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1-20 of 37
Nenad Miljkovic
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Journal Articles
Siavash Khodakarami, Vaibhav Agarwal, Pouya Kabirzadeh, Alexandra Solecki, Muhammad Jahidul Hoque, Wentao Yang, Nicole Stokowski, Joshua Jacobs, Arindam Chatterji, Edward Lovelace, Andrew Stillwell, Nenad Miljkovic
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. January 2025, 147(1): 012401.
Paper No: HT-24-1025
Published Online: September 30, 2024
Includes: Supplementary data
Journal Articles
Mostafa Olyaei, Sagar Singh, Kaiying Jiang, Yashraj Gurumukhi, Kenneth Goodson, Mehdi Asheghi, Nenad Miljkovic
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041110.
Paper No: EP-24-1024
Published Online: August 9, 2024
Proceedings Papers
Zheng Liu, Jiaxin Wu, Wuchen Fu, Pouya Kabirzadeh, In-Bum Chung, Mohammed Jubair Dipto, Nenad Miljkovic, Pingfeng Wang, Yumeng Li
Proc. ASME. IMECE2023, Volume 2: Advanced Design and Information Technologies, V002T02A016, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-112873
Proceedings Papers
Sagar Singh, Mostafa Olyaei, Katherine Jiang, Yashraj Gurumukhi, Kenneth Goodson, Mehdi Asheghi, Nenad Miljkovic
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A007, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111825
Proceedings Papers
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A005, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97412
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011105.
Paper No: EP-22-1022
Published Online: November 11, 2022
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011101.
Paper No: EP-22-1023
Published Online: September 27, 2022
Journal Articles
Publisher: ASME
Article Type: Review Articles
J. Heat Mass Transfer. May 2022, 144(5): 050801.
Paper No: HT-21-1600
Published Online: March 1, 2022
Proceedings Papers
Proc. ASME. IMECE2021, Volume 11: Heat Transfer and Thermal Engineering, V011T11A029, November 1–5, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2021-70949
Proceedings Papers
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A006, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73313
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041105.
Paper No: EP-21-1112
Published Online: October 6, 2021
Journal Articles
Muhammad Jahidul Hoque, Alperen Günay, Andrew Stillwell, Yashraj Gurumukhi, Robert C. N. Pilawa-Podgurski, Nenad Miljkovic
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 020903.
Paper No: EP-20-1081
Published Online: February 22, 2021
Journal Articles
Zhuoyuan Zheng, Bo Chen, Yanwen Xu, Nathan Fritz, Yashraj Gurumukhi, John Cook, Mehmet N. Ates, Nenad Miljkovic, Paul V. Braun, Pingfeng Wang
Publisher: ASME
Article Type: Research Papers
J. Electrochem. En. Conv. Stor. February 2021, 18(1): 011011.
Paper No: JEECS-19-1155
Published Online: May 11, 2020
Journal Articles
Publisher: ASME
Article Type: Guest Editorial
J. Heat Mass Transfer. March 2020, 142(3): 030301.
Paper No: HT-20-1047
Published Online: February 5, 2020
Topics:
Heat transfer
Journal Articles
Publisher: ASME
Article Type: Photo Gallery
J. Heat Mass Transfer. March 2020, 142(3): 030901.
Paper No: HT-20-1034
Published Online: February 5, 2020
Journal Articles
Publisher: ASME
Article Type: Photo Gallery
J. Heat Mass Transfer. March 2020, 142(3): 030904.
Paper No: HT-20-1041
Published Online: February 5, 2020
Proceedings Papers
Gowtham Kuntumalla, Yuquan Meng, Manjunath Rajagopal, Ricardo Toro, Hanyang Zhao, Ho Chan Chang, Sreenath Sundar, Srinivasa Salapaka, Nenad Miljkovic, Chenhui Shao, Placid Ferreira, Sanjiv Sinha
Proc. ASME. IMECE2019, Volume 2B: Advanced Manufacturing, V02BT02A018, November 11–14, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2019-10621
Proceedings Papers
Yuquan Meng, Dingyu Peng, Qasim Nazir, Gowtham Kuntumalla, Manjunath C. Rajagopal, Ho Chan Chang, Hanyang Zhao, Sreenath Sundar, Placid M. Ferreira, Sanjiv Sinha, Nenad Miljkovic, Srinivasa M. Salapaka, Chenhui Shao
Proc. ASME. MSEC2019, Volume 2: Processes; Materials, V002T03A083, June 10–14, 2019
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2019-2938
Journal Articles
Publisher: ASME
Article Type: Guest Editorial
J. Heat Mass Transfer. October 2019, 141(10): 100301.
Paper No: HT-19-1486
Published Online: September 13, 2019
Topics:
Heat transfer
Journal Articles
Publisher: ASME
Article Type: Photo Gallery
J. Heat Mass Transfer. October 2019, 141(10): 100902.
Paper No: HT-19-1481
Published Online: September 13, 2019
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