1-20 of 56
Scott Miller
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Process Recipe and Functional Circuitry Performance on Aerosol Jet Printed Water-Based Silver Ink

Pradeep Lall, Sabina Bimali, Scott Miller
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041116.
Paper No: EP-24-1029
https://doi.org/10.1115/1.4066041
Published Online: August 17, 2024
View Article titled, Process Recipe and Functional Circuitry Performance on Aerosol Jet Printed Water-Based Silver Ink
Open the PDF for Process Recipe and Functional Circuitry Performance on Aerosol Jet Printed Water-Based Silver Ink in another window
Topics: Circuits, Design, Inks, Printing, Shear (Mechanics), Silver, Sintering, Aerosols, Stress, Water
Proceedings Papers

Repairability of SMDs on 3D Printed Circuitry for Sustainable Electronics Utilizing Direct Write Technique

Pradeep Lall, Md Golam Sarwar, Ved Soni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A015, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112061
https://doi.org/10.1115/IPACK2023-112061
View Paper titled, Repairability of SMDs on 3D Printed Circuitry for Sustainable Electronics Utilizing Direct Write Technique
Open the PDF for Repairability of SMDs on 3D Printed Circuitry for Sustainable Electronics Utilizing Direct Write Technique in another window
Topics: Additive manufacturing, Adhesives, Electronics, Flexible electronics, Printing, Surface mount devices, Sustainability
Proceedings Papers

Evaluation of Thermoformability of Additively Printed Circuits Printed Using Gravure Offset Printing Technique and Investigation of In-Mold Electronic Circuits

Pradeep Lall, Ved Soni, Jinesh Narangaparambil, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A014, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112060
https://doi.org/10.1115/IPACK2023-112060
View Paper titled, Evaluation of Thermoformability of Additively Printed Circuits Printed Using Gravure Offset Printing Technique and Investigation of In-Mold Electronic Circuits
Open the PDF for Evaluation of Thermoformability of Additively Printed Circuits Printed Using Gravure Offset Printing Technique and Investigation of In-Mold Electronic Circuits in another window
Topics: Circuits, Electronic circuits, Electronics, Offset printing
Proceedings Papers

Investigation of Performance and Repairability of Additively Printed Functional Circuits With Water-Based Silver Ink on an Inkjet Platform

Pradeep Lall, Shriram Kulkarni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A020, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-114686
https://doi.org/10.1115/IPACK2023-114686
View Paper titled, Investigation of Performance and Repairability of Additively Printed Functional Circuits With Water-Based Silver Ink on an Inkjet Platform
Open the PDF for Investigation of Performance and Repairability of Additively Printed Functional Circuits With Water-Based Silver Ink on an Inkjet Platform in another window
Topics: Circuits, Inks, Silver, Water, Printing, Manufacturing, Adhesives, Electronic circuits, Electronics, Filters
Proceedings Papers

Functional Circuit Performance of Printable Formable Inks for In-Mold Electronics Applications

Pradeep Lall, Jinesh Narangaparambil, Ved Soni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A019, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112069
https://doi.org/10.1115/IPACK2023-112069
View Paper titled, Functional Circuit Performance of Printable Formable Inks for In-Mold Electronics Applications
Open the PDF for Functional Circuit Performance of Printable Formable Inks for In-Mold Electronics Applications in another window
Topics: Adhesives, Circuits, Electronics, Inks, Printing
Proceedings Papers

Component Attach Process Recipe and Performance on Aerosol Printed Sustainable Silver Ink

Pradeep Lall, Sabina Bimali, Jinesh Narangaparambil, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A018, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112066
https://doi.org/10.1115/IPACK2023-112066
View Paper titled, Component Attach Process Recipe and Performance on Aerosol Printed Sustainable Silver Ink
Open the PDF for Component Attach Process Recipe and Performance on Aerosol Printed Sustainable Silver Ink in another window
Topics: Adhesives, Aerosols, Failure, Inks, Printing, Shear (Mechanics), Silver, Sintering, Stress, Sustainability
Proceedings Papers

Evaluation of Additive Circuits Printed With Sustainable Aqueous Silver Inks Using Aerosol Jet Printing and Gravure Offset Printing and Investigation of Circuit Repairability

Pradeep Lall, Ved Soni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A013, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112058
https://doi.org/10.1115/IPACK2023-112058
View Paper titled, Evaluation of Additive Circuits Printed With Sustainable Aqueous Silver Inks Using Aerosol Jet Printing and Gravure Offset Printing and Investigation of Circuit Repairability
Open the PDF for Evaluation of Additive Circuits Printed With Sustainable Aqueous Silver Inks Using Aerosol Jet Printing and Gravure Offset Printing and Investigation of Circuit Repairability in another window
Topics: Aerosols, Batteries, Circuits, Electronics, Inks, Offset printing, Printing, Silver, Sustainability
Proceedings Papers

Comparison of Machine Learning Approaches for Correlating Print Process Parameters to Realized Physical and Electrical Characteristics of Printed Electronics Using Inkjet Platform

Pradeep Lall, Ved Soni, Shriram Kulkarni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A012, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112056
https://doi.org/10.1115/IPACK2023-112056
View Paper titled, Comparison of Machine Learning Approaches for Correlating Print Process Parameters to Realized Physical and Electrical Characteristics of Printed Electronics Using Inkjet Platform
Open the PDF for Comparison of Machine Learning Approaches for Correlating Print Process Parameters to Realized Physical and Electrical Characteristics of Printed Electronics Using Inkjet Platform in another window
Topics: Electronics, Machine learning, Printing
Proceedings Papers

Additive Printing of Wearable EDA Sensors on In-Mold Electronics on Automotive Platform

Pradeep Lall, Hyesoo Jang, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A007, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111973
https://doi.org/10.1115/IPACK2023-111973
View Paper titled, Additive Printing of Wearable EDA Sensors on In-Mold Electronics on Automotive Platform
Open the PDF for Additive Printing of Wearable EDA Sensors on In-Mold Electronics on Automotive Platform in another window
Topics: Electronics, Manufacturing, Printing, Reliability, Sensors
Proceedings Papers

Process Performance Interactions for Additively Printed Water-Based Nanoparticle Sustainable Silver-Ink With Ultrasonic Atomization on Aerosol Jet Printer

Pradeep Lall, Daniel Karakitie, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111958
https://doi.org/10.1115/IPACK2023-111958
View Paper titled, Process Performance Interactions for Additively Printed Water-Based Nanoparticle Sustainable Silver-Ink With Ultrasonic Atomization on Aerosol Jet Printer
Open the PDF for Process Performance Interactions for Additively Printed Water-Based Nanoparticle Sustainable Silver-Ink With Ultrasonic Atomization on Aerosol Jet Printer in another window
Topics: Aerosols, Failure, Inks, Nanoparticles, Shear (Mechanics), Silver, Stress, Sustainability, Water
Proceedings Papers

Surface-Mount Component Attachment on Aerosol Jet Printed Sustainable Water-Base Silver Nanoparticle Ink

Pradeep Lall, Daniel Karakitie, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111957
https://doi.org/10.1115/IPACK2023-111957
View Paper titled, Surface-Mount Component Attachment on Aerosol Jet Printed Sustainable Water-Base Silver Nanoparticle Ink
Open the PDF for Surface-Mount Component Attachment on Aerosol Jet Printed Sustainable Water-Base Silver Nanoparticle Ink in another window
Topics: Additive manufacturing, Aerosols, Circuits, Inks, Nanoparticles, Silver, Surface mount components, Sustainability, Water
Proceedings Papers

Impact of Component Interconnectivity on Mechanical and Electrical Properties of Flexible Hybrid Electronics with Printed Water-based Silver Ink Circuits

Pradeep Lall, Fatahi Musa, Ved Soni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112012
https://doi.org/10.1115/IPACK2023-112012
View Paper titled, Impact of Component Interconnectivity on Mechanical and Electrical Properties of Flexible Hybrid Electronics with Printed Water-based Silver Ink Circuits
Open the PDF for Impact of Component Interconnectivity on Mechanical and Electrical Properties of Flexible Hybrid Electronics with Printed Water-based Silver Ink Circuits in another window
Topics: Bonding, Circuits, Electrical properties, Electronics, Inks, Silver, Water, Adhesives, Low temperature, Solders
Proceedings Papers

Sustainable Silver Ink Flexible Circuits Fabrication Using Direct Write Additive Manufacturing Techniques

Pradeep Lall, Fatahi Musa, Ved Soni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A010, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112001
https://doi.org/10.1115/IPACK2023-112001
View Paper titled, Sustainable Silver Ink Flexible Circuits Fabrication Using Direct Write Additive Manufacturing Techniques
Open the PDF for Sustainable Silver Ink Flexible Circuits Fabrication Using Direct Write Additive Manufacturing Techniques in another window
Topics: Additive manufacturing, Filters, Flexible electronics, Inks, Manufacturing, Silver, Sustainability, Circuits, Surface mount components, Biodegradable materials
Proceedings Papers

Reparability Test of Aerosol-Jet Printed Sustainable Silver Ink Circuit

Pradeep Lall, Sabina Bimali, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A017, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112064
https://doi.org/10.1115/IPACK2023-112064
View Paper titled, Reparability Test of Aerosol-Jet Printed Sustainable Silver Ink Circuit
Open the PDF for Reparability Test of Aerosol-Jet Printed Sustainable Silver Ink Circuit in another window
Topics: Adhesives, Aerosols, Circuits, Failure, Inks, Shear (Mechanics), Silver, Stress, Sustainability
Proceedings Papers

Direct Write Thermoformed Additive Silver Circuits With SMDs Attachment for In-Mold Electronics

Pradeep Lall, Md Golam Sarwar, Ved Soni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A016, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112063
https://doi.org/10.1115/IPACK2023-112063
View Paper titled, Direct Write Thermoformed Additive Silver Circuits With SMDs Attachment for In-Mold Electronics
Open the PDF for Direct Write Thermoformed Additive Silver Circuits With SMDs Attachment for In-Mold Electronics in another window
Topics: Circuits, Electronics, Printing, Silver, Surface mount devices
Proceedings Papers

Line Width and Electrical Performance Prediction for Inkjet Printed Conductors-Resistors-Inductors-Capacitors

Pradeep Lall, Shriram Kulkarni, Ved Soni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A009, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111980
https://doi.org/10.1115/IPACK2023-111980
View Paper titled, Line Width and Electrical Performance Prediction for Inkjet Printed Conductors-Resistors-Inductors-Capacitors
Open the PDF for Line Width and Electrical Performance Prediction for Inkjet Printed Conductors-Resistors-Inductors-Capacitors in another window
Topics: Capacitors, Inductors, Resistors, Printing, Circuits, Drops, Electronics, Inks, Particulate matter, Resolution (Optics)
Proceedings Papers

Comparative Study of SMD Components Attached Using Electrically Conductive Adhesive and Magnetically Oriented Anisotropic Conductive Adhesive on Inkjet Printed Structures

Pradeep Lall, Shriram Kulkarni, Jinesh Narangaparambil, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111979
https://doi.org/10.1115/IPACK2023-111979
View Paper titled, Comparative Study of SMD Components Attached Using Electrically Conductive Adhesive and Magnetically Oriented Anisotropic Conductive Adhesive on Inkjet Printed Structures
Open the PDF for Comparative Study of SMD Components Attached Using Electrically Conductive Adhesive and Magnetically Oriented Anisotropic Conductive Adhesive on Inkjet Printed Structures in another window
Topics: Adhesives, Anisotropy, Surface mount devices
Proceedings Papers

Mathematical Analysis of the Tensile Behavior of DP 980 Steel Using Digital Image Correlation (DIC)

Ebrahim Seidi, Scott Miller, Lu Huang, Thomas Stoughton
Proc. ASME. MSEC2023, Volume 2: Manufacturing Equipment and Automation; Manufacturing Processes; Manufacturing Systems; Nano/Micro/Meso Manufacturing; Quality and Reliability, V002T06A038, June 12–16, 2023
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2023-105621
https://doi.org/10.1115/MSEC2023-105621
View Paper titled, Mathematical Analysis of the Tensile Behavior of DP 980 Steel Using Digital Image Correlation (DIC)
Open the PDF for Mathematical Analysis of the Tensile Behavior of DP 980 Steel Using Digital Image Correlation (DIC) in another window
Topics: Mathematical analysis, Steel, Stress, Geometry, Necking, Matlab, Metal stamping, Plasticity, Resolution (Optics), Tensile testing
Journal Articles

Interaction of Surface Preparation and Cure Parameters on the Interface Reliability of Flexible Encapsulation in Flexible Hybrid Electronics Applications

Pradeep Lall, Padmanava Choudhury, Scott Miller
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011109.
Paper No: EP-22-1035
https://doi.org/10.1115/1.4056477
Published Online: January 11, 2023
View Article titled, Interaction of Surface Preparation and Cure Parameters on the Interface Reliability of Flexible Encapsulation in Flexible Hybrid Electronics Applications
Open the PDF for Interaction of Surface Preparation and Cure Parameters on the Interface Reliability of Flexible Encapsulation in Flexible Hybrid Electronics Applications in another window
Topics: Adhesives, Electronics, Reliability, Surface preparation, Temperature, Stress, Inks, Silver
Proceedings Papers

Additively Printed Flexible Charging Circuits and Effect on Evolution of Line Resistance and Charging Current in Charging Thin Flexible Batteries

Pradeep Lall, Ved Soni, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A009, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97450
https://doi.org/10.1115/IPACK2022-97450
View Paper titled, Additively Printed Flexible Charging Circuits and Effect on Evolution of Line Resistance and Charging Current in Charging Thin Flexible Batteries
Open the PDF for Additively Printed Flexible Charging Circuits and Effect on Evolution of Line Resistance and Charging Current in Charging Thin Flexible Batteries in another window
Topics: Circuits, Electronics, Printing