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Journal Articles

Mechanical Strengths and Microstructures of Recycled Aggregate Concrete Incorporating Nanoparticles

Wengui Li, Zhiyu Luo, Chu Long, Zhengyu Huang, Liang Huang, Qiang Yu, Zhihui Sun
Journal: Advances in Civil Engineering Materials
Publisher: ASTM International
Article Type: Technical Papers
Adv. Civ. Eng. Matls.. February 2018, 7(1): 188–205.
Paper No: ACEM20160078
https://doi.org/10.1520/ACEM20160078
Published Online: April 25, 2018
View Article titled, Mechanical Strengths and Microstructures of Recycled Aggregate Concrete Incorporating Nanoparticles
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Proceedings Papers

A Two-Dimensional Analytical Method for Turbine Blade Cooling Design

Chen Li, Jian-jun Liu, Bai-tao An, Zhi-qiang Yu
Proc. ASME. GT2017, Volume 2B: Turbomachinery, V02BT41A023, June 26–30, 2017
Publisher: American Society of Mechanical Engineers
Paper No: GT2017-63856
https://doi.org/10.1115/GT2017-63856
View Paper titled, A Two-Dimensional Analytical Method for Turbine Blade Cooling Design
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Topics: Cooling, Design, Turbine blades, Blades, Flow (Dynamics), Heat transfer coefficients, Turbines, Boundary-value problems, Computational fluid dynamics, Computational methods
Journal Articles

Subcritical Crack Growth in Cementitious Materials Subject to Chemomechanical Deterioration—Experimental Test Using Specimens of Negative Geometry

Weijin Wang, Teng Tong, Susheng Tan, Qiang Yu
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research-Article
J. Appl. Mech. April 2017, 84(4): 041004.
Paper No: JAM-16-1437
https://doi.org/10.1115/1.4035523
Published Online: February 22, 2017
View Article titled, Subcritical Crack Growth in Cementitious Materials Subject to Chemomechanical Deterioration—Experimental Test Using Specimens of Negative Geometry
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Topics: Cements (Adhesives), Fracture (Materials), Geometry, Stress, Stress corrosion cracking, Crack propagation, Fatigue testing, Atomic force microscopy
Proceedings Papers

Accuracy of Superposition Predictions of Film Cooling Effectiveness on a Flat Plate With Double Rows of Holes

Tong Meng, Hui-ren Zhu, Cun-liang Liu, Qiang Yu, Jian-sheng Wei
Proc. ASME. GT2016, Volume 5C: Heat Transfer, V05CT19A018, June 13–17, 2016
Publisher: American Society of Mechanical Engineers
Paper No: GT2016-56865
https://doi.org/10.1115/GT2016-56865
View Paper titled, Accuracy of Superposition Predictions of Film Cooling Effectiveness on a Flat Plate With Double Rows of Holes
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Topics: Film cooling, Flat plates, Plates (structures), Shapes, Computer simulation, Computer software, Coolants, Cooling, Cylinders, Engine design
Journal Articles

Scaling of Strength of Metal-Composite Joints—Part III: Numerical Simulation

Qiang Yu, Zdeněk P. Bažant, Jia-Liang Le
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Technical Briefs
J. Appl. Mech. September 2013, 80(5): 054503.
Paper No: JAM-12-1476
https://doi.org/10.1115/1.4023643
Published Online: July 18, 2013
View Article titled, Scaling of Strength of Metal-Composite Joints—Part III: Numerical Simulation
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Topics: Composite materials, Computer simulation, Fracture (Materials), Fracture (Process), Metallic composites, Size effect, Stress, Corners (Structural elements), Damage, Displacement
Proceedings Papers

Effect of Micro Structure on Fatigue Characteristics of Lead Free Solder Joints

Takahiro Akutsu, Qiang Yu
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 691-700, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52070
https://doi.org/10.1115/IPACK2011-52070
View Paper titled, Effect of Micro Structure on Fatigue Characteristics of Lead Free Solder Joints
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Topics: Fatigue, Lead-free solders, Fatigue cracks, Crystals, Finite element methods, Finite element model, Solder joints, Fatigue life, Grain size, Solders
Proceedings Papers

A Study on the Thermal Deformation and the Mechanical Properties due to Curing Process of the Encapsulation Resin

Hiroyuki Sato, Qiang Yu, Ryusuke Sone
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 185-190, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52101
https://doi.org/10.1115/IPACK2011-52101
View Paper titled, A Study on the Thermal Deformation and the Mechanical Properties due to Curing Process of the Encapsulation Resin
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Topics: Hardening (Curing), Mechanical properties, Resins, Thermal deformation, Aluminum, Warping, Deformation, Elastic moduli, Reliability, Semiconductors (Materials)
Proceedings Papers

Reliability Evaluation of Fatigue Life for Solder Joints in Chip Components Considering Dispersion of the Shape and the Properties

Yuji Nishimura, Qiang Yu
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 191-194, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52105
https://doi.org/10.1115/IPACK2011-52105
View Paper titled, Reliability Evaluation of Fatigue Life for Solder Joints in Chip Components Considering Dispersion of the Shape and the Properties
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Topics: Fatigue life, Reliability, Shapes, Solder joints, Fibers, Electronics, Fatigue, Fatigue cracks, Fatigue properties, Fatigue testing
Proceedings Papers

Study on High Reliability of Lead-Free Solder Joint on Metal Substrate

Kanji Takagi, Masaki Wakabayashi, Junichi Inoue, Qiang Yu, Takahiro Akutsu
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 143-148, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52044
https://doi.org/10.1115/IPACK2011-52044
View Paper titled, Study on High Reliability of Lead-Free Solder Joint on Metal Substrate
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Topics: Lead-free solders, Metals, Reliability, Rupture, Solder joints, Crack propagation, Heating, Temperature, Thermal conductivity, Design methodology
Proceedings Papers

The Effect of the Surface Roughness of Al Layer of DBA Substrate on Fatigue Life of Solder Joint in Power-Devices

Shiqiang Zhao, Qiang Yu, Hiroki Akaeda
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 195-199, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52109
https://doi.org/10.1115/IPACK2011-52109
View Paper titled, The Effect of the Surface Roughness of Al Layer of DBA Substrate on Fatigue Life of Solder Joint in Power-Devices
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Topics: Fatigue life, Solder joints, Surface roughness, Cycles, Aluminum, Reliability, Thermal stresses
Proceedings Papers

A Study on Reliability of High-Temperature Joint in Packaging Structure

Takayuki Ishikawa, Toshikazu Oshidari, Hiromi Sugihara, Qiang Yu
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 45-51, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52154
https://doi.org/10.1115/IPACK2011-52154
View Paper titled, A Study on Reliability of High-Temperature Joint in Packaging Structure
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Topics: High temperature, Packaging, Reliability, Nickel plating, Aluminum, Plating, Stress, Temperature, Cooling systems, Cycles
Proceedings Papers

Precision Evaluation for Thermal Fatigue Life of Power Module Using Coupled Electrical-Thermal-Structural Analysis

Tomohiro Takahashi, Qiang Yu, Masahiro Kobayashi
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 157-163, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52068
https://doi.org/10.1115/IPACK2011-52068
View Paper titled, Precision Evaluation for Thermal Fatigue Life of Power Module Using Coupled Electrical-Thermal-Structural Analysis
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Topics: Fatigue life, Solder joints, Wire, Bonding, Fatigue, Finite element methods, Fracture (Materials), Temperature distribution, Crack propagation, Damage
Proceedings Papers

Reliability Evaluation of Electronic Devices Under Considering the Actual Use Conditions

Shilin Liu, Qiang Yu, Michael Pecht
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 201-205, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52111
https://doi.org/10.1115/IPACK2011-52111
View Paper titled, Reliability Evaluation of Electronic Devices Under Considering the Actual Use Conditions
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Topics: Reliability, Stress, Accounting, Electronic components, Fatigue life, Semiconductors (Materials)
eBook Chapter

Bench Tests for Characterizing the Thermophysical Properties of Type X Special Fire Resistant Gypsum Board Exposed to Fire

Series: ASTM Selected Technical Papers
Publisher: ASTM International
Published: 2012
ISBN: 978-0-8031-7527-3
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Proceedings Papers

High-Accuracy Fatigue Evaluation of Power Devices by Multi-Coupled Analysis

Kazunori Shinohara, Qiang Yu, Takashi Anzawa, Hideaki Ishii
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 19-26, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89043
https://doi.org/10.1115/InterPACK2009-89043
View Paper titled, High-Accuracy Fatigue Evaluation of Power Devices by Multi-Coupled Analysis
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Topics: Fatigue, Power semiconductor devices, Electrical conductivity, Semiconductors (Materials), Vehicles, Electric vehicles, Engineering simulation, Heat, Hybrid electric vehicles, Reliability
Proceedings Papers

Reflow Process Simulation for Dispersion Evaluation of Solder Joint Shape on Chip Component

Kanji Takagi, Qiang Yu, Tadahiro Shibutani, Hiroki Miyauchi
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1-8, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89019
https://doi.org/10.1115/InterPACK2009-89019
View Paper titled, Reflow Process Simulation for Dispersion Evaluation of Solder Joint Shape on Chip Component
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Topics: Process simulation, Shapes, Solder joints, Reliability, Electronic components, Manufacturing, Simulation, Surface tension, Crack propagation, Design
Proceedings Papers

Reliability Study of High-Temperature-Resistant Mounting Structure Considering Shear Behavior of Joint Layer

Masanori Yamagiwa, Masato Fujita, Qiang Yu, Hiromi Sugihara
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 849-855, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89284
https://doi.org/10.1115/InterPACK2009-89284
View Paper titled, Reliability Study of High-Temperature-Resistant Mounting Structure Considering Shear Behavior of Joint Layer
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Topics: Reliability, Shear (Mechanics), Temperature, Finite element analysis, Cycles, Displacement, Fatigue, Gallium nitride, Stress, Circuits
Proceedings Papers

Thermal Fatigue Reliability of High-Temperature-Resistant Joint for Power Devices

Hiromi Sugihara, Masanori Yamagiwa, Masato Fujita, Toshikazu Oshidari, Qiang Yu
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 937-943, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89342
https://doi.org/10.1115/InterPACK2009-89342
View Paper titled, Thermal Fatigue Reliability of High-Temperature-Resistant Joint for Power Devices
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Topics: Fatigue, Reliability, Temperature, Finite element analysis, Nickel plating, Circuits, Cooling, Cycles, Electric vehicles, Electronics
Proceedings Papers

Deformation of Resin Material Due to Curing in the Thermal Process

Ryusuke Sone, Qiang Yu, Tadahiro Shibutani
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 953-958, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89353
https://doi.org/10.1115/InterPACK2009-89353
View Paper titled, Deformation of Resin Material Due to Curing in the Thermal Process
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Topics: Deformation, Hardening (Curing), Resins, Warping, Reliability, Strength (Materials), Stress
Journal Articles

Reliability Evaluation on Deterioration of Power Device Using Coupled Electrical-Thermal-Mechanical Analysis

Takashi Anzawa, Qiang Yu, Masanori Yamagiwa, Tadahiro Shibutani, Masaki Shiratori
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031012.
https://doi.org/10.1115/1.4002451
Published Online: September 30, 2010
View Article titled, Reliability Evaluation on Deterioration of Power Device Using Coupled Electrical-Thermal-Mechanical Analysis
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Topics: Bonding, Crack propagation, Fatigue life, Fracture (Materials), Reliability, Solder joints, Temperature, Temperature distribution, Wire, Wire bonding