With the rapid emerging of two-dimensional (2D) micro/nanomaterials and their applications in flexible electronics and microfabrication, adhesion between thin film and varying substrates is of great significance for fabrication and performance of micro devices and for the understanding of the buckle delamination mechanics. However, the adhesion energy remains to be difficult to be measured, especially for compliant substrates. We propose a simple methodology to deduce the adhesion energy between a thin film and soft substrate based on the successive or simultaneous emergence of wrinkles and delamination. The new metrology does not explicitly require the knowledge of the Young's modulus, Poisson's ratio, and thickness of the 2D material, the accurate measurement of which could be a challenge in many cases. Therefore, the uncertainty of the results of the current method is notably reduced. Besides, for cases where the delamination width is close to the critical wrinkle wavelength of the thin film/substrate system, the procedure can be further simplified. The simple and experimentally easy methodology developed here is promising for determining/estimating the interface adhesion energy of a variety of thin film/soft substrate systems.
Skip Nav Destination
Article navigation
April 2017
Research-Article
Delamination-Based Measurement and Prediction of the Adhesion Energy of Thin Film/Substrate Interfaces
Liangliang Zhu,
Liangliang Zhu
International Center for Applied Mechanics
State Key Laboratory for Strength and
Vibration of Mechanical Structures,
International Center for Applied Mechanics,
School of Aerospace,
Xi'an Jiaotong University,
No. 28, Xianning West Road,
Xi'an, Shaanxi 710049, China;
State Key Laboratory for Strength and
Vibration of Mechanical Structures,
International Center for Applied Mechanics,
School of Aerospace,
Xi'an Jiaotong University,
No. 28, Xianning West Road,
Xi'an, Shaanxi 710049, China;
Columbia Nanomechanics Research Center
Department of Earth and
Environmental Engineering,
Columbia University,
500 West 120th Street,
New York, NY 10027
e-mail: zhu.liangliang@stu.xjtu.edu.cn
Department of Earth and
Environmental Engineering,
Columbia University,
500 West 120th Street,
New York, NY 10027
e-mail: zhu.liangliang@stu.xjtu.edu.cn
Search for other works by this author on:
Xi Chen
Xi Chen
Fellow ASME
Columbia Nanomechanics Research Center,
Department of Earth and
Environmental Engineering,
Columbia University,
500 West 120th Street,
New York, NY 10027
e-mail: xichen@columbia.edu
Columbia Nanomechanics Research Center,
Department of Earth and
Environmental Engineering,
Columbia University,
500 West 120th Street,
New York, NY 10027
e-mail: xichen@columbia.edu
Search for other works by this author on:
Liangliang Zhu
International Center for Applied Mechanics
State Key Laboratory for Strength and
Vibration of Mechanical Structures,
International Center for Applied Mechanics,
School of Aerospace,
Xi'an Jiaotong University,
No. 28, Xianning West Road,
Xi'an, Shaanxi 710049, China;
State Key Laboratory for Strength and
Vibration of Mechanical Structures,
International Center for Applied Mechanics,
School of Aerospace,
Xi'an Jiaotong University,
No. 28, Xianning West Road,
Xi'an, Shaanxi 710049, China;
Columbia Nanomechanics Research Center
Department of Earth and
Environmental Engineering,
Columbia University,
500 West 120th Street,
New York, NY 10027
e-mail: zhu.liangliang@stu.xjtu.edu.cn
Department of Earth and
Environmental Engineering,
Columbia University,
500 West 120th Street,
New York, NY 10027
e-mail: zhu.liangliang@stu.xjtu.edu.cn
Xi Chen
Fellow ASME
Columbia Nanomechanics Research Center,
Department of Earth and
Environmental Engineering,
Columbia University,
500 West 120th Street,
New York, NY 10027
e-mail: xichen@columbia.edu
Columbia Nanomechanics Research Center,
Department of Earth and
Environmental Engineering,
Columbia University,
500 West 120th Street,
New York, NY 10027
e-mail: xichen@columbia.edu
1Corresponding author.
Contributed by the Materials Division of ASME for publication in the JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY. Manuscript received August 10, 2016; final manuscript received October 4, 2016; published online February 9, 2017. Assoc. Editor: Taehyo Park.
J. Eng. Mater. Technol. Apr 2017, 139(2): 021021 (4 pages)
Published Online: February 9, 2017
Article history
Received:
August 10, 2016
Revised:
October 4, 2016
Citation
Zhu, L., and Chen, X. (February 9, 2017). "Delamination-Based Measurement and Prediction of the Adhesion Energy of Thin Film/Substrate Interfaces." ASME. J. Eng. Mater. Technol. April 2017; 139(2): 021021. https://doi.org/10.1115/1.4035497
Download citation file:
Get Email Alerts
Cited By
Reviewer's Recognition
J. Eng. Mater. Technol (July 2025)
Forming limits of thin ferritic stainless steel for fuel cell application
J. Eng. Mater. Technol
Related Articles
Retracted: “Effect of Pin and Shoulder Geometry on Stir Zone and Mechanical Properties of Friction Stir Spot-Welded Aluminum Alloy 2024-T3 Sheets” [ASME J. Eng. Mater. Technol. 2015; 137(3): pp. 031004–031004-6.; doi: 10.1115/1.4030197]
J. Eng. Mater. Technol (July,2015)
Confined Thin Film
Delamination in the Presence of Intersurface Forces With Finite Range and
Magnitude
J. Appl. Mech (September,2009)
Axisymmetric Peeling of Thin Elastic Films: A Perturbation Solution
J. Appl. Mech (October,2023)
Related Proceedings Papers
Related Chapters
Surface Analysis and Tools
Tribology of Mechanical Systems: A Guide to Present and Future Technologies
In Situ Observations of the Failure Mechanisms of Hydrided Zircaloy-4
Zirconium in the Nuclear Industry: 20th International Symposium
Transverse Free Vibration Analysis of Hybrid SPR Steel Joints
Proceedings of the 2010 International Conference on Mechanical, Industrial, and Manufacturing Technologies (MIMT 2010)