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Daniel Lorenzini
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Journal Articles

Flow Boiling in Flexible Polymer Microgaps for Embedded Cooling in High-Power Applications

Daniel Lorenzini, Wenming Li, Yogendra Joshi
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. April 2023, 145(4): 041603.
Paper No: HT-22-1470
https://doi.org/10.1115/1.4056594
Published Online: February 3, 2023
View Article titled, Flow Boiling in Flexible Polymer Microgaps for Embedded Cooling in High-Power Applications
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Topics: Boiling, Cooling, Flow (Dynamics), Fluids, Plasma desorption mass spectrometry, Vapors, Temperature, Computer simulation, Computational fluid dynamics, Heat
Journal Articles

Parametric Analysis of Microfluidic Cooling Systems for Three-Dimensional-Stacked Silicon Microelectronics by Inferential Statistic Approaches

Tomas Moreno-Torres, Daniel Lorenzini, Yogendra Joshi, Abel Hernandez-Guerrero, J. Luis Luviano-Ortiz
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. April 2021, 143(4): 044502.
Paper No: HT-20-1769
https://doi.org/10.1115/1.4049639
Published Online: February 2, 2021
View Article titled, Parametric Analysis of Microfluidic Cooling Systems for Three-Dimensional-Stacked Silicon Microelectronics by Inferential Statistic Approaches
Open the PDF for Parametric Analysis of Microfluidic Cooling Systems for Three-Dimensional-Stacked Silicon Microelectronics by Inferential Statistic Approaches in another window
Topics: Computer simulation, Cooling systems, Density, Experimental design, Heat, Microfluidics, Pressure drop, Silicon, Temperature, Fins
Journal Articles

Computational Fluid Dynamics Modeling of Flow Boiling in Microchannels With Nonuniform Heat Flux

Daniel Lorenzini, Yogendra K. Joshi
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. January 2018, 140(1): 011501.
Paper No: HT-16-1351
https://doi.org/10.1115/1.4037343
Published Online: August 23, 2017
View Article titled, Computational Fluid Dynamics Modeling of Flow Boiling in Microchannels With Nonuniform Heat Flux
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Topics: Boiling, Computational fluid dynamics, Flow (Dynamics), Heat flux, Microchannels, Pressure drop, Temperature, Two-phase flow, Vapors, Silicon
Journal Articles

Comparison of the Volume of Fluid and CLSVOF Methods for the Assessment of Flow Boiling in Silicon Microgaps

Daniel Lorenzini, Yogendra Joshi
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. November 2017, 139(11): 111506.
Paper No: HT-16-1651
https://doi.org/10.1115/1.4036682
Published Online: June 21, 2017
View Article titled, Comparison of the Volume of Fluid and CLSVOF Methods for the Assessment of Flow Boiling in Silicon Microgaps
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Topics: Boiling, Bubbles, Fins, Flow (Dynamics), Fluids, Nucleation (Physics), Silicon, Temperature, Two-phase flow, Vapors
Proceedings Papers

Heat Sink Performance Improvement by Way of Nanofluids

J. L. Zúñiga-Cerroblanco, C. Ulises Gonzalez-Valle, Daniel Lorenzini-Gutierrez, Abel Hernandez-Guerrero, Jaime Cervantes de Gortari
Proc. ASME. HT2016, Volume 2: Heat Transfer in Multiphase Systems; Gas Turbine Heat Transfer; Manufacturing and Materials Processing; Heat Transfer in Electronic Equipment; Heat and Mass Transfer in Biotechnology; Heat Transfer Under Extreme Conditions; Computational Heat Transfer; Heat Transfer Visualization Gallery; General Papers on Heat Transfer; Multiphase Flow and Heat Transfer; Transport Phenomena in Manufacturing and Materials Processing, V002T21A001, July 10–14, 2016
Publisher: American Society of Mechanical Engineers
Paper No: HT2016-1027
https://doi.org/10.1115/HT2016-1027
View Paper titled, Heat Sink Performance Improvement by Way of Nanofluids
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Topics: Heat sinks, Nanofluids, Cooling, Fluids, Flow (Dynamics), Particulate matter, Water, Design, Energy dissipation, Heat transfer
Proceedings Papers

CFD Analysis of Flow Boiling in a Silicon Microchannel With Non-Uniform Heat Flux

Daniel Lorenzini, Yogendra K. Joshi
Proc. ASME. ICNMM2015, ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, V001T07A014, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2015-48098
https://doi.org/10.1115/ICNMM2015-48098
View Paper titled, CFD Analysis of Flow Boiling in a Silicon Microchannel With Non-Uniform Heat Flux
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Topics: Boiling, Computational fluid dynamics, Flow (Dynamics), Heat flux, Microchannels, Silicon, Heat, Flux (Metallurgy), Microelectronic devices, Cooling
Journal Articles

Variable Fin Density Flow Channels for Effective Cooling and Mitigation of Temperature Nonuniformity in Three-Dimensional Integrated Circuits

Daniel Lorenzini-Gutierrez, Satish G. Kandlikar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2014, 136(2): 021007.
Paper No: EP-13-1082
https://doi.org/10.1115/1.4027091
Published Online: April 29, 2014
View Article titled, Variable Fin Density Flow Channels for Effective Cooling and Mitigation of Temperature Nonuniformity in Three-Dimensional Integrated Circuits
Open the PDF for Variable Fin Density Flow Channels for Effective Cooling and Mitigation of Temperature Nonuniformity in Three-Dimensional Integrated Circuits in another window
Topics: Density, Flow (Dynamics), Pressure drop, Temperature, Cooling, Fins