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Christopher R. Yap
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Proceedings Papers

Experimental Study and High Speed Visualization of Flow Boiling Characteristics in Silicon Microgap Heat Sink

Tamanna Alam, Poh Seng Lee, Christopher R. Yap, Liwen Jin
Proc. ASME. IMECE2012, Volume 7: Fluids and Heat Transfer, Parts A, B, C, and D, 2059-2068, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-86669
https://doi.org/10.1115/IMECE2012-86669
View Paper titled, Experimental Study and High Speed Visualization of Flow Boiling Characteristics in Silicon Microgap Heat Sink
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Topics: Boiling, Flow (Dynamics), Heat sinks, Silicon, Visualization, Heat transfer, Heat transfer coefficients, Heat flux, Computer cooling, Electronic components
Journal Articles

A Correlation for Confined Nucleate Boiling Heat Transfer

Mark Aaron Chan, Christopher R. Yap, Kim Choon Ng
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. July 2011, 133(7): 074502.
https://doi.org/10.1115/1.4003551
Published Online: April 5, 2011
View Article titled, A Correlation for Confined Nucleate Boiling Heat Transfer
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Topics: Boiling, Heat transfer, Heat transfer coefficients, Nucleate boiling, Space
Journal Articles

Pool Boiling Heat Transfer of Water on Finned Surfaces at Near Vacuum Pressures

Mark Aaron Chan, Christopher R. Yap, Kim Choon Ng
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. March 2010, 132(3): 031501.
https://doi.org/10.1115/1.4000054
Published Online: December 29, 2009
View Article titled, Pool Boiling Heat Transfer of Water on Finned Surfaces at Near Vacuum Pressures
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Topics: Boiling, Bubbles, Heat, Heat transfer, Pressure, Vapors, Visualization, Water, Heat flux, Nucleation (Physics)
Proceedings Papers

Modeling and Testing of an Integrated Evaporator-Condenser Device for CPU Cooling

Mark Aaron Chan, Christopher R. Yap, Kim Choon Ng
Proc. ASME. HT2008, Heat Transfer: Volume 2, 685-691, August 10–14, 2008
Publisher: American Society of Mechanical Engineers
Paper No: HT2008-56187
https://doi.org/10.1115/HT2008-56187
View Paper titled, Modeling and Testing of an Integrated Evaporator-Condenser Device for CPU Cooling
Open the PDF for Modeling and Testing of an Integrated Evaporator-Condenser Device for CPU Cooling in another window
Topics: Computer cooling, Condensers (steam plant), Modeling, Testing, Design, Cooling, Heat, Air flow, Boiling, Copper