Micro-scale laser shock peening can potentially be applied to metallic structures in microdevices to improve fatigue and reliability performance. Copper thin films on a single-crystal silicon substrate are treated by using and characterized using techniques of X-ray microdiffraction and electron backscatter diffraction (EBSD). Strain field, dislocation density, and microstructure changes including crystallographic texture, grain size and subgrain structure are determined and analyzed. Further, shock peened single crystal silicon was experimentally characterized to better understand its effects on thin films response to . The experimental result is favorably compared with finite element method simulation based on single-crystal plasticity.
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June 2007
Technical Papers
Response of Thin Films and Substrate to Micro-Scale Laser Shock Peening
Youneng Wang,
Youneng Wang
Department of Mechanical Engineering,
e-mail: yw2119@columbia.edu
Columbia University
, New York, NY 10027
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Hongqiang Chen,
Hongqiang Chen
Department of Mechanical Engineering,
Columbia University
, New York, NY 10027
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Jeffrey W. Kysar,
Jeffrey W. Kysar
Department of Mechanical Engineering,
Columbia University
, New York, NY 10027
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Y. Lawrence Yao
Y. Lawrence Yao
Department of Mechanical Engineering,
Columbia University
, New York, NY 10027
Search for other works by this author on:
Youneng Wang
Department of Mechanical Engineering,
Columbia University
, New York, NY 10027e-mail: yw2119@columbia.edu
Hongqiang Chen
Department of Mechanical Engineering,
Columbia University
, New York, NY 10027
Jeffrey W. Kysar
Department of Mechanical Engineering,
Columbia University
, New York, NY 10027
Y. Lawrence Yao
Department of Mechanical Engineering,
Columbia University
, New York, NY 10027J. Manuf. Sci. Eng. Jun 2007, 129(3): 485-496 (12 pages)
Published Online: November 10, 2006
Article history
Received:
November 22, 2004
Revised:
November 10, 2006
Citation
Wang, Y., Chen, H., Kysar, J. W., and Lawrence Yao, Y. (November 10, 2006). "Response of Thin Films and Substrate to Micro-Scale Laser Shock Peening." ASME. J. Manuf. Sci. Eng. June 2007; 129(3): 485–496. https://doi.org/10.1115/1.2714568
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