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Journal Articles

In Memoriam: Raymond Viskanta

Marcus V. A. Bianchi, Theodore L. Bergman, Vijay K. Dhir, Amir Faghri, Andrei G. Fedorov, M. Pinar Mengüç, Abdulmajeed Mohamad, Laurent Pilon, Xiulin Ruan, Tae-Ho Song, Brent W. Webb, Xianfan Xu
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: In Memoriam
J. Heat Mass Transfer. May 2023, 145(5): 050101.
Paper No: HT-23-1141
https://doi.org/10.1115/1.4062261
Published Online: April 11, 2023
View Article titled, In Memoriam: Raymond Viskanta
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Topics: Engineering teachers, Graduate students, Heat transfer, Students
Proceedings Papers

Analysis of Conjugate Heat Transfer in a Three-Dimensional Microchannel Heat Sink for Cooling of Electronic Components

Andrei G. Fedorov, Raymond Viskanta
Proc. ASME. IMECE99, Heat Transfer: Volume 3, 89-98, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-1066
https://doi.org/10.1115/IMECE1999-1066
View Paper titled, Analysis of Conjugate Heat Transfer in a Three-Dimensional Microchannel Heat Sink for Cooling of Electronic Components
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Topics: Cooling, Electronic components, Heat sinks, Heat transfer, Microchannels, Fluids, Design, Electronic packaging, Energy conservation, Flow (Dynamics)
Proceedings Papers

Apparent Radiative Properties and Radiation Scattering by a Semitransparent Hemispherical Shell

Tai-Hsi Fan, Andrei G. Fedorov
Proc. ASME. IMECE2001, Heat Transfer: Volume 4 — Combustion and Energy Systems, 251-258, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24266
https://doi.org/10.1115/IMECE2001/HTD-24266
View Paper titled, Apparent Radiative Properties and Radiation Scattering by a Semitransparent Hemispherical Shell
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Topics: Radiation scattering, Shells, Manufacturing, Foams (Chemistry), Glass melting, Heating, Materials processing, Radiation (Physics), Radiative heat transfer, Ray tracing
Proceedings Papers

Combined Radiation and Conduction in Glass Foams

Mark J. Varady, Andrei G. Fedorov
Proc. ASME. IMECE2001, Heat Transfer: Volume 4 — Combustion and Energy Systems, 235-241, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24264
https://doi.org/10.1115/IMECE2001/HTD-24264
View Paper titled, Combined Radiation and Conduction in Glass Foams
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Topics: Foams (Chemistry), Glass, Heat conduction, Radiation (Physics), Heat transfer, Approximation, Bubbles, Combustion gases, Electromagnetic scattering, Energy conservation
Proceedings Papers

Brazings for Metal-Ceramic Joining in Sodium Thermal Electrochemical Converter (Na-TEC) Devices

Andrey Gunawan, Jong Min Ha, Diane M. England, Alexander Limia, Peter A. Kottke, Andrei G. Fedorov, Seung Woo Lee, Shannon K. Yee
Proc. ASME. ES2018, ASME 2018 12th International Conference on Energy Sustainability, V001T07A008, June 24–28, 2018
Publisher: American Society of Mechanical Engineers
Paper No: ES2018-7517
https://doi.org/10.1115/ES2018-7517
View Paper titled, Brazings for Metal-Ceramic Joining in Sodium Thermal Electrochemical Converter (Na-TEC) Devices
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Topics: Ceramics, Joining, Metals, Sodium, Thermoelectric coolers, Brazing, Alloys, Electrolytes, Pressure, Carbon
Proceedings Papers

Techno-Economic Analysis of Dual-Stage Sodium Thermal Electrochemical Converter (Na-TEC) Power Block for Distributed CSP

Andrey Gunawan, Alexander Limia, Jong Min Ha, Peter A. Kottke, Seung Woo Lee, Andrei G. Fedorov, Shannon K. Yee
Proc. ASME. ES2018, ASME 2018 12th International Conference on Energy Sustainability, V001T11A008, June 24–28, 2018
Publisher: American Society of Mechanical Engineers
Paper No: ES2018-7505
https://doi.org/10.1115/ES2018-7505
View Paper titled, Techno-Economic Analysis of Dual-Stage Sodium Thermal Electrochemical Converter (Na-TEC) Power Block for Distributed CSP
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Topics: Sodium, Thermoelectric coolers, Design, Generators, Manufacturing, Temperature, Cycles, Electrodes, Heat, Heat engines
Journal Articles

Hotspot Thermal Management With Flow Boiling of Refrigerant in Ultrasmall Microgaps

Mohamed H. Nasr, Craig E. Green, Peter A. Kottke, Xuchen Zhang, Thomas E. Sarvey, Yogendra K. Joshi, Muhannad S. Bakir, Andrei G. Fedorov
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011006.
Paper No: EP-16-1097
https://doi.org/10.1115/1.4035387
Published Online: January 5, 2017
View Article titled, Hotspot Thermal Management With Flow Boiling of Refrigerant in Ultrasmall Microgaps
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Topics: Boiling, Flow (Dynamics), Flux (Metallurgy), Heat, Thermal resistance, Heat flux, Wall temperature, Coolants, Pressure drop, Thermal management
Journal Articles

Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications

Xuchen Zhang, Xuefei Han, Thomas E. Sarvey, Craig E. Green, Peter A. Kottke, Andrei G. Fedorov, Yogendra Joshi, Muhannad S. Bakir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010910.
Paper No: EP-15-1107
https://doi.org/10.1115/1.4032496
Published Online: March 10, 2016
View Article titled, Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications
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Topics: Cooling, Design, Fins, Flow (Dynamics), Heat flux, Heat sinks, Heat transfer coefficients, Microfluidics, Temperature, Testing
Proceedings Papers

Performance and Integration Implications of Addressing Localized Hotspots Through Two Approaches: Clustering of Micro Pin-Fins and Dedicated Microgap Coolers

Craig E. Green, Peter A. Kottke, Thomas E. Sarvey, Andrei G. Fedorov, Yogendra Joshi, Muhannad S. Bakir
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A056, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48537
https://doi.org/10.1115/IPACK2015-48537
View Paper titled, Performance and Integration Implications of Addressing Localized Hotspots Through Two Approaches: Clustering of Micro Pin-Fins and Dedicated Microgap Coolers
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Topics: Coolers, Fins, Computer simulation, Cooling, Density, Flow (Dynamics), Flux (Metallurgy), Heat, Coolants, Design
Proceedings Papers

3D IC With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications

Xuchen Zhang, Xuefei Han, Thomas E. Sarvey, Craig E. Green, Peter A. Kottke, Andrei G. Fedorov, Yogendra Joshi, Muhannad S. Bakir
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A008, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48584
https://doi.org/10.1115/IPACK2015-48584
View Paper titled, 3D IC With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications
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Topics: Cooling, Microfluidics, Heat sinks, Atmospheric pressure, Coolants, Heat flux, Heat transfer coefficients, Pressure drop, Silicon, Testing
Journal Articles

Two-Phase Convective Cooling for Ultrahigh Power Dissipation in Microprocessors

Peter A. Kottke, Thomas M. Yun, Craig E. Green, Yogendra K. Joshi, Andrei G. Fedorov
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. January 2016, 138(1): 011501.
Paper No: HT-15-1103
https://doi.org/10.1115/1.4031111
Published Online: August 11, 2015
View Article titled, Two-Phase Convective Cooling for Ultrahigh Power Dissipation in Microprocessors
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Topics: Coolants, Cooling, Energy dissipation, Friction, Heat, Heat transfer, Pressure, Pressure drop, Temperature, Vapors
Journal Articles

Transient Characterization of Hybrid Microfluidic-Thermoelectric Cooling Scheme for Dynamic Thermal Management of Microprocessor

Vivek Sahu, Andrei G. Fedorov, Yogendra K. Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031014.
Paper No: EP-13-1105
https://doi.org/10.1115/1.4027901
Published Online: July 15, 2014
View Article titled, Transient Characterization of Hybrid Microfluidic-Thermoelectric Cooling Scheme for Dynamic Thermal Management of Microprocessor
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Topics: Cooling, Superlattices, Temperature, Transients (Dynamics), Microchannels
Proceedings Papers

Shape Characterization for Droplet Impingement Dynamics in Ink-Jet Deposition

Wenchao Zhou, Drew Loney, Andrei G. Fedorov, F. Levent Degertekin, David W. Rosen
Proc. ASME. IDETC-CIE2012, Volume 2: 32nd Computers and Information in Engineering Conference, Parts A and B, 1313-1319, August 12–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: DETC2012-71026
https://doi.org/10.1115/DETC2012-71026
View Paper titled, Shape Characterization for Droplet Impingement Dynamics in Ink-Jet Deposition
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Topics: Drops, Dynamics (Mechanics), Inks, Shapes
Journal Articles

Absorption Heat Pump/Refrigeration System Utilizing Ionic Liquid and Hydrofluorocarbon Refrigerants

Sarah Kim, Yoon Jo Kim, Yogendra K. Joshi, Andrei G. Fedorov, Paul A. Kohl
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2012, 134(3): 031009.
https://doi.org/10.1115/1.4007111
Published Online: July 23, 2012
View Article titled, Absorption Heat Pump/Refrigeration System Utilizing Ionic Liquid and Hydrofluorocarbon Refrigerants
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Topics: Absorption, Fluids, Heat pumps, Refrigerants, Refrigeration, Temperature, Pressure, Cooling, Heat
Proceedings Papers

Waste-Heat Driven Miniature Absorption Refrigeration System Using Ionic-Liquid as a Working Fluid

Yoon Jo Kim, Sarah Kim, Yogendra K. Joshi, Andrei G. Fedorov, Paul A. Kohl
Proc. ASME. ES2011, ASME 2011 5th International Conference on Energy Sustainability, Parts A, B, and C, 1299-1305, August 7–10, 2011
Publisher: American Society of Mechanical Engineers
Paper No: ES2011-54217
https://doi.org/10.1115/ES2011-54217
View Paper titled, Waste-Heat Driven Miniature Absorption Refrigeration System Using Ionic-Liquid as a Working Fluid
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Topics: Absorption, Fluids, Refrigeration, Waste heat, Temperature, Refrigerants, Water, Computer cooling, Condensers (steam plant), Crystallization
Proceedings Papers

Gas Assisted Thin-Film Evaporation for Hotspot Thermal Management

Shankar Narayanan, Andrei G. Fedorov, Yogendra K. Joshi
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 671-674, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-23015
https://doi.org/10.1115/IHTC14-23015
View Paper titled, Gas Assisted Thin-Film Evaporation for Hotspot Thermal Management
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Topics: Evaporation, Flux (Metallurgy), Heat, Thermal management, Thin films
Proceedings Papers

Hybrid Superlattice Coolers for Dynamic Thermal Management of Microprocessor Hotspots

Vivek Sahu, Yogendra K. Joshi, Andrei G. Fedorov
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 681-687, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-23054
https://doi.org/10.1115/IHTC14-23054
View Paper titled, Hybrid Superlattice Coolers for Dynamic Thermal Management of Microprocessor Hotspots
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Topics: Coolers, Heat sinks, Microchannels, Superlattices, Thermal management
Proceedings Papers

Scaling Analysis of Performance Trade-Offs in Electronics Cooling

Craig E. Green, Andrei G. Fedorov, Yogendra K. Joshi
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1047-1056, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89389
https://doi.org/10.1115/InterPACK2009-89389
View Paper titled, Scaling Analysis of Performance Trade-Offs in Electronics Cooling
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Topics: Computer cooling, Tradeoffs, Cooling, Scaling laws (Mathematical physics), Coolants, Fluids, Geometry, Heat sinks, Heat transfer, Internal flow
Proceedings Papers

Thermal Characterization of Interlayer Microfluidic Cooling of Three-Dimensional IC With Non-Uniform Heat Flux

Yoon Jo Kim, Yogendra K. Joshi, Andrei G. Fedorov, Young-Joon Lee, Sung Kyu Lim
Proc. ASME. ICNMM2009, ASME 2009 7th International Conference on Nanochannels, Microchannels and Minichannels, 1249-1258, June 22–24, 2009
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2009-82133
https://doi.org/10.1115/ICNMM2009-82133
View Paper titled, Thermal Characterization of Interlayer Microfluidic Cooling of Three-Dimensional IC With Non-Uniform Heat Flux
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Topics: Cooling, Heat flux, Microfluidics, Thermal characterization, Refrigerants, Thermal management, Flow (Dynamics), Fluids, Geometry, Heat transfer coefficients
Journal Articles

Micromachined Ultrasonic Print-Head for Deposition of High-Viscosity Materials

J. Mark Meacham, Amanda O’Rourke, Yong Yang, Andrei G. Fedorov, F. Levent Degertekin, David W. Rosen
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Special Issue On Nanomanufacturing
J. Manuf. Sci. Eng. June 2010, 132(3): 030905.
https://doi.org/10.1115/1.4001551
Published Online: May 19, 2010
View Article titled, Micromachined Ultrasonic Print-Head for Deposition of High-Viscosity Materials
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Topics: Fluids, Manganese (Metal), Manufacturing, Micromachining, Nozzles, Photopolymers, Piezoelectric transducers, Printing, Resins, Surface tension