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Hideo Nishimura
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Proceedings Papers

Stress Analysis of High Density Bare Chip Packaging Technologies

Yutaka Tsukada, Shogo Mizumoto, Yasuyuki Kodama, Hideo Nishimura
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 49-50, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0499
https://doi.org/10.1115/IMECE1997-0499
View Paper titled, Stress Analysis of High Density Bare Chip Packaging Technologies
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Topics: Density, Packaging, Stress analysis (Engineering), Epoxy adhesives, Epoxy resins, Ceramics, Ball-Grid-Array packages, Ball-Grid-Array packaging, Electronic packaging, Flip-chip
Journal Articles

Creep-Fatigue Life Evaluation for Sn - 3.5 Ag Solder

Mineo Nozaki, Masao Sakane, Yutaka Tsukada, Hideo Nishimura
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Research Papers
J. Eng. Mater. Technol. April 2006, 128(2): 142–150.
https://doi.org/10.1115/1.2172273
Published Online: May 11, 2005
View Article titled, Creep-Fatigue Life Evaluation for Sn - 3.5 Ag Solder
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Topics: Creep, Fatigue, Solders, Tin, Waves
Journal Articles

A Strain Rate Ratio Approach for Assessing Creep-Fatigue Life of 63Sn-37Pb Solder Under Shear Loading

Yutaka Tsukada, Hideo Nishimura, Hiroki Yamamoto, Masao Sakane
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 407–414.
https://doi.org/10.1115/1.2070091
Published Online: December 24, 2004
View Article titled, A Strain Rate Ratio Approach for Assessing Creep-Fatigue Life of 63Sn-37Pb Solder Under Shear Loading
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Topics: Creep, Fatigue, Solders, Fatigue life, Damage, Shear (Mechanics), Waves, Ductility
Journal Articles

Temperature and Strain Rate Effects on Tensile Strength and Inelastic Constitutive Relationship of Sn-Pb Solders

Haruo Nose, Lecturer,, Masao Sakane, Professor,, Yutaka Tsukada, Researcher, Hideo Nishimura, Researcher
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 59–66.
https://doi.org/10.1115/1.1533058
Published Online: March 14, 2003
View Article titled, Temperature and Strain Rate Effects on Tensile Strength and Inelastic Constitutive Relationship of Sn-Pb Solders
Open the PDF for Temperature and Strain Rate Effects on Tensile Strength and Inelastic Constitutive Relationship of Sn-Pb Solders in another window
Topics: Solders, Temperature, Tensile strength, Tin, Yield stress, Young's modulus, Creep, Stress
Journal Articles

Fatigue Life Analysis of Solder Joints in Flip Chip Bonding

Yutaka Tsukada, Hideo Nishimura, Masao Sakane, Masateru Ohnami
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 207–213.
https://doi.org/10.1115/1.1286002
Published Online: November 1, 1999
View Article titled, Fatigue Life Analysis of Solder Joints in Flip Chip Bonding
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Topics: Bonding, Fatigue life, Finite element methods, Flip-chip, Flip-chip devices, Solder joints, Solders, Thermal stresses, Dimensions, Finite element analysis