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Journal Articles

Coupled Electrical–Thermal–Fluidic Multi-Physics Analysis of Through Silicon Via Pin Fin Microchannel in the Three-Dimensional Integrated Circuit

Ping Sun, Bing-Huan Huang, Kui Li, Liang Gong, Chuan-Yong Zhu, Ying Zheng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011005.
Paper No: EP-22-1080
https://doi.org/10.1115/1.4062531
Published Online: June 6, 2023
View Articletitled, Coupled Electrical–Thermal–Fluidic Multi-Physics Analysis of Through Silicon Via Pin Fin Microchannel in the Three-Dimensional Integrated Circuit
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Topics: Flow (Dynamics), Heat transfer, Microchannels, Shapes, Temperature, Fins, Circuits, Cooling, Integrated circuits
Journal Articles

Investigation on Thermal Performance of a Novel Passive Phase Change Material-Based Fin Heat Exchanger

De-Xin Zhang, Chuan-Yong Zhu, Liang Gong, Bin Ding, Ming-Hai Xu
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. February 2023, 15(2): 021007.
Paper No: TSEA-22-1182
https://doi.org/10.1115/1.4056009
Published Online: November 8, 2022
View Articletitled, Investigation on Thermal Performance of a Novel Passive Phase Change Material-Based Fin Heat Exchanger
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Topics: Heat exchangers, Heat flux, Temperature, Phase change materials, Temperature control, Heat, Shock (Mechanics), Fins, Melting
Journal Articles

Theoretical and DSMC Studies on Heat Conduction of Gas Confined in a Cuboid Nanopore

Chuan-Yong Zhu, Zeng-Yao Li, Wen-Quan Tao
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. May 2017, 139(5): 052405.
Paper No: HT-16-1325
https://doi.org/10.1115/1.4035854
Published Online: February 23, 2017
View Articletitled, Theoretical and DSMC Studies on Heat Conduction of Gas Confined in a Cuboid Nanopore
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Topics: Heat conduction, Nanopores, Thermal conductivity, Mean free path, Heat flux, Temperature, Helium
Proceedings Papers

Theoretical and DSMC Study on Heat Conduction of Gas in Nanoscale Pores

Chuan-Yong Zhu, Zeng-Yao Li
Proc. ASME. MNHMT2016, Volume 2: Micro/Nano-Thermal Manufacturing and Materials Processing; Boiling, Quenching and Condensation Heat Transfer on Engineered Surfaces; Computational Methods in Micro/Nanoscale Transport; Heat and Mass Transfer in Small Scale; Micro/Miniature Multi-Phase Devices; Biomedical Applications of Micro/Nanoscale Transport; Measurement Techniques and Thermophysical Properties in Micro/Nanoscale; Posters, V002T11A008, January 4–6, 2016
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2016-6435
https://doi.org/10.1115/MNHMT2016-6435
View Paper titled, Theoretical and DSMC Study on Heat Conduction of Gas in Nanoscale Pores
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Topics: Heat conduction, Nanoscale phenomena, Simulation, Boundary-value problems, Heat flux, Mean free path, Temperature, Thermal conductivity