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Pedro Quintero
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Journal Articles

Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick Direct Bond Copper Substrates for Power Electronics

Margie Guerrero-Fernandez, Pedro Quintero, Ozan Cagatay Ozdemir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041107.
Paper No: EP-24-1022
https://doi.org/10.1115/1.4065943
Published Online: July 26, 2024
View Article titled, Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick Direct Bond Copper Substrates for Power Electronics
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Topics: Coating processes, Coatings, Copper, Plasma spraying, Spraying (Coating processes), Sprays, Surface roughness, Ceramics, Electronics, Experimental design
Journal Articles

Transient Performance Analysis of Centrifugal Left Ventricular Assist Devices Coupled With Windkessel Model: Large Eddy Simulations Study on Continuous and Pulsatile Flow Operation

Antonio Gil, Roberto Navarro, Pedro Quintero, Andrea Mares
Journal: Journal of Biomechanical Engineering
Publisher: ASME
Article Type: Research-Article
J Biomech Eng. October 2024, 146(10): 101008.
Paper No: BIO-24-1023
https://doi.org/10.1115/1.4065418
Published Online: May 13, 2024
View Article titled, Transient Performance Analysis of Centrifugal Left Ventricular Assist Devices Coupled With Windkessel Model: Large Eddy Simulations Study on Continuous and Pulsatile Flow Operation
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Topics: Flow (Dynamics), Large eddy simulation, Pressure, Pulsatile flow, Simulation, Transients (Dynamics), Ventricular assist devices, Fluids, Turbulence, Pumps
Proceedings Papers

Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick DBC Substrates for Power Electronics

Margie Guerrero, Pedro Quintero, Ozan Cagatay Ozdemir
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A004, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111534
https://doi.org/10.1115/IPACK2023-111534
View Paper titled, Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick DBC Substrates for Power Electronics
Open the PDF for Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick DBC Substrates for Power Electronics in another window
Topics: Ceramics, Copper, Electronics, Plasma spraying, Spraying (Coating processes), Coatings, Sprays, Surface roughness, Electronic packaging, Additive manufacturing
Proceedings Papers

Influence of Turbulence Modeling on the Simulation of Miniaturized Levitating Centrifugal Pumps for Cardiac Assistance

Antonio Gil, Jorge García-Tíscar, Pedro Quintero, Andrea Mares
Proc. ASME. GT2023, Volume 9: Microturbines, Turbochargers, and Small Turbomachines; Oil and Gas Applications, V009T18A003, June 26–30, 2023
Publisher: American Society of Mechanical Engineers
Paper No: GT2023-101412
https://doi.org/10.1115/GT2023-101412
View Paper titled, Influence of Turbulence Modeling on the Simulation of Miniaturized Levitating Centrifugal Pumps for Cardiac Assistance
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Topics: Centrifugal pumps, Modeling, Simulation, Turbulence
Proceedings Papers

Numerical and Experimental Evaluation of Noise and Performance in UAV Propellers

José R. Serrano, Jorge García-Tíscar, Pedro Quintero, Federico N. Ramírez
Proc. ASME. GT2023, Volume 1: Aircraft Engine, V001T01A023, June 26–30, 2023
Publisher: American Society of Mechanical Engineers
Paper No: GT2023-102389
https://doi.org/10.1115/GT2023-102389
View Paper titled, Numerical and Experimental Evaluation of Noise and Performance in UAV Propellers
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Topics: Acoustics, Noise (Sound), Propellers, Unmanned aerial vehicles
Proceedings Papers

Cold Gas Spray of Copper on Aluminum Nitride as Substrate for Power Electronics

Margie Guerrero, Pedro Quintero, Ozan Ozdemir, Tricia Schwartz
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-69270
https://doi.org/10.1115/IPACK2021-69270
View Paper titled, Cold Gas Spray of Copper on Aluminum Nitride as Substrate for Power Electronics
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Topics: Aluminum, Copper, Electronics, Sprays, Ceramics, Manufacturing, Additive manufacturing, Bonding, Deformation, Electrical properties
Proceedings Papers

Study of the Thermomechanical Inelastic Energy Response of Backward Compatible Solder Joints Made With Sn-3.8Ag-0.7Cu versus Reballed Sn37.0Pb Components

Lorraine M. Renta, Ricky Valentin, Pedro Quintero, David Ma, Alan Hovland
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 123-129, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52036
https://doi.org/10.1115/IPACK2011-52036
View Paper titled, Study of the Thermomechanical Inelastic Energy Response of Backward Compatible Solder Joints Made With Sn-3.8Ag-0.7Cu versus Reballed Sn37.0Pb Components
Open the PDF for Study of the Thermomechanical Inelastic Energy Response of Backward Compatible Solder Joints Made With Sn-3.8Ag-0.7Cu versus Reballed Sn37.0Pb Components in another window
Topics: Solder joints, Thermomechanics, Tin, Ball-Grid-Array packaging, Lead-free solders, Solders, Cycles, Alloys, Copper, Density