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Proceedings Papers

An Integrated Approach Toward the Dynamic Analysis of High-Speed Spindles: Part II — Dynamics Under Moving End Load

C. H. Chen, K. W. Wang
Proc. ASME. DETC93, 14th Biennial Conference on Mechanical Vibration and Noise: Vibration of Rotating Systems, 347-354, September 19–22, 1993
Publisher: American Society of Mechanical Engineers
Paper No: DETC1993-0211
https://doi.org/10.1115/DETC1993-0211
View Paper titled, An Integrated Approach Toward the Dynamic Analysis of High-Speed Spindles: Part II — Dynamics Under Moving End Load
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Topics: Dynamic analysis, Dynamics (Mechanics), Stress, Bearings, Chatter, Equilibrium (Physics), Errors, Iterative methods, Rotors, Stability
Proceedings Papers

An Integrated Approach Toward the Dynamic Analysis of High-Speed Spindles: Part I — System Model

C. H. Chen, K. W. Wang, Y. C. Shin
Proc. ASME. DETC93, 14th Biennial Conference on Mechanical Vibration and Noise: Vibration of Rotating Systems, 339-346, September 19–22, 1993
Publisher: American Society of Mechanical Engineers
Paper No: DETC1993-0210
https://doi.org/10.1115/DETC1993-0210
View Paper titled, An Integrated Approach Toward the Dynamic Analysis of High-Speed Spindles: Part I — System Model
Open the PDF for An Integrated Approach Toward the Dynamic Analysis of High-Speed Spindles: Part I — System Model in another window
Topics: Approximation, Ball bearings, Bearings, Centrifugal force, Dynamic analysis, Dynamics (Mechanics), Modeling, Stiffness, Vibration
eBook Chapter

Multi-Channel Constant Current LED Driver with PWM Boost Converter

Series: ASME Press Select Proceedings
Publisher: ASME Press
Published: 2011
ISBN: 9780791859896
Open the PDF for Multi-Channel Constant Current LED Driver with PWM Boost Converter in another window
Topics: Brightness (Photometry), Circuits, Complementary metal oxide semiconductors, Design, Energy consumption, Errors, Image processing, Light-emitting diodes, Lithium-ion batteries, String
Proceedings Papers

Thermal Reliability of Low-Cost High-Power LED Package Module Under WHTOL Test

C. H. Chen, W. L. Tsai, C. Y. Tang, M. Y. Tsai
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 921-927, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89337
https://doi.org/10.1115/InterPACK2009-89337
View Paper titled, Thermal Reliability of Low-Cost High-Power LED Package Module Under WHTOL Test
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Topics: Junctions, Reliability, Temperature, Thermal resistance
Proceedings Papers

Mid-Infrared Properties of Nanoscale Metallic Slit Arrays

Y.-B. Chen, K. Fu, C.-H. Chen, P.-F. Hsu, Y.-C. Lee
Proc. ASME. HT2008, Heat Transfer: Volume 3, 709-712, August 10–14, 2008
Publisher: American Society of Mechanical Engineers
Paper No: HT2008-56197
https://doi.org/10.1115/HT2008-56197
View Paper titled, Mid-Infrared Properties of Nanoscale Metallic Slit Arrays
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Topics: Cavities, Dielectric materials, Diffraction gratings, Energy conversion, Metals, Microscopy, Nanolithography, Nanoscale phenomena, Optical instruments, Periodic structures
Proceedings Papers

Novel Test Methods for Die Strength

M. Y. Tsai, C. H. Chen, C. S. Lin
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 939-945, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73296
https://doi.org/10.1115/IPACK2005-73296
View Paper titled, Novel Test Methods for Die Strength
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Topics: Atomic force microscopy, Design, Electromagnetic scattering, Electronic packaging, Failure, Failure mechanisms, Finite element analysis, Geometry, Grinding, Packaging
Proceedings Papers

Study of Electrical Breakdown Phenomena on Silicon With Micron Separations

P. J. Wang, C. H. Chen
Proc. ASME. IMECE2004, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 289-293, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-59698
https://doi.org/10.1115/IMECE2004-59698
View Paper titled, Study of Electrical Breakdown Phenomena on Silicon With Micron Separations
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Topics: Breakdown (Electricity), Silicon, Insulation, Microelectromechanical systems, Electrodes, Semiconductor wafers, Circuits, Design, Shapes, Silicon-on-insulator
Journal Articles

Test Methods for Silicon Die Strength

M. Y. Tsai, C. H. Chen, C. S. Lin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 419–426.
https://doi.org/10.1115/1.2351907
Published Online: February 6, 2006
View Article titled, Test Methods for Silicon Die Strength
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Topics: Silicon, Stress, Semiconductor wafers, Failure, Surface roughness, Deflection, Finite element analysis
Journal Articles

A Large Biaxial Shear Box for Shaking Table Test on Saturated Sand

T-S Ueng, M-H Wang, M-H Chen, C-H Chen, L-H Peng
Journal: Geotechnical Testing Journal
Publisher: ASTM International
Article Type: Research-Article
Geotech. Test. J.. January 2006, 29(1): 1–8.
https://doi.org/10.1520/GTJ12649
Published Online: January 1, 2006
View Article titled, A Large Biaxial Shear Box for Shaking Table Test on Saturated Sand
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Journal Articles

An Integrated Approach Toward the Dynamic Analysis of High-Speed Spindles: Part 2—Dynamics Under Moving End Load

C. H. Chen, K. W. Wang
Journal: Journal of Vibration and Acoustics
Publisher: ASME
Article Type: Research Papers
J. Vib. Acoust. October 1994, 116(4): 514–522.
https://doi.org/10.1115/1.2930457
Published Online: October 1, 1994
View Article titled, An Integrated Approach Toward the Dynamic Analysis of High-Speed Spindles: Part 2—Dynamics Under Moving End Load
Open the PDF for An Integrated Approach Toward the Dynamic Analysis of High-Speed Spindles: Part 2—Dynamics Under Moving End Load in another window
Topics: Dynamic analysis, Dynamics (Mechanics), Stress, Bearings, Chatter, Equilibrium (Physics), Errors, Iterative methods, Rotors, Stability
Journal Articles

An Integrated Approach Toward the Dynamic Analysis of High-Speed Spindles: Part I—System Model

C. H. Chen, K. W. Wang, Y. C. Shin
Journal: Journal of Vibration and Acoustics
Publisher: ASME
Article Type: Research Papers
J. Vib. Acoust. October 1994, 116(4): 506–513.
https://doi.org/10.1115/1.2930456
Published Online: October 1, 1994
View Article titled, An Integrated Approach Toward the Dynamic Analysis of High-Speed Spindles: Part I—System Model
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Topics: Approximation, Ball bearings, Bearings, Centrifugal force, Dynamic analysis, Dynamics (Mechanics), Machinery, Modeling, Stiffness, Stress
eBook Chapter

Application of the Ronchi Ruling Beam Profiling Method to Axially Symmetric Laser Beams

Series: ASTM Selected Technical Papers
Publisher: ASTM International
Published: 1990
ISBN-10: 0-8031-4478-4
ISBN: 978-0-8031-4478-1
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eBook Chapter

Plasma Etching of Aluminum Alloys in BCL 3 /CL 2 Plasmas

Series: ASTM Selected Technical Papers
Publisher: ASTM International
Published: 1989
ISBN-10: 0-8031-1273-4
ISBN: 978-0-8031-1273-5
Open the PDF for Plasma Etching of Aluminum Alloys in BCL 3 /CL 2 Plasmas in another window
Journal Articles

Fire Plume Along Vertical Surfaces: Effect of Finite-Rate Chemical Reactions

C. H. Chen, J. S. T’ien
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. November 1984, 106(4): 713–720.
https://doi.org/10.1115/1.3246743
Published Online: November 1, 1984
View Article titled, Fire Plume Along Vertical Surfaces: Effect of Finite-Rate Chemical Reactions
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Topics: Chemical reactions, Fire, Plumes (Fluid dynamics), Carbon, Boundary layers, Carbon dioxide, Chemical kinetics, Flames, Fuels, Heat transfer
Journal Articles

On Prediction and Unified Correlation for Decay of Vertical Buoyant Jets

C. J. Chen, C. H. Chen
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. August 1979, 101(3): 532–537.
https://doi.org/10.1115/1.3451023
Published Online: August 1, 1979
View Article titled, On Prediction and Unified Correlation for Decay of Vertical Buoyant Jets
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Topics: Jets, Turbulence, Flow (Dynamics), Kinetic energy, Plumes (Fluid dynamics), Algebra, Density, Energy dissipation, Flux (Metallurgy), Heat
Journal Articles

Rectangular or Square Array Fibrous Composite With Anisotropic or Isotropic Filament

C. H. Chen
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Technical Briefs
J. Appl. Mech. September 1971, 38(3): 710–712.
https://doi.org/10.1115/1.3408881
Published Online: September 1, 1971
View Article titled, Rectangular or Square Array Fibrous Composite With Anisotropic or Isotropic Filament
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Topics: Anisotropy, Fiber reinforced composites
Journal Articles

Mechanical Properties of Anisotropic Fiber-Reinforced Composites

C. H. Chen, Shun Cheng
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Technical Briefs
J. Appl. Mech. March 1970, 37(1): 186–189.
https://doi.org/10.1115/1.3408430
Published Online: March 1, 1970
View Article titled, Mechanical Properties of Anisotropic Fiber-Reinforced Composites
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Topics: Anisotropy, Fiber reinforced composites, Mechanical properties, Composite materials, Fibers, Die cutting, Elastic constants, Elastic moduli, Elasticity, Shearing (Deformation)
Journal Articles

Fiber-Reinforced Composites Under Longitudinal Shear Loading

C. H. Chen
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Technical Briefs
J. Appl. Mech. March 1970, 37(1): 198–201.
https://doi.org/10.1115/1.3408437
Published Online: March 1, 1970
View Article titled, Fiber-Reinforced Composites Under Longitudinal Shear Loading
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Topics: Fiber reinforced composites, Shear (Mechanics)