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Nazli Donmezer
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Journal Articles

Thermal Spreading Resistance of Surface Adjacent Localized Heating-Induced Size Effects in Semiconductors

Amir Abdolhosseinzadeh, Nazli Donmezer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041108.
Paper No: EP-24-1026
https://doi.org/10.1115/1.4065945
Published Online: July 26, 2024
View Article titled, Thermal Spreading Resistance of Surface Adjacent Localized Heating-Induced Size Effects in Semiconductors
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Topics: Heat, Heating, Phonons, Temperature
Proceedings Papers

Prediction of the Localized Heating-Induced Size Effects in Semiconductors Based on the Heat Generation Characteristics and the Material Thermophysical Properties

Amir Abdolhosseinzadeh, Emine Goktepe, Nazli Donmezer
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A003, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111501
https://doi.org/10.1115/IPACK2023-111501
View Paper titled, Prediction of the Localized Heating-Induced Size Effects in Semiconductors Based on the Heat Generation Characteristics and the Material Thermophysical Properties
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Topics: Heat, Heating, Phonons, Semiconductors (Materials)
Proceedings Papers

Performance Analysis of Micro-Raman Spectroscopy Models for Thermal Conductivity Calculation

Taher Meydando, Nazli Donmezer
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73648
https://doi.org/10.1115/IPACK2021-73648
View Paper titled, Performance Analysis of Micro-Raman Spectroscopy Models for Thermal Conductivity Calculation
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Topics: Phonons, Spectroscopy, Thermal conductivity, Thin films
Journal Articles

Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging

Ronald J. Warzoha, Adam A. Wilson, Brian F. Donovan, Nazli Donmezer, Ashutosh Giri, Patrick E. Hopkins, Sukwon Choi, Darshan Pahinkar, Jingjing Shi, Samuel Graham, Zhiting Tian, Laura Ruppalt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2021, 143(2): 020804.
Paper No: EP-20-1070
https://doi.org/10.1115/1.4049293
Published Online: February 22, 2021
View Article titled, Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging
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Topics: Electronics, Gallium nitride, Heat, Nanoscale phenomena, Phonons, Temperature, Thermal conductivity, Electromagnetic scattering, Energy gap, Diamonds
Proceedings Papers

Electrothermal Analysis of the Field-Plated AlGaN/GaN HEMTs With SiO 2 Passivation

Dogacan Kara, F. Nazli Donmezer Akgun
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A011, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74125
https://doi.org/10.1115/IPACK2017-74125
View Paper titled, Electrothermal Analysis of the Field-Plated AlGaN/GaN HEMTs With SiO 2 Passivation
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Topics: Gallium nitride, Plates (structures), Collapse, Electrons, Heating, Reliability, Electric fields, Electron mobility, Engineering simulation, Joules
Proceedings Papers

A Roadmap for Building Thermal Models for AlGaN/GaN HEMTs: Simplifications and Beyond

Mohammad Azarifar, Nazli Donmezer
Proc. ASME. HT2016, Volume 2: Heat Transfer in Multiphase Systems; Gas Turbine Heat Transfer; Manufacturing and Materials Processing; Heat Transfer in Electronic Equipment; Heat and Mass Transfer in Biotechnology; Heat Transfer Under Extreme Conditions; Computational Heat Transfer; Heat Transfer Visualization Gallery; General Papers on Heat Transfer; Multiphase Flow and Heat Transfer; Transport Phenomena in Manufacturing and Materials Processing, V002T11A006, July 10–14, 2016
Publisher: American Society of Mechanical Engineers
Paper No: HT2016-7383
https://doi.org/10.1115/HT2016-7383
View Paper titled, A Roadmap for Building Thermal Models for AlGaN/GaN HEMTs: Simplifications and Beyond
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Topics: Gallium nitride, Heat, Heat transfer, Engineering simulation, Simulation, Boundary-value problems, Design, Electron mobility, Heating, High temperature
Proceedings Papers

Effects of Field Plate on the Maximum Temperature and Temperature Distribution for GaN HEMT Devices

Dogacan Kara, Nazli Donmezer, Talha Furkan Canan, Ozlem Sen, Ekmel Ozbay
Proc. ASME. HT2016, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamentals in Heat Transfer; Nanoscale Thermal Transport; Heat Transfer in Equipment; Heat Transfer in Fire and Combustion; Transport Processes in Fuel Cells and Heat Pipes; Boiling and Condensation in Macro, Micro and Nanosystems, V001T04A003, July 10–14, 2016
Publisher: American Society of Mechanical Engineers
Paper No: HT2016-7367
https://doi.org/10.1115/HT2016-7367
View Paper titled, Effects of Field Plate on the Maximum Temperature and Temperature Distribution for GaN HEMT Devices
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Topics: Gallium nitride, Temperature, Temperature distribution, Electric fields, Electron mobility, Heating, Plates (structures), Transistors, Engineering simulation, Finite element analysis
Proceedings Papers

Modeling the Hotspot Temperature in AlGaN/GaN High Electron Mobility Transistors Using a Non-Gray Phonon BTE Solver

Fatma Nazli Donmezer, Munmun Islam, Samuel Graham, Douglas Yoder
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 1175-1188, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-89720
https://doi.org/10.1115/IMECE2012-89720
View Paper titled, Modeling the Hotspot Temperature in AlGaN/GaN High Electron Mobility Transistors Using a Non-Gray Phonon BTE Solver
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Topics: Electron mobility, Gallium nitride, Modeling, Phonons, Temperature, Transistors, Electrons, Electromagnetic spectrum, Gates (Closures), Electric fields
Proceedings Papers

Lattice Boltzmann and Discrete Ordinates Methods for Phonon Transport Modeling: A Comparative Study

Fatma Nazli Donmezer, Dhruv Singh, William James, Adam Christensen, Samuel Graham, Jayathi Y. Murthy
Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 333-343, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-64008
https://doi.org/10.1115/IMECE2011-64008
View Paper titled, Lattice Boltzmann and Discrete Ordinates Methods for Phonon Transport Modeling: A Comparative Study
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Topics: Lattice Boltzmann methods, Modeling, Phonons, Errors, Resolution (Optics), Acoustics, Engineering simulation, Heat, Nanoscale phenomena, Polarization (Electricity)