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Journal Articles

Effect of Zinc Content on the Microstructure, Thermal Behavior, and Static Mechanical Properties of Sn-xZn Alloys Containing Mixed Trace Rare Earth Elements

Shih-Ying Chang, An-Bang Wu, Jun-Yen Lee, Yan-Hua Huang

Publisher: ASME

J. Eng. Mater. Technol. April 2020, 142(2): 024502.

Paper No: MATS-19-1010

https://doi.org/10.1115/1.4045433

Published Online: December 5, 2019

View Article titled, Effect of Zinc Content on the Microstructure, Thermal Behavior, and Static Mechanical Properties of Sn-xZn Alloys Containing Mixed Trace Rare Earth Elements

Topics: Alloys, Mechanical properties, Tin, Temperature, Tensile strength

Journal Articles

Importance of Bonding Atmosphere for Mechanical Reliability of Reactively Bonded Solder Joints

Shugo Miyake, Kohei Ohtani, Shozo Inoue, Takahiro Namazu

Publisher: ASME

J. Eng. Mater. Technol. January 2016, 138(1): 011006.

Paper No: MATS-15-1128

https://doi.org/10.1115/1.4032020

Published Online: December 8, 2015

View Article titled, Importance of Bonding Atmosphere for Mechanical Reliability of Reactively Bonded Solder Joints

Topics: Bonding, Fracture (Materials), Fracture (Process), Fracture toughness, Pressure, Reliability, Solder joints, Solders, Stress, Vacuum

Journal Articles

Notch Effect on Low Cycle Fatigue of Sn–3.5Ag Solder

Mineo Nozaki, Masao Sakane, Yutaka Tsukada

Publisher: ASME

J. Eng. Mater. Technol. January 2008, 130(1): 011001.

https://doi.org/10.1115/1.2806237

Published Online: December 20, 2007

View Article titled, Notch Effect on Low Cycle Fatigue of Sn–3.5Ag Solder

Topics: Crack propagation, Cycles, Failure, Fracture (Materials), Low cycle fatigue, Solders, Tin, Stress concentration, Stress, Finite element analysis

Journal Articles

Creep-Fatigue Life Evaluation for Sn - 3.5 Ag Solder

Mineo Nozaki, Masao Sakane, Yutaka Tsukada, Hideo Nishimura

Publisher: ASME

J. Eng. Mater. Technol. April 2006, 128(2): 142–150.

https://doi.org/10.1115/1.2172273

Published Online: May 11, 2005

View Article titled, Creep-Fatigue Life Evaluation for Sn - 3.5 Ag Solder

Topics: Creep, Fatigue, Solders, Tin, Waves

Journal Articles

Creep Behavior and Deformation Mechanism Map of Sn-Pb Eutectic Solder Alloy

X. Q. Shi, Z. P. Wang, Q. J. Yang, H. L. J. Pang

Publisher: ASME

J. Eng. Mater. Technol. January 2003, 125(1): 81–88.

https://doi.org/10.1115/1.1525254

Published Online: December 31, 2002

View Article titled, Creep Behavior and Deformation Mechanism Map of Sn-Pb Eutectic Solder Alloy

Topics: Creep, Solders, Temperature, Dislocations, Stress, Alloys, Diffusion (Physics), Tin

Journal Articles

Optimum Forming Loading Paths for Pb-Sn Superplastic Sheet Materials

Marwan K. Khraisheh, Hussein M. Zbib

Publisher: ASME

J. Eng. Mater. Technol. July 1999, 121(3): 341–345.

https://doi.org/10.1115/1.2812384

Published Online: July 1, 1999

View Article titled, Optimum Forming Loading Paths for Pb-Sn Superplastic Sheet Materials

Topics: Sheet materials, Superplasticity, Tin, Pressure, Deformation, Failure, Hardening

Journal Articles

An Investigation of Yield Potentials In Superplastic Deformation

Marwan K. Khraisheh

Publisher: ASME

J. Eng. Mater. Technol. January 2000, 122(1): 93–97.

https://doi.org/10.1115/1.482771

Published Online: May 14, 1999

View Article titled, An Investigation of Yield Potentials In Superplastic Deformation

Topics: Alloys, Anisotropy, Deformation, Superplasticity, Tension, Torsion, Tin, Stress, Flow (Dynamics)

Journal Articles

On the Constitutive Response of 63/37 Sn/Pb Eutectic Solder

A. F. Skipor, S. V. Harren, J. Botsis

Publisher: ASME

J. Eng. Mater. Technol. January 1996, 118(1): 1–11.

https://doi.org/10.1115/1.2805929

Published Online: January 1, 1996

View Article titled, On the Constitutive Response of 63/37 Sn/Pb Eutectic Solder

Topics: Solders, Tin, Stress, Creep, Temperature, Electronic packaging, Finite element analysis, Temperature effects, Tension, Viscoplasticity

Journal Articles

A Visco-Plastic Constitutive Model for 60/40 Tin-Lead Solder Used in IC Package Joints

E. P. Busso, M. Kitano, T. Kumazawa

Publisher: ASME

J. Eng. Mater. Technol. July 1992, 114(3): 331–337.

https://doi.org/10.1115/1.2904181

Published Online: July 1, 1992

View Article titled, A Visco-Plastic Constitutive Model for 60/40 Tin-Lead Solder Used in IC Package Joints

Topics: Constitutive equations, Solders, Deformation, Hardening, Steady state, Stress, Continuum mechanics, Creep, Finite element analysis, Lead alloys

Journal Articles

Progress in the Design of an Improved High-Temperature 1 Percent CrMoV Rotor Steel

R. L. Bodnar, J. R. Michael, S. S. Hansen, R. I. Jaffee

Publisher: ASME

J. Eng. Mater. Technol. January 1990, 112(1): 99–115.

https://doi.org/10.1115/1.2903194

Published Online: January 1, 1990

View Article titled, Progress in the Design of an Improved High-Temperature 1 Percent CrMoV Rotor Steel

Topics: Design, High temperature, Rotors, Steel, Creep, Temperature, Rupture, Fracture toughness, Ductility, Tensile strength

Journal Articles

The Effects of Composition and Microstructure on Temper Embrittlement in 2 1/4 Cr-1 Mo Steel

J. C. Murza, C. J. McMahon, Jr.

Publisher: ASME

J. Eng. Mater. Technol. October 1980, 102(4): 369–375.

https://doi.org/10.1115/1.3224826

Published Online: October 1, 1980

View Article titled, The Effects of Composition and Microstructure on Temper Embrittlement in 2 1/4 Cr-1 Mo Steel

Topics: Embrittlement, Steel, Augers, Cooling, Grain size, Martensitic steel, Phase transition temperature, Scanning electron microscopy, Tin

Journal Articles

Deformation Modeling Applied to Stress Relaxation of Four Solder Alloys

R. W. Rohde, J. C. Swearengen

Publisher: ASME

J. Eng. Mater. Technol. April 1980, 102(2): 207–214.

https://doi.org/10.1115/1.3224799

Published Online: April 1, 1980

View Article titled, Deformation Modeling Applied to Stress Relaxation of Four Solder Alloys

Topics: Alloys, Deformation, Modeling, Relaxation (Physics), Solders, Stress, Tin, Aluminum, Dislocations, Stainless steel

Journal Articles

Stress Relaxation in the Sn-Pb Eutectic Alloy

G. S. Murty, U. P. Singh, N. G. R. Iyengar

Publisher: ASME

J. Eng. Mater. Technol. April 1975, 97(2): 187–188.

https://doi.org/10.1115/1.3443280

Published Online: April 1, 1975

View Article titled, Stress Relaxation in the Sn-Pb Eutectic Alloy

Topics: Eutectic alloys, Relaxation (Physics), Stress, Tin

Journal citation

NARROW

Effect of Zinc Content on the Microstructure, Thermal Behavior, and Static Mechanical Properties of Sn-xZn Alloys Containing Mixed Trace Rare Earth Elements

Importance of Bonding Atmosphere for Mechanical Reliability of Reactively Bonded Solder Joints

Notch Effect on Low Cycle Fatigue of Sn–3.5Ag Solder

Creep-Fatigue Life Evaluation for Sn - 3.5 Ag Solder

Creep Behavior and Deformation Mechanism Map of Sn-Pb Eutectic Solder Alloy

Optimum Forming Loading Paths for Pb-Sn Superplastic Sheet Materials

An Investigation of Yield Potentials In Superplastic Deformation

On the Constitutive Response of 63/37 Sn/Pb Eutectic Solder

A Visco-Plastic Constitutive Model for 60/40 Tin-Lead Solder Used in IC Package Joints

Progress in the Design of an Improved High-Temperature 1 Percent CrMoV Rotor Steel

The Effects of Composition and Microstructure on Temper Embrittlement in 2 1/4 Cr-1 Mo Steel

Deformation Modeling Applied to Stress Relaxation of Four Solder Alloys

Stress Relaxation in the Sn-Pb Eutectic Alloy

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