1-19 of 19
Kenneth Goodson
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Virtual Testbed for Economical and Reliability Analysis of Battery Thermal Management Control Strategies

Mostafa Olyaei, Sagar Singh, Kaiying Jiang, Yashraj Gurumukhi, Kenneth Goodson, Mehdi Asheghi, Nenad Miljkovic
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041110.
Paper No: EP-24-1024
https://doi.org/10.1115/1.4065988
Published Online: August 9, 2024
View Article titled, Virtual Testbed for Economical and Reliability Analysis of Battery Thermal Management Control Strategies
Open the PDF for Virtual Testbed for Economical and Reliability Analysis of Battery Thermal Management Control Strategies in another window
Topics: Batteries, Cycles, Temperature, Thermal management, Cooling
Proceedings Papers

Experimental Characterization of Confined, Package-Level Direct Two-Phase Jet Impingement Cooling With Micro-Pin Fin Surface Enhancement

Qianying Wu, Zheng Gong, Chih-Yao Chan, Heungdong Kwon, Kenneth Goodson, Tiwei Wei
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-109944
https://doi.org/10.1115/IPACK2023-109944
View Paper titled, Experimental Characterization of Confined, Package-Level Direct Two-Phase Jet Impingement Cooling With Micro-Pin Fin Surface Enhancement
Open the PDF for Experimental Characterization of Confined, Package-Level Direct Two-Phase Jet Impingement Cooling With Micro-Pin Fin Surface Enhancement in another window
Topics: Boiling, Bubbles, Computer cooling, Coolants, Cooling, Cooling systems, Drying, Energy consumption, Experimental characterization, Flow (Dynamics)
Proceedings Papers

Reliability of Copper Inverse Opal Surfaces for Extreme-Heat-Flux Micro-Coolers in Low-Global-Warming-Potential Refrigerant R-1233zd Pool Boiling Experiments

Bidzina Kekelia, Qianying Wu, Sreekant Narumanchi, Joshua Major, Gilbert Moreno, Mehdi Asheghi, Ercan M. Dede, James Palko, Kenneth Goodson
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A017, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-113781
https://doi.org/10.1115/IPACK2023-113781
View Paper titled, Reliability of Copper Inverse Opal Surfaces for Extreme-Heat-Flux Micro-Coolers in Low-Global-Warming-Potential Refrigerant R-1233zd Pool Boiling Experiments
Open the PDF for Reliability of Copper Inverse Opal Surfaces for Extreme-Heat-Flux Micro-Coolers in Low-Global-Warming-Potential Refrigerant R-1233zd Pool Boiling Experiments in another window
Topics: Copper, Critical heat flux, Data centers, Heat, Heat transfer, Microcoolers, Pool boiling, Refrigerants, Reliability
Proceedings Papers

Virtual Testbed for Economical and Reliability Analysis of Battery Thermal Management Control Strategies

Sagar Singh, Mostafa Olyaei, Katherine Jiang, Yashraj Gurumukhi, Kenneth Goodson, Mehdi Asheghi, Nenad Miljkovic
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A007, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111825
https://doi.org/10.1115/IPACK2023-111825
View Paper titled, Virtual Testbed for Economical and Reliability Analysis of Battery Thermal Management Control Strategies
Open the PDF for Virtual Testbed for Economical and Reliability Analysis of Battery Thermal Management Control Strategies in another window
Topics: Batteries, Cooling, Event history analysis, Thermal management
Proceedings Papers

Development of Thermal Interface Materials Tape Using Vertically Aligned Copper Nanowire-PDMS Composites

Hansen Qiao, Katherine Jiang, Tiwei Wei, Yujui Lin, Chris Perez, Mehdi Asheghi, Kenneth Goodson
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A007, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-113126
https://doi.org/10.1115/IPACK2023-113126
View Paper titled, Development of Thermal Interface Materials Tape Using Vertically Aligned Copper Nanowire-PDMS Composites
Open the PDF for Development of Thermal Interface Materials Tape Using Vertically Aligned Copper Nanowire-PDMS Composites in another window
Topics: Composite materials, Copper, Nanowires, Plasma desorption mass spectrometry
Proceedings Papers

Characterization and Prevention of Metal Overflow in Ultra-Thin Au-Sn Eutectic Chip Bonding for Packaging and Integration of Extreme Heat Flux Micro-Coolers

Sougata Hazra, Yashvi Singh, Mehdi Asheghi, Kenneth Goodson
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2533
https://doi.org/10.1115/IPACK2020-2533
View Paper titled, Characterization and Prevention of Metal Overflow in Ultra-Thin Au-Sn Eutectic Chip Bonding for Packaging and Integration of Extreme Heat Flux Micro-Coolers
Open the PDF for Characterization and Prevention of Metal Overflow in Ultra-Thin Au-Sn Eutectic Chip Bonding for Packaging and Integration of Extreme Heat Flux Micro-Coolers in another window
Topics: Bonding, Flip-chip, Heat flux, Intermetallic compounds, Metals, Microcoolers, Packaging, Tin
Proceedings Papers

Lasered Roughness to Increase Wicking Rates in Pin-Fin Microstructure

Sougata Hazra, Tanya Liu, Mehdi Asheghi, Kenneth Goodson
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A006, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2640
https://doi.org/10.1115/IPACK2020-2640
View Paper titled, Lasered Roughness to Increase Wicking Rates in Pin-Fin Microstructure
Open the PDF for Lasered Roughness to Increase Wicking Rates in Pin-Fin Microstructure in another window
Topics: Lasers, Surface roughness, Vapors
Proceedings Papers

Design and Fabrication of Graded Copper Inverse Opals (g-CIOs) for Capillary-Fed Boiling in High Heat Flux Cooling Applications

Qianying Wu, Chi Zhang, Mehdi Asheghi, Kenneth Goodson
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A011, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2603
https://doi.org/10.1115/IPACK2020-2603
View Paper titled, Design and Fabrication of Graded Copper Inverse Opals (g-CIOs) for Capillary-Fed Boiling in High Heat Flux Cooling Applications
Open the PDF for Design and Fabrication of Graded Copper Inverse Opals (g-CIOs) for Capillary-Fed Boiling in High Heat Flux Cooling Applications in another window
Topics: Boiling, Cooling, Copper, Design, Heat flux, Manufacturing, Critical heat flux, Heat, Modeling, Permeability
Proceedings Papers

Investigation of the Heterogeneous Thermal Conductivity in Bulk CVD Diamond for Use in Electronics Thermal Management

Luke Yates, Ramez Cheaito, Aditya Sood, Zhe Cheng, Thomas Bougher, Mehdi Asheghi, Kenneth Goodson, Mark Goorsky, Firooz Faili, Dan Twitchen, Samuel Graham
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A014, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74163
https://doi.org/10.1115/IPACK2017-74163
View Paper titled, Investigation of the Heterogeneous Thermal Conductivity in Bulk CVD Diamond for Use in Electronics Thermal Management
Open the PDF for Investigation of the Heterogeneous Thermal Conductivity in Bulk CVD Diamond for Use in Electronics Thermal Management in another window
Topics: Electronics, Synthetic diamonds, Thermal conductivity, Thermal management, Diamonds, Chemical vapor deposition, Electron backscatter diffraction, Lasers, Boron, Heat flux
Proceedings Papers

Numerical Optimization of Advanced Monolithic Microcoolers for High Heat Flux Microelectronics

Sebastian Scholl, Catherine Gorle, Farzad Houshmand, Mehdi Asheghi, Kenneth Goodson, Tom Verstraete
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A018, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48123
https://doi.org/10.1115/IPACK2015-48123
View Paper titled, Numerical Optimization of Advanced Monolithic Microcoolers for High Heat Flux Microelectronics
Open the PDF for Numerical Optimization of Advanced Monolithic Microcoolers for High Heat Flux Microelectronics in another window
Topics: Heat flux, Microcoolers, Microelectronic devices, Optimization, Cooling, Fluids, Heat transfer, Computational fluid dynamics, Design, Engineering simulation
Proceedings Papers

Full Scale Simulation of an Integrated Monolithic Heat Sink for Thermal Management of a High Power Density GaN-SiC Chip

Tanya Liu, Farzad Houshmand, Catherine Gorle, Sebastian Scholl, Hyoungsoon Lee, Yoonjin Won, Mehdi Asheghi, Kenneth Goodson, Hooman Kazemi, Kenneth Vanhille
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A057, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48592
https://doi.org/10.1115/IPACK2015-48592
View Paper titled, Full Scale Simulation of an Integrated Monolithic Heat Sink for Thermal Management of a High Power Density GaN-SiC Chip
Open the PDF for Full Scale Simulation of an Integrated Monolithic Heat Sink for Thermal Management of a High Power Density GaN-SiC Chip in another window
Topics: Gallium nitride, Heat sinks, Power density, Simulation, Thermal management, Cooling, Flow (Dynamics), Microchannels, Design, Heat transfer
Proceedings Papers

Validation Study for VOF Simulations of Boiling in a Microchannel

Catherine Gorlé, Hyoungsoon Lee, Farzad Houshmand, Mehdi Asheghi, Kenneth Goodson, Pritish R. Parida
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A022, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48129
https://doi.org/10.1115/IPACK2015-48129
View Paper titled, Validation Study for VOF Simulations of Boiling in a Microchannel
Open the PDF for Validation Study for VOF Simulations of Boiling in a Microchannel in another window
Topics: Boiling, Microchannels, Simulation, Boundary-value problems, Temperature, Two-phase flow, Flow (Dynamics), Fluids, Heat flux, Heat transfer
Proceedings Papers

Numerical Simulation of Advanced Monolithic Microcooler Designs for High Heat Flux Microelectronics

Sebastian Scholl, Catherine Gorle, Farzad Houshmand, Tanya Liu, Hyoungsoon Lee, Yoonjin Won, Mehdi Asheghi, Kenneth Goodson, Hooman Kazemi
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A009, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48122
https://doi.org/10.1115/IPACK2015-48122
View Paper titled, Numerical Simulation of Advanced Monolithic Microcooler Designs for High Heat Flux Microelectronics
Open the PDF for Numerical Simulation of Advanced Monolithic Microcooler Designs for High Heat Flux Microelectronics in another window
Topics: Boundary-value problems, Computational fluid dynamics, Computer simulation, Cooling, Design, Fins, Flow (Dynamics), Fluid dynamics, Geometry, Heat conduction
Proceedings Papers

Modeling and Optimization of Small Thermoelectric Generators for Low-Power Electronics

Marc T. Dunham, Michael T. Barako, Saniya LeBlanc, Mehdi Asheghi-Roudheni, Baoxing Chen, Kenneth Goodson
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T03A009, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73297
https://doi.org/10.1115/IPACK2013-73297
View Paper titled, Modeling and Optimization of Small Thermoelectric Generators for Low-Power Electronics
Open the PDF for Modeling and Optimization of Small Thermoelectric Generators for Low-Power Electronics in another window
Topics: Generators, Low-power electronics, Modeling, Optimization, Temperature, Design, Fillers (Materials), Heat, Thermal resistance, Thermoelectric devices
Proceedings Papers

Decoupled Thermal and Fluidic Effects on Hotspot Cooling in a Boiling Flow Microchannel Heat Sink

Roger Flynn, Ching-Hsiang Cheng, Kenneth Goodson
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 179-184, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33484
https://doi.org/10.1115/IPACK2007-33484
View Paper titled, Decoupled Thermal and Fluidic Effects on Hotspot Cooling in a Boiling Flow Microchannel Heat Sink
Open the PDF for Decoupled Thermal and Fluidic Effects on Hotspot Cooling in a Boiling Flow Microchannel Heat Sink in another window
Topics: Boiling, Cooling, Flow (Dynamics), Heat sinks, Microchannels, Thermal resistance, Convection, Design, Flow instability, Microfluidics
Proceedings Papers

3-D Numerical Simulation of Contact Angle Hysteresis for Slug Flow in Microchannel

Chen Fang, Carlos Hidrovo, Fumin Wang, Julie Steinbrenner, Eonsoo Lee, Dongrip Kim, Kenneth Goodson
Proc. ASME. ICNMM2007, ASME 5th International Conference on Nanochannels, Microchannels, and Minichannels, 955-963, June 18–20, 2007
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2007-30199
https://doi.org/10.1115/ICNMM2007-30199
View Paper titled, 3-D Numerical Simulation of Contact Angle Hysteresis for Slug Flow in Microchannel
Open the PDF for 3-D Numerical Simulation of Contact Angle Hysteresis for Slug Flow in Microchannel in another window
Topics: Computer simulation, Microchannels, Slug flows, Simulation, Dimensions, Accounting, Algorithms, Dynamics (Mechanics), Flow (Dynamics), Nonlinear equations
Proceedings Papers

Thermal Conduction Phenomena in Advanced Interface Materials for Electronics Cooling

Xuejiao Hu, Ravi Prasher, Kenneth Goodson
Proc. ASME. HT2005, Heat Transfer: Volume 4, 963-966, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: HT2005-72729
https://doi.org/10.1115/HT2005-72729
View Paper titled, Thermal Conduction Phenomena in Advanced Interface Materials for Electronics Cooling
Open the PDF for Thermal Conduction Phenomena in Advanced Interface Materials for Electronics Cooling in another window
Topics: Computer cooling, Heat conduction, Packaging, Composite materials, Polymers, Semiconductors (Materials), Thermal resistance, Thin films
Proceedings Papers

Design, Fabrication and Thermal Characterization of a MEMS Device for Control of Nerve Cell Growth

Ankur Jain, Kevin Ness, Angie McConnell, Linan Jiang, Kenneth Goodson
Proc. ASME. IMECE2003, Microelectromechanical Systems, 251-257, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-41590
https://doi.org/10.1115/IMECE2003-41590
View Paper titled, Design, Fabrication and Thermal Characterization of a MEMS Device for Control of Nerve Cell Growth
Open the PDF for Design, Fabrication and Thermal Characterization of a MEMS Device for Control of Nerve Cell Growth in another window
Topics: Design, Manufacturing, Microelectromechanical systems, Thermal characterization, Membranes, Temperature, Biomedicine, Finite element analysis, Heating, Modeling
Journal Articles

Thermometry and Thermal Transport in Micro/Nanoscale Solid-State Devices and Structures

David G. Cahill, Kenneth Goodson, Arunava Majumdar
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Review Papers
J. Heat Mass Transfer. April 2002, 124(2): 223–241.
https://doi.org/10.1115/1.1454111
Published Online: December 7, 2001
View Article titled, Thermometry and Thermal Transport in Micro/Nanoscale Solid-State Devices and Structures
Open the PDF for Thermometry and Thermal Transport in Micro/Nanoscale Solid-State Devices and Structures in another window
Topics: Phonons, Superlattices, Temperature, Temperature measurement, Thermal conductivity, Thin films, Heat conduction, Probes, Heat, Thermoreflectance