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Proceedings Papers

Electronic Conduction Mechanism in Van Der Waals Flake Thin Film

Ajit K. Roy, Jonghoon Lee, Dhriti Nepal, John Ferguson
Proc. ASME. SSDM2023, ASME 2023 Aerospace Structures, Structural Dynamics, and Materials Conference, V001T03A019, June 19–21, 2023
Publisher: American Society of Mechanical Engineers
Paper No: SSDM2023-108595
https://doi.org/10.1115/SSDM2023-108595
View Paper titled, Electronic Conduction Mechanism in Van Der Waals Flake Thin Film
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Topics: Distributed power generation, Graphene, Heat conduction, Thin films
Proceedings Papers

In Situ Damage and Failure Observation in Model Carbon-Carbon Laminates Containing Planar Yarn Crimping

Ajit K. Roy, David P. Anderson
Proc. ASME. IMECE96, Aerospace, 15-18, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0604
https://doi.org/10.1115/IMECE1996-0604
View Paper titled, In Situ Damage and Failure Observation in Model Carbon-Carbon Laminates Containing Planar Yarn Crimping
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Topics: Carbon, Damage, Failure, Laminates, Yarns, Composite materials, Stress, Failure mechanisms, Fibers, High temperature
Proceedings Papers

Prediction of Stiffness and Strength of Plain Weave Composites by Mixed Finite Element Method

Sangwook Sihn, Ajit K. Roy
Proc. ASME. IMECE2000, Aerospace, 9-14, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-2149
https://doi.org/10.1115/IMECE2000-2149
View Paper titled, Prediction of Stiffness and Strength of Plain Weave Composites by Mixed Finite Element Method
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Topics: Composite materials, Finite element methods, Stiffness, Computer simulation, Damage, Elastic moduli, Failure, Failure analysis, Stress, Stress analysis (Engineering)
Journal Articles

Improved Flow Rate in Electro-Osmotic Micropumps for Combinations of Substrates and Different Liquids With and Without Nanoparticles

Marwan F. Al-Rjoub, Ajit K. Roy, Sabyasachi Ganguli, Rupak K. Banerjee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021001.
Paper No: EP-14-1059
https://doi.org/10.1115/1.4028746
Published Online: June 1, 2015
View Article titled, Improved Flow Rate in Electro-Osmotic Micropumps for Combinations of Substrates and Different Liquids With and Without Nanoparticles
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Topics: Electroosmosis, Flow (Dynamics), Microchannels, Micropumps, Plasma desorption mass spectrometry
Proceedings Papers

Heat Transfer at Aluminum-Water Interfaces: Effect of Surface Roughness

H. Sam Huang, Jennifer L. Wohlwend, Vikas Varshney, Ajit K. Roy
Proc. ASME. IMECE2012, Volume 7: Fluids and Heat Transfer, Parts A, B, C, and D, 1695-1702, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-87584
https://doi.org/10.1115/IMECE2012-87584
View Paper titled, Heat Transfer at Aluminum-Water Interfaces: Effect of Surface Roughness
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Topics: Aluminum, Finite element methods, Heat transfer, Molecular dynamics, Surface roughness, Water
Proceedings Papers

Enhanced Electro-Osmotic Flow Pump for Micro-Scale Heat Exchangers

Marwan F. Al-Rjoub, Ajit K. Roy, Sabyasachi Ganguli, Rupak K. Banerjee
Proc. ASME. MNHMT2012, ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer, 829-833, March 3–6, 2012
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2012-75026
https://doi.org/10.1115/MNHMT2012-75026
View Paper titled, Enhanced Electro-Osmotic Flow Pump for Micro-Scale Heat Exchangers
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Topics: Electroosmosis, Heat exchangers, Microscale devices, Pumps, Silicon, Design, Manufacturing, Micropumps, Water, Microchannels
Journal Articles

Heat Transfer at Aluminum–Water Interfaces: Effect of Surface Roughness

H. Sam Huang, Vikas Varshney, Jennifer L. Wohlwend, Ajit K. Roy
Journal: Journal of Nanotechnology in Engineering and Medicine
Publisher: ASME
Article Type: Research-Article
J. Nanotechnol. Eng. Med. August 2012, 3(3): 031008.
Paper No: NANO-12-1064
https://doi.org/10.1115/1.4007584
Published Online: January 18, 2013
View Article titled, Heat Transfer at Aluminum–Water Interfaces: Effect of Surface Roughness
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Topics: Aluminum, Heat transfer, Surface roughness, Water, Electrical conductance, Thermal conductivity, Mesoscopic systems
Proceedings Papers

Atomistic Scale Thermal Transport in Amorphous Materials and Its Interfaces

Ajit K. Roy, V. Varshney, S. Ganguli, S. Sihn, J. Lee, B. Farmer
Proc. ASME. AJTEC2011, ASME/JSME 2011 8th Thermal Engineering Joint Conference, T30065, March 13–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: AJTEC2011-44656
https://doi.org/10.1115/AJTEC2011-44656
View Paper titled, Atomistic Scale Thermal Transport in Amorphous Materials and Its Interfaces
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Topics: Amorphous materials, Polymers, Heat, US Department of Defense, Adhesives, Aircraft, Carbon nanotubes, Composite materials, Design, Electronics
Journal Articles

Temperature and Load Ratio Effects on Crack-Growth Behavior of Austenitic Superalloys

Ajit K. Roy, Joydeep Pal, Muhammad H. Hasan
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Research Papers
J. Eng. Mater. Technol. January 2010, 132(1): 011001.
https://doi.org/10.1115/1.3184027
Published Online: November 2, 2009
View Article titled, Temperature and Load Ratio Effects on Crack-Growth Behavior of Austenitic Superalloys
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Topics: Alloys, Fracture (Materials), Stress, Superalloys, Temperature, Fatigue
Proceedings Papers

Cracking of Alloy C-276 in an Acidic Environment

Joydeep Pal, Chandan Mukhopadhyay, Ajit K. Roy
Proc. ASME. PVP2007, Volume 6: Materials and Fabrication, 385-389, July 22–26, 2007
Publisher: American Society of Mechanical Engineers
Paper No: PVP2007-26429
https://doi.org/10.1115/PVP2007-26429
View Paper titled, Cracking of Alloy C-276 in an Acidic Environment
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Topics: Alloys, Fracture (Process), Stress
Proceedings Papers

Tensile Deformation of Alloy-22 at Ambient and Elevated Temperatures

Rama S. Koripelli, Ajit K. Roy
Proc. ASME. PVP2007, Volume 6: Materials and Fabrication, 391-394, July 22–26, 2007
Publisher: American Society of Mechanical Engineers
Paper No: PVP2007-26464
https://doi.org/10.1115/PVP2007-26464
View Paper titled, Tensile Deformation of Alloy-22 at Ambient and Elevated Temperatures
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Topics: Alloys, Temperature, Tensile deformation, Tensile strength
Proceedings Papers

The Evaluation of the Cracking Susceptibility of Alloy 718 in an Acidic Solution

Anand Venkatesh, Ajit K. Roy
Proc. ASME. PVP2007, Volume 6: Materials and Fabrication, 401-404, July 22–26, 2007
Publisher: American Society of Mechanical Engineers
Paper No: PVP2007-26493
https://doi.org/10.1115/PVP2007-26493
View Paper titled, The Evaluation of the Cracking Susceptibility of Alloy 718 in an Acidic Solution
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Topics: Alloys, Corrosion, Fracture (Process)
Proceedings Papers

Thermally Conductive Epoxy Nanocomposites

Sabyasachi Ganguli, Ajit K. Roy, David Anderson, Josh Wong
Proc. ASME. IMECE2007, Volume 11: Micro and Nano Systems, Parts A and B, 1143-1153, November 11–15, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2007-43347
https://doi.org/10.1115/IMECE2007-43347
View Paper titled, Thermally Conductive Epoxy Nanocomposites
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Topics: Epoxy adhesives, Epoxy resins, Nanocomposites, Thermal conductivity, Composite materials, Fillers (Materials), Graphite, Polymers, Aerospace industry, Fibers
Proceedings Papers

The Effect of Environmental and Mechanical Variables on Stress Corrosion Cracking of a Martensitic Stainless Steel for Transmutation Applications

Ramprashad Prabhakaran, Ajit K. Roy
Proc. ASME. ICONE12, 12th International Conference on Nuclear Engineering, Volume 1, 773-781, April 25–29, 2004
Publisher: American Society of Mechanical Engineers
Paper No: ICONE12-49399
https://doi.org/10.1115/ICONE12-49399
View Paper titled, The Effect of Environmental and Mechanical Variables on Stress Corrosion Cracking of a Martensitic Stainless Steel for Transmutation Applications
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Topics: Corrosion, Stainless steel, Stress corrosion cracking
Proceedings Papers

Mechanical Properties and Cracking Behavior of High-Temperature Heat-Exchanger Materials

Ajit K. Roy, Lalit Savalia, Narendra Kothapalli, Raghunandan Karamcheti
Proc. ASME. PVP2005, Volume 6: Materials and Fabrication, 709-715, July 17–21, 2005
Publisher: American Society of Mechanical Engineers
Paper No: PVP2005-71781
https://doi.org/10.1115/PVP2005-71781
View Paper titled, Mechanical Properties and Cracking Behavior of High-Temperature Heat-Exchanger Materials
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Topics: Alloys, Cracking (Materials), Fracture (Process), Heat exchangers, High temperature, Mechanical properties, Stress corrosion cracking
Proceedings Papers

Characterization of Residual Stresses in Structural Materials for Nuclear Applications

Ajit K. Roy, Subhra Bandyopadhyay, Silpa Budugur Suresh, Douglas Wells
Proc. ASME. PVP2005, Volume 5: High Pressure Technology, Nondestructive Evaluation, Pipeline Systems, Student Paper Competition, 113-118, July 17–21, 2005
Publisher: American Society of Mechanical Engineers
Paper No: PVP2005-71490
https://doi.org/10.1115/PVP2005-71490
View Paper titled, Characterization of Residual Stresses in Structural Materials for Nuclear Applications
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Topics: Positron annihilation, Residual stresses, Transmission electron microscopy
eBook Chapter

Residual Stress Measurements in Welded and Plastically Deformed Target Structural Materials

Series: ASTM Selected Technical Papers
Publisher: ASTM International
Published: 2007
ISBN-10: 0-8031-4472-5
ISBN: 978-0-8031-4472-9
Open the PDF for Residual Stress Measurements in Welded and Plastically Deformed Target Structural Materials in another window
eBook Chapter

The Role of Applied Potential on Environment-Assisted Cracking of Zirconium Alloys

Series: ASTM Selected Technical Papers
Publisher: ASTM International
Published: 2007
ISBN-10: 0-8031-3406-1
ISBN: 978-0-8031-3406-5
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Journal Articles

Effect of Carbonization Heating Rate, Microstructure, and Lay-Up on the Interlaminar Tensile Properties of a Two-Dimensional Carbon-Carbon Composite

Ajit K. Roy, David P. Anderson
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Technical Papers
J. Eng. Mater. Technol. April 1996, 118(2): 241–246.
https://doi.org/10.1115/1.2804895
Published Online: April 1, 1996
View Article titled, Effect of Carbonization Heating Rate, Microstructure, and Lay-Up on the Interlaminar Tensile Properties of a Two-Dimensional Carbon-Carbon Composite
Open the PDF for Effect of Carbonization Heating Rate, Microstructure, and Lay-Up on the Interlaminar Tensile Properties of a Two-Dimensional Carbon-Carbon Composite in another window
Topics: Carbon, Composite materials, Heating, Tensile strength, Laminates, Warping, Lamination, Packing (Shipments), Packings (Cushioning), Porosity
Journal Articles

Three-Dimensional Effective Moduli of Orthotropic and Symmetric Laminates

Ajit K. Roy, Stephen W. Tsai
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. March 1992, 59(1): 39–47.
https://doi.org/10.1115/1.2899462
Published Online: March 1, 1992
View Article titled, Three-Dimensional Effective Moduli of Orthotropic and Symmetric Laminates
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Topics: Laminates, Stiffness, Composite materials, Shear (Mechanics), Boundary-value problems, Deformation, Displacement, Stress