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Joel Plawsky
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Journal Articles

Special Issue From International Workshop on New Understanding in Nanoscale/Microscale Phase Change Phenomena Held in Trondheim, Norway, June 12–16, 2016

Satish Kandlikar, Carlos A. Dorao, Joel Plawsky, Peter Stephan
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Guest Editorial
J. Heat Mass Transfer. November 2017, 139(11): 110301.
Paper No: HT-17-1426
https://doi.org/10.1115/1.4037533
Published Online: August 24, 2017
View Article titled, Special Issue From International Workshop on New Understanding in Nanoscale/Microscale Phase Change Phenomena Held in Trondheim, Norway, June 12–16, 2016
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Topics: Boiling, Condensation, Evaporation, Heat transfer, Microscale devices, Nanoscale phenomena, Workshops (Work spaces), Nanoscale heat transfer
Proceedings Papers

Heat Conduction in High Thermal Conductivity Networked Composite Films for Thermal Interface Materials

Hafez Raeisi Fard, Kamyar Pashayi, Fengyuan Lai, Joel Plawsky, Theodorian Borca-Tasciuc
Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 409-410, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-65633
https://doi.org/10.1115/IMECE2011-65633
View Paper titled, Heat Conduction in High Thermal Conductivity Networked Composite Films for Thermal Interface Materials
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Topics: Composite materials, Heat conduction, Thermal conductivity, Thermal management, Contact resistance, Heat, Low temperature, Nanoparticles, Optoelectronic devices, Particulate matter
Proceedings Papers

Annealing Temperature Effect on the Structure of High Thermal Conductivity Silver/Epoxy Nanocomposites

Kamyar Pashayi, Hafez Raeisi Fard, Fengyuan Lai, Joel Plawsky, Theodorian Borca-Tasciuc
Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 713-714, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-65578
https://doi.org/10.1115/IMECE2011-65578
View Paper titled, Annealing Temperature Effect on the Structure of High Thermal Conductivity Silver/Epoxy Nanocomposites
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Topics: Annealing, Epoxy adhesives, Epoxy resins, Nanocomposites, Silver, Temperature, Thermal conductivity, Nanoparticles, Polymers, Coating processes