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C. S. Lin
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Journal Articles

X-Ray Imaging Inspection System for Blind Holes in the Intermediate Layer of Printed Circuit Boards with Neural Network Identification

C.-S. Lin, B.-E. Chan, Y.-C. Huang, H.-T. Chen, Y.-C. Lin
Journal: Journal of Testing and Evaluation
Publisher: ASTM International
Article Type: Research-Article
J. Test. Eval.. May 2017, 45(3): 1005–1015.
Paper No: JTE20150015
https://doi.org/10.1520/JTE20150015
Published Online: May 24, 2017
View Articletitled, X-Ray Imaging Inspection System for Blind Holes in the Intermediate Layer of Printed Circuit Boards with Neural Network Identification
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Proceedings Papers

Novel Test Methods for Die Strength

M. Y. Tsai, C. H. Chen, C. S. Lin
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 939-945, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73296
https://doi.org/10.1115/IPACK2005-73296
View Paper titled, Novel Test Methods for Die Strength
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Topics: Atomic force microscopy, Design, Electromagnetic scattering, Electronic packaging, Failure, Failure mechanisms, Finite element analysis, Geometry, Grinding, Packaging
Journal Articles

Test Methods for Silicon Die Strength

M. Y. Tsai, C. H. Chen, C. S. Lin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 419–426.
https://doi.org/10.1115/1.2351907
Published Online: February 6, 2006
View Articletitled, Test Methods for Silicon Die Strength
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Topics: Silicon, Stress, Semiconductor wafers, Failure, Surface roughness, Deflection, Finite element analysis
Journal Articles

Direct Contact Condensation in the Presence of Noncondensables in OC-OTEC Condensers

S. M. Ghiaasiaan, A. T. Wassel, C. S. Lin
Journal: Journal of Solar Energy Engineering
Publisher: ASME
Article Type: Research Papers
J. Sol. Energy Eng. November 1991, 113(4): 228–235.
https://doi.org/10.1115/1.2929967
Published Online: November 1, 1991
View Articletitled, Direct Contact Condensation in the Presence of Noncondensables in OC-OTEC Condensers
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Topics: Condensation, Condensers (steam plant), Ocean thermal energy conversion, Cycles, Flow (Dynamics), Mass transfer, Sprays, Temperature, Temperature profiles, Transients (Dynamics)
Journal Articles

Optimum Path Planning for Mechanical Manipulators

J. Y. S. Luh, C. S. Lin
Journal: Journal of Dynamic Systems, Measurement, and Control
Publisher: ASME
Article Type: Research Papers
J. Dyn. Sys., Meas., Control. June 1981, 103(2): 142–151.
https://doi.org/10.1115/1.3139654
Published Online: June 1, 1981
View Articletitled, Optimum Path Planning for Mechanical Manipulators
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Topics: Manipulators, Path planning, Computer programming, Algorithms, Collisions (Physics), Composite materials, Conveyor systems, FORTRAN, Linear programming, Travel time (Traffic engineering)
eBook Chapter

Stress Corrosion Cracking of High-Strength Bolting

Series: ASTM Selected Technical Papers
Publisher: ASTM International
Published: 1967
https://doi.org/10.1520/STP46454S
ISBN-10: 0-8031-6638-9
ISBN: 978-0-8031-6638-7
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