A technique has been developed using the reversing dc electrical potential method to determine the mode of damage taking place during creep-fatigue interaction. It is observed that the hysteresis loop created by plotting the stress verses electrical potential gives a clear indication whether the damage in process is creep dominated or fatigue-dominated. During the fatigue-dominated damage process the hysteresis loop of stress verses electrical potential changes the shape whereas during the creep-dominated damage process the hysteresis loop of stress verses electrical potential does not change the shape but moves in the direction of higher electrical potential values. These changes are observed well before any indication seen on the conventional hysteresis loop of stress verses strain. This identification of the damage mode is observed well before failure occurs. The conclusion has been confirmed through fractographs. Hence it can be said that this technique eliminates the need for fractographs when determining the mode of damage during creep-fatigue interaction.

1.
Catlin
,
W. R.
,
Lord
,
D. C.
,
Prater
,
T. A.
, and
Coffin
,
L. F.
, 1985, “
The Reversing DC Electrical Potential Method
,” ASTM STP 887, p.
887
.
2.
Javed Hyder
,
M.
, 1991, “
A Study of Fatigue Damage Using the Electrical Potential Method
,” Ph.D. thesis, Rensselaer Polytechnic Institute, Troy, New York.
3.
Raj
,
R.
, 1984, “
Mechanisms of Creep-Fatigue Interaction, Flow and Fracture at Elevated Temperature
,”
ASM—Materials Science Seminar
, pp.
215
249
.
4.
Kanchanomai
,
C.
,
Yamamoto
,
S.
,
Miyashita
,
Y.
,
Mutoh
,
Y.
, and
McEvily
,
A. J.
, 2002, “
Low Cycle Fatigue Test for Solder Using Non-Contact Digital Image Measurement System
,”
Int. J. Fatigue
0142-1123,
24
, pp.
57
67
.
5.
Lefranc
,
G.
,
Licht
,
T.
, and
Mitic
,
G.
, 2002, “
Properties of Solders and Their Fatigue in Power Modules
,”
Microelectron. Reliab.
0026-2714,
42
, pp.
1641
1646
.
6.
Jiang
,
H.
,
Hermann
,
R.
, and
Plumbridge
,
W. J.
, 1996, “
High-Strain Fatigue of Pb-Sn Eutectic Solder Alloy
,”
J. Mater. Sci.
0022-2461,
31
, pp.
6455
6461
.
7.
Vaynman
,
S.
,
Fine
,
M. E.
, and
Jeannotte
,
D. A.
, 1988, “
Isothermal Fatigue of Low Tin Lead Based Solder
,”
Metall. Trans. A
0360-2133,
19A
, pp.
1051
1059
.
8.
Pang
,
H. L. J.
,
Tan
,
K. H.
,
Shi
,
X. Q.
, and
Wang
,
Z. P.
, 2001, “
Microstructure and Intermetallic Growth Effects on Shear and Fatigue Strength of Solder Joints Subjected to Thermal Cycling Aging
,”
Mater. Sci. Eng., A
0921-5093,
307
, pp.
42
50
.
9.
Villain
,
J.
,
Brueller
,
O. S.
, and
Qasim
,
T.
, 2002, “
Creep Behaviour of Lead Free and Lead Containing Solder Materials at High Homologous Temperatures with Regard to Small Solder Volumes
,”
Sens. Actuators, A
0924-4247,
99
, pp.
194
197
.
10.
Javed Hyder
,
M.
, and
Woodford
,
D. A.
, 1995, “
Development of Bimetal Test Specimen for Testing Materials at High Homologous Temperature
,” Pakistan
J. Sci. Ind. Res.
0022-4456,
38
(
7
), pp.
241
245
.
You do not currently have access to this content.