechanism Beneath Boiling Bubble With MEMS Sensor in another window
Topics: Boiling, Bubbles, Heat transfer, Microelectromechanical systems, Sensors