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Proceedings Papers

Direct Measurement of the Adhesive Fracture Resistance of CVD Diamond Particles

Shoji Kamiya, Hironori Takahashi, Masumi Saka, Hiroyuki Abé
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 169-174, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0513
https://doi.org/10.1115/IMECE1997-0513
View Paper titled, Direct Measurement of the Adhesive Fracture Resistance of CVD Diamond Particles
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Topics: Adhesives, Fracture (Materials), Fracture (Process), Particulate matter, Synthetic diamonds, Chemical vapor deposition, Diamond films, Nucleation (Physics), Stress, Electronics
Proceedings Papers

A New Approach to Calculate Atomic Flux Divergence by Electromigration

Kazuhiko Sasagawa, Naoaki Nakamura, Masumi Saka, Hiroyuki Abé
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 145-152, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0510
https://doi.org/10.1115/IMECE1997-0510
View Paper titled, A New Approach to Calculate Atomic Flux Divergence by Electromigration
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Topics: Electrodiffusion, Current density, Temperature, Corners (Structural elements), Metals, Modeling
Proceedings Papers

Analysis of Electromigration Considering Thomson Effect

Kazuhiko Sasagawa, Manabu Yagi, Masumi Saka, Hiroyuki Abé
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 87-92, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0433
https://doi.org/10.1115/IMECE1998-0433
View Paper titled, Analysis of Electromigration Considering Thomson Effect
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Topics: Electrodiffusion, Thermoelectricity, Temperature distribution, Metals, Corners (Structural elements), Current density, Damage, Temperature
Proceedings Papers

Study of Nucleation of Diamond on Silicon Substrate by Ab-Initio Molecular Dynamics

Tomoo Kayaba, Akinori Inoue, Masumi Saka, Hiroyuki Abé
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 83-85, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0432
https://doi.org/10.1115/IMECE1998-0432
View Paper titled, Study of Nucleation of Diamond on Silicon Substrate by Ab-Initio Molecular Dynamics
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Topics: Diamonds, Molecular dynamics, Nucleation (Physics), Silicon, Atoms, Carbon, Chemical vapor deposition, Diamond films, Simulation, Aluminum
Journal Articles

Prediction of Electromigration Critical Current Density in Passivated Arbitrary-Configuration Interconnect

Yasuhiro Kimura, Masumi Saka
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2019, 141(2): 021008.
Paper No: EP-18-1073
https://doi.org/10.1115/1.4042980
Published Online: April 10, 2019
View Article titled, Prediction of Electromigration Critical Current Density in Passivated Arbitrary-Configuration Interconnect
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Topics: Current density, Electrodiffusion, Finite element analysis, Flow (Dynamics), Electric potential, Anodes, Damage, Density, Solders, Atoms
Journal Articles

Joule Heat Welding of Thin Platinum and Tungsten Wires and the Thermoelectric Effects Around Bi-Metal Junctions

Hironori Tohmyoh, Tomochika Tanaka, Masato Fujimori, Masumi Saka
Journal: Journal of Micro and Nano-Manufacturing
Publisher: ASME
Article Type: Technical Briefs
J. Micro Nano-Manuf. June 2013, 1(2): 024501.
Paper No: JMNM-12-1009
https://doi.org/10.1115/1.4024082
Published Online: April 17, 2013
View Article titled, Joule Heat Welding of Thin Platinum and Tungsten Wires and the Thermoelectric Effects Around Bi-Metal Junctions
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Topics: Heat, Joules, Junctions, Metals, Temperature, Thermoelectricity, Welding, Wire, Circuits, Platinum
Proceedings Papers

Joule Heat Welding of Thin Metallic Wires and Thermoelectric Effects Around Dissimilar Metal Weld

Hironori Tohmyoh, Tomochika Tanaka, Masato Fujimori, Masumi Saka
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 709-712, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52071
https://doi.org/10.1115/IPACK2011-52071
View Paper titled, Joule Heat Welding of Thin Metallic Wires and Thermoelectric Effects Around Dissimilar Metal Weld
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Topics: Heat, Joules, Metals, Thermoelectricity, Welding, Wire, Temperature, Circuits, Electrodes
Proceedings Papers

Effect of Chip Size and Thermal Amplitude on Fatigue Life of Pb-Free Solder Bump

Shoho Ishikawa, Hironori Tohmyoh, Masumi Saka, Satoshi Watanabe, Motohisa Kuroha, Yoshikatsu Nakano
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 207-211, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52112
https://doi.org/10.1115/IPACK2011-52112
View Paper titled, Effect of Chip Size and Thermal Amplitude on Fatigue Life of Pb-Free Solder Bump
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Topics: Fatigue life, Lead-free solders, Electronic components, Electronic packages, Electronic products, Fatigue, Fatigue damage, Fatigue failure, Finite element analysis, Reliability
Proceedings Papers

Evaluating the Dominant Factor for Electromigration in High Purities Al Film Deposited by Sputtering

Xu Zhao, Masumi Saka, Mitsuo Yamashita, Fumiaki Togoh
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 397-400, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89282
https://doi.org/10.1115/InterPACK2009-89282
View Paper titled, Evaluating the Dominant Factor for Electromigration in High Purities Al Film Deposited by Sputtering
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Topics: Electrodiffusion, Sputtering (Irradiation), Diffusion (Physics), Grain size, Temperature, Ceramics, Current density, Electron field emission, Focused ion beams, Materials properties
Proceedings Papers

High Performance Flip Chip Package With Higher Mountability and Longer Interconnect Life

Satoru Katsurayama, Hironori Tohmyoh, Masumi Saka
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 749-753, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89148
https://doi.org/10.1115/InterPACK2009-89148
View Paper titled, High Performance Flip Chip Package With Higher Mountability and Longer Interconnect Life
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Topics: Flip-chip packages, Warping, Reliability, Cycles, Manufacturing, Stress
Proceedings Papers

Manipulation of Thin Metallic Wires by Joule Heat Joining

Hironori Tohmyoh, Hironao Takeda, M. A. Salam Akanda, Masumi Saka
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 563-567, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89122
https://doi.org/10.1115/InterPACK2009-89122
View Paper titled, Manipulation of Thin Metallic Wires by Joule Heat Joining
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Topics: Heat, Joining, Joules, Wire, Electrical properties, Electrodes, Electromagnetic actuators, Heating, Microelectromechanical systems, Nanoelectromechanical systems
Proceedings Papers

Reliability Analysis of Solderless Press-Fit Interconnections

Hironori Tohmyoh, Kiichiro Yamanobe, Masumi Saka, Jiro Utsunomiya, Takeshi Nakamura, Yoshikatsu Nakano
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 611-615, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33264
https://doi.org/10.1115/IPACK2007-33264
View Paper titled, Reliability Analysis of Solderless Press-Fit Interconnections
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Topics: Event history analysis, Press fits, Manufacturing, Stress, Friction, Printed circuit boards, Damage, Displacement, Failure, Finite element analysis
Proceedings Papers

Reliability of Flip Chip Package Depending on Underfill Encapsulating Processes

Satoru Katsurayama, Masumi Saka
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 9-12, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33562
https://doi.org/10.1115/IPACK2007-33562
View Paper titled, Reliability of Flip Chip Package Depending on Underfill Encapsulating Processes
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Topics: Flip-chip packages, Reliability, Warping, Stress, Deformation, Flip-chip, Flip-chip devices, Flow (Dynamics), Manufacturing
Proceedings Papers

Fabrication of Al Micro-Coil and Loop by Utilizing Electromigration

Yuxin Sun, Masumi Saka
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 589-592, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70073
https://doi.org/10.1115/MicroNano2008-70073
View Paper titled, Fabrication of Al Micro-Coil and Loop by Utilizing Electromigration
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Topics: Electrodiffusion, Manufacturing, Fibers, Aluminum, Anodes, Atoms, Crystallization, Current density, Temperature
Proceedings Papers

Acoustic Microscopy for Micro Electrical Interconnections

Hironori Tohmyoh, Tsuyoshi Akaogi, Masumi Saka
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1689-1693, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73061
https://doi.org/10.1115/IPACK2005-73061
View Paper titled, Acoustic Microscopy for Micro Electrical Interconnections
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Topics: Acoustics, Microscopy, Design, Printed circuit boards, Silicon chips
Proceedings Papers

Effect of Line-Shape on Threshold Current Density of Electromigration Damage in Bamboo Lines

Kazuhiko Sasagawa, Shigeo Uno, Nao Yamaji, Masumi Saka
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1147-1152, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73133
https://doi.org/10.1115/IPACK2005-73133
View Paper titled, Effect of Line-Shape on Threshold Current Density of Electromigration Damage in Bamboo Lines
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Topics: Current density, Damage, Electrodiffusion, Shapes, Metals, Computer simulation, Density, Evaluation methods, Reliability
Proceedings Papers

Development of a New Microscopic Four-Point AFM Probe for the Measurement of Local Electrical Conductivity

Bing-Feng Ju, Yang Ju, Masumi Saka
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1955-1958, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73433
https://doi.org/10.1115/IPACK2005-73433
View Paper titled, Development of a New Microscopic Four-Point AFM Probe for the Measurement of Local Electrical Conductivity
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Topics: Atomic force microscopy, Electrical conductivity, Probes, Aluminum, Electrical potential drop techniques, Electrodes, Microscale devices, Photolithography, Position control, Resolution (Optics)
Proceedings Papers

Microwave Imaging of Conductivity Distribution of Silicon Wafers

Yang Ju, Masumi Saka, Hiroyuki Abe´
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 61-64, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35117
https://doi.org/10.1115/IPACK2003-35117
View Paper titled, Microwave Imaging of Conductivity Distribution of Silicon Wafers
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Topics: Electrical conductivity, Imaging, Microwaves, Semiconductor wafers, Thermal conductivity, Reflectance, Sensors, Signals, Resolution (Optics)
Proceedings Papers

Nondestructive Inspection of Chip Size Package by Millimeter Waves

Yang Ju, Hiroshi Yamamoto, Masumi Saka
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 765-768, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35118
https://doi.org/10.1115/IPACK2003-35118
View Paper titled, Nondestructive Inspection of Chip Size Package by Millimeter Waves
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Topics: Millimeter waves, Nondestructive evaluation, Delamination, Reflectance, Resolution (Optics), Sensors, Silicon chips, Solders
Proceedings Papers

Expression of a Governing Parameter for Electromigration Damage on Metal Line Ends

Masataka Hasegawa, Kazuhiko Sasagawa, Masumi Saka, Hiroyuki Abe´
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 717-722, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35064
https://doi.org/10.1115/IPACK2003-35064
View Paper titled, Expression of a Governing Parameter for Electromigration Damage on Metal Line Ends
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Topics: Damage, Electrodiffusion, Metals, Boundary-value problems, Current density, Failure, Computer simulation, Diffusion (Physics), Electric current, Grain boundaries