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Journal Articles

Importance of Bonding Atmosphere for Mechanical Reliability of Reactively Bonded Solder Joints

Shugo Miyake, Kohei Ohtani, Shozo Inoue, Takahiro Namazu
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Research-Article
J. Eng. Mater. Technol. January 2016, 138(1): 011006.
Paper No: MATS-15-1128
https://doi.org/10.1115/1.4032020
Published Online: December 8, 2015
View Article titled, Importance of Bonding Atmosphere for Mechanical Reliability of Reactively Bonded Solder Joints
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Topics: Bonding, Fracture (Materials), Fracture (Process), Fracture toughness, Pressure, Reliability, Solder joints, Solders, Stress, Vacuum
Journal Articles

Influences of Exothermic Reactive Layer and Metal Interlayer on Fracture Behavior of Reactively Bonded Solder Joints

Takahiro Namazu, Kohei Ohtani, Shozo Inoue, Shugo Miyake
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Research-Article
J. Eng. Mater. Technol. July 2015, 137(3): 031011.
Paper No: MATS-14-1250
https://doi.org/10.1115/1.4030413
Published Online: July 1, 2015
View Article titled, Influences of Exothermic Reactive Layer and Metal Interlayer on Fracture Behavior of Reactively Bonded Solder Joints
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Topics: Fracture (Materials), Fracture (Process), Metals, Solder joints, Solders, Stress, Bonding, Pressure
Journal Articles

Notch Effect on Low Cycle Fatigue of Sn–3.5Ag Solder

Mineo Nozaki, Masao Sakane, Yutaka Tsukada
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Research Papers
J. Eng. Mater. Technol. January 2008, 130(1): 011001.
https://doi.org/10.1115/1.2806237
Published Online: December 20, 2007
View Article titled, Notch Effect on Low Cycle Fatigue of Sn–3.5Ag Solder
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Topics: Crack propagation, Cycles, Failure, Fracture (Materials), Low cycle fatigue, Solders, Tin, Stress concentration, Stress, Finite element analysis
Journal Articles

Crack Initiation and Growth in Solder Joints Under Cyclic Shear Deformation Using Piezomechanical Actuation

Dong-Jin Shim, S. Mark Spearing, Qingda Yang
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Technical Papers
J. Eng. Mater. Technol. January 2007, 129(1): 19–28.
https://doi.org/10.1115/1.2400257
Published Online: December 6, 2005
View Article titled, Crack Initiation and Growth in Solder Joints Under Cyclic Shear Deformation Using Piezomechanical Actuation
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Topics: Fracture (Materials), Piezoelectric ceramics, Shear (Mechanics), Solder joints, Solders, Shear deformation, Plates (structures)
Journal Articles

Creep-Fatigue Life Evaluation for Sn - 3.5 Ag Solder

Mineo Nozaki, Masao Sakane, Yutaka Tsukada, Hideo Nishimura
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Research Papers
J. Eng. Mater. Technol. April 2006, 128(2): 142–150.
https://doi.org/10.1115/1.2172273
Published Online: May 11, 2005
View Article titled, Creep-Fatigue Life Evaluation for Sn - 3.5 Ag Solder
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Topics: Creep, Fatigue, Solders, Tin, Waves
Journal Articles

Creep Behavior and Deformation Mechanism Map of Sn-Pb Eutectic Solder Alloy

X. Q. Shi, Z. P. Wang, Q. J. Yang, H. L. J. Pang
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Technical Papers
J. Eng. Mater. Technol. January 2003, 125(1): 81–88.
https://doi.org/10.1115/1.1525254
Published Online: December 31, 2002
View Article titled, Creep Behavior and Deformation Mechanism Map of Sn-Pb Eutectic Solder Alloy
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Topics: Creep, Solders, Temperature, Dislocations, Stress, Alloys, Diffusion (Physics), Tin
Journal Articles

On the Constitutive Response of 63/37 Sn/Pb Eutectic Solder

A. F. Skipor, S. V. Harren, J. Botsis
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Technical Papers
J. Eng. Mater. Technol. January 1996, 118(1): 1–11.
https://doi.org/10.1115/1.2805929
Published Online: January 1, 1996
View Article titled, On the Constitutive Response of 63/37 Sn/Pb Eutectic Solder
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Topics: Solders, Tin, Stress, Creep, Temperature, Electronic packaging, Finite element analysis, Temperature effects, Tension, Viscoplasticity
Journal Articles

Quantitative Comparison Between Precision Closed-Die Forging-Force Data and Computer Simulations

J. N. Majerus, K. P. Jen, H. Gong
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Research Papers
J. Eng. Mater. Technol. October 1992, 114(4): 465–471.
https://doi.org/10.1115/1.2904200
Published Online: October 1, 1992
View Article titled, Quantitative Comparison Between Precision Closed-Die Forging-Force Data and Computer Simulations
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Topics: Computer simulation, Forging, Engineering simulation, Simulation, Computers, Displacement, Finite element methods, Finite element model, Elasticity, Forgings (Products)
Journal Articles

A Visco-Plastic Constitutive Model for 60/40 Tin-Lead Solder Used in IC Package Joints

E. P. Busso, M. Kitano, T. Kumazawa
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Research Papers
J. Eng. Mater. Technol. July 1992, 114(3): 331–337.
https://doi.org/10.1115/1.2904181
Published Online: July 1, 1992
View Article titled, A Visco-Plastic Constitutive Model for 60/40 Tin-Lead Solder Used in IC Package Joints
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Topics: Constitutive equations, Solders, Deformation, Hardening, Steady state, Stress, Continuum mechanics, Creep, Finite element analysis, Lead alloys
Journal Articles

Stress-Strain Equations for Some Near-Eutectic Tin-Lead Solders

K. P. Jen, J. N. Majerus
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Research Papers
J. Eng. Mater. Technol. October 1991, 113(4): 475–484.
https://doi.org/10.1115/1.2904128
Published Online: October 1, 1991
View Article titled, Stress-Strain Equations for Some Near-Eutectic Tin-Lead Solders
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Topics: Solders, Stress, Errors, Compression, Elasticity, Eutectic alloys, Event history analysis, Mechanical properties, Microhardness, Printed circuit boards
Journal Articles

Deformation Modeling Applied to Stress Relaxation of Four Solder Alloys

R. W. Rohde, J. C. Swearengen
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Research Papers
J. Eng. Mater. Technol. April 1980, 102(2): 207–214.
https://doi.org/10.1115/1.3224799
Published Online: April 1, 1980
View Article titled, Deformation Modeling Applied to Stress Relaxation of Four Solder Alloys
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Topics: Alloys, Deformation, Modeling, Relaxation (Physics), Solders, Stress, Tin, Aluminum, Dislocations, Stainless steel