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Michael Osterman
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Journal Articles

Temperature-Humidity-Bias Testing and Life Prediction Modeling for Electrochemical Migration in Aerosol-Jet Printed Circuits

Beihan Zhao, Aniket Bharamgonda, Edwin Quinn, George Stackhouse, Jason Fleischer, Michael Osterman, Michael H. Azarian, Daniel R. Hines, Siddhartha Das, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041105.
Paper No: EP-23-1012
https://doi.org/10.1115/1.4063541
Published Online: November 1, 2023
View Article titled, Temperature-Humidity-Bias Testing and Life Prediction Modeling for Electrochemical Migration in Aerosol-Jet Printed Circuits
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Topics: Aerosols, Failure, Failure mechanisms, Modeling, Reliability, Silver, Temperature, Testing, Circuits, Printing
Proceedings Papers

Electro-Chemical Migration in Aerosol-Jet Printed Electronics Using Temperature-Humidity and Water Droplet Testing Methods

Beihan Zhao, Aniket Ajitkumar Bharamgonda, Eric Jennings, Robert G. Utter, Michael Osterman, Michael H. Azarian, Siddhartha Das, Abhijit Dasgupta, Jason Fleischer, Edwin Quinn, Daniel Hines
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A001, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-92306
https://doi.org/10.1115/IPACK2022-92306
View Paper titled, Electro-Chemical Migration in Aerosol-Jet Printed Electronics Using Temperature-Humidity and Water Droplet Testing Methods
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Topics: Aerosols, Drops, Electronics, Silver, Temperature, Testing, Water
Proceedings Papers

Effect of Corner Staking on the Fatigue Life of BGA Under Thermal Cycling

Deng Yun Chen, Michael Osterman
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A018, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74249
https://doi.org/10.1115/IPACK2017-74249
View Paper titled, Effect of Corner Staking on the Fatigue Life of BGA Under Thermal Cycling
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Topics: Ball-Grid-Array packaging, Corners (Structural elements), Fatigue life, Solder joints, Solders, Adhesives, Failure, Materials properties, Stress, Temperature
Proceedings Papers

Effect of Isothermal Aging on Microstructure and Creep Properties of SAC305 Solder: A Micromechanics Approach

Preeti Chauhan, Subhasis Mukherjee, Michael Osterman, Abhijit Dasgupta, Michael Pecht
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A009, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73164
https://doi.org/10.1115/IPACK2013-73164
View Paper titled, Effect of Isothermal Aging on Microstructure and Creep Properties of SAC305 Solder: A Micromechanics Approach
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Topics: Creep, Micromechanics (Engineering), Solders, Tin, Nanoscale phenomena, Solder joints, Alloys, Image processing, Intermetallic compounds, Particulate matter
Proceedings Papers

Examination of Solder Interconnects Formed on ENEPIG Finished Printed Wiring Boards Under Drop Loading Conditions

Adam Pearl, Michael Osterman
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A018, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73278
https://doi.org/10.1115/IPACK2013-73278
View Paper titled, Examination of Solder Interconnects Formed on ENEPIG Finished Printed Wiring Boards Under Drop Loading Conditions
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Topics: Printed circuit boards, Solders, Finishes, Failure mechanisms, Lumber, Reliability, Cracking (Materials), Fracture (Process), Resistors, Shock (Mechanics)
Journal Articles

Accelerated Temperature and Voltage Stress Tests of Embedded Planar Capacitors With Epoxy–BaTiO 3 Composite Dielectric

Mohammed A. Alam, Michael H. Azarian, Michael Osterman, Michael Pecht
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021009.
https://doi.org/10.1115/1.4006704
Published Online: June 11, 2012
View Article titled, Accelerated Temperature and Voltage Stress Tests of Embedded Planar Capacitors With Epoxy–BaTiO 3 Composite Dielectric
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Topics: Capacitance, Capacitors, Failure, Stress, Temperature, Composite materials, Epoxy resins, Failure mechanisms
Proceedings Papers

Prognostics of Embedded Planar Capacitors Under Temperature and Voltage Aging

Mohammed A. Alam, Michael H. Azarian, Michael Osterman, Michael Pecht
Proc. ASME. SMASIS2010, ASME 2010 Conference on Smart Materials, Adaptive Structures and Intelligent Systems, Volume 2, 783-792, September 28–October 1, 2010
Publisher: American Society of Mechanical Engineers
Paper No: SMASIS2010-3864
https://doi.org/10.1115/SMASIS2010-3864
View Paper titled, Prognostics of Embedded Planar Capacitors Under Temperature and Voltage Aging
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Topics: Capacitors, Temperature, Failure, Failure mechanisms, Insulation, Capacitance, Laminates, Printed circuit boards, Composite materials, Energy dissipation
Journal Articles

Solder Joint Reliability of SnBi Finished TSOPs with Alloy 42 Lead-Frame under Temperature Cycling

Weiqiang Wang, Michael Osterman, Diganta Das, Michael Pecht
Journal: Journal of ASTM International
Publisher: ASTM International
Article Type: Research-Article
J. ASTM Int.. September 2010, 7(8): 1–11.
https://doi.org/10.1520/JAI102939
Published Online: September 1, 2010
View Article titled, Solder Joint Reliability of SnBi Finished TSOPs with Alloy 42 Lead-Frame under Temperature Cycling
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Proceedings Papers

Characterization of Lead-Free Solder Interconnects Reliability Under Torsional Loads

Vikram Srinivas, Moustafa Al-Bassyiouni, Michael Osterman, Michael Pecht
Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 211-216, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-11376
https://doi.org/10.1115/IMECE2009-11376
View Paper titled, Characterization of Lead-Free Solder Interconnects Reliability Under Torsional Loads
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Topics: Lead-free solders, Reliability, Resistors, Stress, Torsion
Proceedings Papers

Physics of Failure Based Virtual Testing of Communications Hardware

Elviz George, Diganta Das, Michael Osterman, Michael Pecht, Christopher Otte
Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 191-197, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-12181
https://doi.org/10.1115/IMECE2009-12181
View Paper titled, Physics of Failure Based Virtual Testing of Communications Hardware
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Topics: Failure, Hardware, Physics, Testing, Design, Simulation, Computer software, Cycles, Reliability, Vibration
Proceedings Papers

Impact of Thermal Aging on the Growth of Cu-Sn Intermetallic Compounds in Pb-Free Solder Joints in 2512 Resistors

Preeti Chauhan, Michael Osterman, Michael Pecht
Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 199-210, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-10169
https://doi.org/10.1115/IMECE2009-10169
View Paper titled, Impact of Thermal Aging on the Growth of Cu-Sn Intermetallic Compounds in Pb-Free Solder Joints in 2512 Resistors
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Topics: Intermetallic compounds, Lead-free solders, Resistors, Tin, Solders, Temperature, Copper, High temperature, Manufacturing, Reliability
Proceedings Papers

Thermal Performance Measurements of Thermal Interface Materials Using the Laser Flash Method

Vinh Khuu, Michael Osterman, Avram Bar-Cohen, Michael Pecht
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 405-414, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33554
https://doi.org/10.1115/IPACK2007-33554
View Paper titled, Thermal Performance Measurements of Thermal Interface Materials Using the Laser Flash Method
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Topics: Lasers, Heat, Composite materials, Thermal resistance, Acoustics, Adhesives, Algorithms, Cracking (Materials), Delamination, Electronic packages
Journal Articles

Prognostics Assessment of Aluminum Support Structure on a Printed Circuit Board

Sony Mathew, Diganta Das, Michael Osterman, Michael Pecht, Robin Ferebee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 339–345.
https://doi.org/10.1115/1.2351897
Published Online: January 8, 2006
View Article titled, Prognostics Assessment of Aluminum Support Structure on a Printed Circuit Board
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Topics: Aluminum, Damage, Life testing, Shock (Mechanics), Stress, Vibration, Testing, Printed circuit boards, Cycles, Failure