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M. Meilunas
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Journal Articles

Effects of Corner/Edge Bonding and Underfill Properties on the Thermal Cycling Performance of Lead Free Ball Grid Array Assemblies

P. Borgesen, D. Blass, M. Meilunas
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011010.
https://doi.org/10.1115/1.4005904
Published Online: March 19, 2012
View Article titled, Effects of Corner/Edge Bonding and Underfill Properties on the Thermal Cycling Performance of Lead Free Ball Grid Array Assemblies
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Topics: Ball-Grid-Array packaging, Bonding, Corners (Structural elements), Fracture (Materials), Solder joints, Solders, Cycles, Manufacturing, Cracking (Materials), Fracture (Process)
Journal Articles

Effects of Cycling Parameters on the Thermal Fatigue Life of Mixed SnAgCu/SnPb Solder Joints

M. Meilunas, P. Borgesen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021001.
https://doi.org/10.1115/1.4003863
Published Online: June 22, 2011
View Article titled, Effects of Cycling Parameters on the Thermal Fatigue Life of Mixed SnAgCu/SnPb Solder Joints
Open the PDF for Effects of Cycling Parameters on the Thermal Fatigue Life of Mixed SnAgCu/SnPb Solder Joints in another window
Topics: Reliability, Solder joints, Solders, Temperature, Ball-Grid-Array packaging, Fatigue life, Manufacturing, Alloys
Proceedings Papers

Effect of Dwell Times and Ramp Rates on the Thermal Cycling Reliability of Pb-Free Wafer-Level Chip Scale Packages: Experiments and Modeling

S. Chaparala, J. M. Pitarresi, M. Meilunas
Proc. ASME. IMECE2006, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 59-65, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-13376
https://doi.org/10.1115/IMECE2006-13376
View Paper titled, Effect of Dwell Times and Ramp Rates on the Thermal Cycling Reliability of Pb-Free Wafer-Level Chip Scale Packages: Experiments and Modeling
Open the PDF for Effect of Dwell Times and Ramp Rates on the Thermal Cycling Reliability of Pb-Free Wafer-Level Chip Scale Packages: Experiments and Modeling in another window
Topics: Modeling, Reliability, Semiconductor wafers, Lead-free solders, Solders, Testing, Tin, Finite element analysis, Temperature, Alloys
Journal Articles

Experimental and Numerical Investigation of the Reliability of Double-Sided Area Array Assemblies

S. Chaparala, J. M. Pitarresi, S. Parupalli, S. Mandepudi, M. Meilunas
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 441–448.
https://doi.org/10.1115/1.2353280
Published Online: February 23, 2006
View Article titled, Experimental and Numerical Investigation of the Reliability of Double-Sided Area Array Assemblies
Open the PDF for Experimental and Numerical Investigation of the Reliability of Double-Sided Area Array Assemblies in another window
Topics: Ball-Grid-Array packaging, Manufacturing, Reliability, Stiffness, Mirrors, Cycles, Solder joints, Solders, Finite element analysis, Capacitors