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Mark G. Allen
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Proceedings Papers

Measurement of Mechanical Properties of Electroplated Nickel-Iron Alloys

Charles C. Chung, Mark G. Allen
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 453-457, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1389
https://doi.org/10.1115/IMECE1996-1389
View Paper titled, Measurement of Mechanical Properties of Electroplated Nickel-Iron Alloys
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Topics: Alloys, Iron, Mechanical properties, Nickel, Shear modulus, Microfabrication, Young's modulus
Proceedings Papers

An 8x8 Robust Capacitive Pressure Sensor Array

Sung-Pil Chang, Jeong-Bong Lee, Mark G. Allen
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 513-517, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1293
https://doi.org/10.1115/IMECE1998-1293
View Paper titled, An 8x8 Robust Capacitive Pressure Sensor Array
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Topics: Pressure sensors, Micromachining, Sensors, Manufacturing, Stainless steel, Capacitance, Design, Electrodes, Flow (Dynamics), Lamination
Proceedings Papers

A Magnetically Actuated, Electrostatically Clamped High Current MEMS Switch

Yoonsu Choi, Kieun Kim, Mark G. Allen
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 83-87, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/MEMS-23812
https://doi.org/10.1115/IMECE2001/MEMS-23812
View Paper titled, A Magnetically Actuated, Electrostatically Clamped High Current MEMS Switch
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Topics: Microelectromechanical systems, Switches, Magnetic fields, Currents, Electrodes, Transients (Dynamics)
Proceedings Papers

Pt Heater/Sensor Microarray for Distributed Fluidic Cooling Assessment

Yong-Kyu Yoon, Mark G. Allen
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 669-675, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/MEMS-23894
https://doi.org/10.1115/IMECE2001/MEMS-23894
View Paper titled, Pt Heater/Sensor Microarray for Distributed Fluidic Cooling Assessment
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Topics: Cooling, Microelectromechanical systems, Sensors, Temperature, Heating, Lasers, Platinum, Cavities, Design, Heat
Proceedings Papers

Micromachined Flexible Interconnect for Wafer Level Packaging

Yeun-Ho Joung, Mark G. Allen
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 745-749, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/MEMS-23905
https://doi.org/10.1115/IMECE2001/MEMS-23905
View Paper titled, Micromachined Flexible Interconnect for Wafer Level Packaging
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Topics: Microelectromechanical systems, Micromachining, Packaging, Semiconductor wafers, Stress, Bonding, Complementary metal oxide semiconductors, Deflection, Density, Finite element analysis
Journal Articles

Wireless Implantable Sensor for Noninvasive, Longitudinal Quantification of Axial Strain Across Rodent Long Bone Defects

Brett S. Klosterhoff, Keat Ghee Ong, Laxminarayanan Krishnan, Kevin M. Hetzendorfer, Young-Hui Chang, Mark G. Allen, Robert E. Guldberg, Nick J. Willett
Journal: Journal of Biomechanical Engineering
Publisher: ASME
Article Type: Research-Article
J Biomech Eng. November 2017, 139(11): 111004.
Paper No: BIO-17-1208
https://doi.org/10.1115/1.4037937
Published Online: October 3, 2017
View Article titled, Wireless Implantable Sensor for Noninvasive, Longitudinal Quantification of Axial Strain Across Rodent Long Bone Defects
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Topics: Bone, Physiology, Sensors, Strain sensors, Surgery, Data acquisition, Design, Signals, Fatigue testing, Biological tissues
Includes: Supplementary data
Journal Articles

Implantable Sensors for Regenerative Medicine

Brett S. Klosterhoff, Melissa Tsang, Didi She, Keat Ghee Ong, Mark G. Allen, Nick J. Willett, Robert E. Guldberg
Journal: Journal of Biomechanical Engineering
Publisher: ASME
Article Type: Research-Article
J Biomech Eng. February 2017, 139(2): 021009.
Paper No: BIO-16-1284
https://doi.org/10.1115/1.4035436
Published Online: January 19, 2017
View Article titled, Implantable Sensors for Regenerative Medicine
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Proceedings Papers

Fabrication of Glass-Metal Composite Micro/Nanonozzles

Nisarga N. Naik, Mark G. Allen
Proc. ASME. IMECE2008, Volume 13: Nano-Manufacturing Technology; and Micro and Nano Systems, Parts A and B, 275-279, October 31–November 6, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2008-67711
https://doi.org/10.1115/IMECE2008-67711
View Paper titled, Fabrication of Glass-Metal Composite Micro/Nanonozzles
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Topics: Composite materials, Glass, Manufacturing, Metals, Nanonozzles
Proceedings Papers

A MEMS Active Cooling Substrate for Microelectronics Thermal Management

Yong Wang, Guang Yuan, Yong-Kyu Yoon, Mark G. Allen, Sue Ann Bidstrup
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 461-463, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-42799
https://doi.org/10.1115/IMECE2003-42799
View Paper titled, A MEMS Active Cooling Substrate for Microelectronics Thermal Management
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Topics: Cooling, Microelectromechanical systems, Microelectronic devices, Thermal management, Jets, Convection, Electrical wires, Electronic systems, Energy consumption, Heat
Proceedings Papers

Mechanically Driven Microtweezers

Yoonsu Choi, James Ross, Steve DeWeerth, Mark G. Allen
Proc. ASME. IMECE2003, Microelectromechanical Systems, 317-320, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-41705
https://doi.org/10.1115/IMECE2003-41705
View Paper titled, Mechanically Driven Microtweezers
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Topics: Design, Electrophysiology, Microassembling, Microelectromechanical systems
Proceedings Papers

High Aspect Ratio SU-8 Structures for 3-D Culturing of Neurons

Yoonsu Choi, Richard Powers, Varadraj Vernekar, A. Bruno Frazier, Michelle C. LaPlaca, Mark G. Allen
Proc. ASME. IMECE2003, Microelectromechanical Systems, 651-654, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-42794
https://doi.org/10.1115/IMECE2003-42794
View Paper titled, High Aspect Ratio SU-8 Structures for 3-D Culturing of Neurons
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Topics: Adhesion, Biocompatibility, Epoxy adhesives, Epoxy resins, Manufacturing, Mechanical stability, Micromachining
Proceedings Papers

Microcombustors Based on Controllable Solid Fuel Elements

Brian E. English, Heather H. DiBiaso, Mark G. Allen
Proc. ASME. IMECE2003, Microelectromechanical Systems, 725-733, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-42823
https://doi.org/10.1115/IMECE2003-42823
View Paper titled, Microcombustors Based on Controllable Solid Fuel Elements
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Topics: Fuels, Combustion chambers, Composite materials, Heat losses, Accelerants (Fuels), Actuators, Atmospheric pressure, Chemistry, Combustion, Geometry
Proceedings Papers

Fabrication of Micromachined Mold Masters for 3-D, High-Aspect-Ratio Cell Culturing Scaffolds

Yanzhu Zhao, Xiaosong Wu, Yong-Kyu Yoon, Jung-Hwan Park, Stephen J. Kennedy, Zvi Schwartz, Barbara D. Boyan, Mark G. Allen
Proc. ASME. IMECE2005, Microelectromechanical Systems, 169-175, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-81991
https://doi.org/10.1115/IMECE2005-81991
View Paper titled, Fabrication of Micromachined Mold Masters for 3-D, High-Aspect-Ratio Cell Culturing Scaffolds
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Topics: Manufacturing, Micromachining, Bone, Semiconductor wafers, Etching, Hydrogels, Molding, Plasma desorption mass spectrometry, Silicon
Journal Articles

Optimization of Synthetic Jet Fluidic Structures in Printed Wiring Boards

Yong Wang, Guang Yuan, Yong-Kyu Yoon, Mark G. Allen, Sue Ann Bidstrup
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 353–359.
https://doi.org/10.1115/1.2351900
Published Online: February 20, 2006
View Article titled, Optimization of Synthetic Jet Fluidic Structures in Printed Wiring Boards
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Topics: Cooling, Dimensions, Heat transfer, Jets, Printed circuit boards, Diaphragms (Mechanical devices), Diaphragms (Structural), Thermal management, Flow (Dynamics), Fluid mechanics