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Keywords: thermal management (packaging)
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Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. April 2012, 134(4): 044501.
Published Online: February 13, 2012
... 2012 13 02 2012 heat transfer phase change materials pipe flow thermal management (packaging) two-phase flow micro-encapsulated phase change material thermal boundary layer enhancement of heat transfer A phase change material (PCM) is a substance with a high latent heat...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. March 2012, 134(3): 031024.
Published Online: January 20, 2012
... of Finned Arrays,” ASME J. Heat Transfer , 107 , p. 746 . 10.1115/1.3247499 22 11 2010 28 06 2011 20 01 2012 20 01 2012 cooling heat exchangers plates (structures) thermal management (packaging) equivalent fin height heat flow choke forced cooled electronic...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. October 2011, 133(10): 101502.
Published Online: August 11, 2011
... nanostructured materials oxidation power semiconductor devices semiconductor device models thermal management (packaging) 08 07 2010 02 05 2011 11 08 2011 11 08 2011 We report the heat transfer performance of microfabricated Cu post wicks. CuO nanostructures integrated onto...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. May 2011, 133(5): 052902.
Published Online: February 3, 2011
... management (packaging) pool boiling heat transfer enhancement microchannels grooves bubble dynamics During pool boiling, the latent heat involved with the phase change from liquid to vapor becomes significant in the heat removal process. The substantial increase in the heat transfer...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. May 2011, 133(5): 054504.
Published Online: February 2, 2011
..., volume, and cost of the air-cooled electronics, the present V-shaped corrugated carbon foam emerges as an alternative heat sink. 10 05 2010 14 11 2010 02 02 2011 02 02 2011 carbon foams forced convection heat sinks thermal management (packaging) carbon foam thermal...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. July 2010, 132(7): 071501.
Published Online: April 28, 2010
... porous media heat transfer microfluidics nanoporous materials thermal management (packaging) pool boiling enhancement copper nanodendrites electrochemical deposition electronics cooling dielectric liquids The ever increasing transistor density and processing speed of computer chips...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. May 2010, 132(5): 052403.
Published Online: March 9, 2010
.../j.ijheatmasstransfer.2007.01.052 19 06 2009 23 09 2009 09 03 2010 09 03 2010 annealing capillarity carbon nanotubes cooling micromechanical devices temperature measurement thermal management (packaging) thermometers thermometer carbon nanotube wick structure...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. April 2010, 132(4): 041005.
Published Online: February 18, 2010
... sinks heat transfer laminar flow microchannel flow thermal management (packaging) 30 09 2008 11 04 2009 18 02 2010 18 02 2010 2010 American Society of Mechanical Engineers ...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. June 2009, 131(6): 064505.
Published Online: April 13, 2009
... be considered for a large thermal mass system in order to achieve steady thermal control. The system presented is capable of maintaining steady thermal control within the given constraints. cooling heat conduction PD control Peltier effect temperature control thermal management (packaging...
Journal Articles
Publisher: ASME
Article Type: Design Innovations
J. Heat Mass Transfer. December 2008, 130(12): 125001.
Published Online: September 25, 2008
... and heat sinks thermal management aerodynamics cooling fans heat conduction heat sinks thermal management (packaging) turbulence Scaling of the Nusselt number and Reynolds number for a range of rotor diameters and speeds Figure 12 demonstrates that the power of 0.8 collapses...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. December 2008, 130(12): 121501.
Published Online: September 23, 2008
... copper elemental semiconductors evaporation heat pipes microprocessor chips porosity silicon statistical analysis thermal management (packaging) thermal resistance heat pipe vapor chamber nonuniform heating evaporative thermal performance silicon die heater As integrated...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. November 2008, 130(11): 114503.
Published Online: September 2, 2008
... thermal management (packaging) thermal resistance carbon nanotube thermal interface material contact thermal resistance plasma CVD low temperature photoacoustic As semiconductor technology continues to advance, resulting in progressive reductions of device feature sizes and expansion...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. June 2008, 130(6): 062201.
Published Online: April 23, 2008
... at an optimum location in either impingement or cross flow position, it can provide similar enhancements. 19 12 2006 25 06 2007 23 04 2008 cooling heat transfer jets microfluidics thermal management (packaging) synthetic jets electronics cooling thermal management impingement...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. February 2008, 130(2): 021401.
Published Online: February 4, 2008
... energy conservation and potential economic savings. exergy second-law analysis data center thermal management electronics cooling energy efficiency air conditioning cooling thermal management (packaging) total energy systems 2008 American Society of Mechanical Engineers ...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Heat Mass Transfer. October 2007, 129(10): 1432–1444.
Published Online: February 23, 2007
... sinks are provided. 11 04 2006 23 02 2007 cooling heat sinks heat transfer integrated circuit packaging thermal management (packaging) conjugate heat transfer thermal management microelectronics micro-fabrication microchannel liquid cooling Heat removal has...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Heat Mass Transfer. October 2007, 129(10): 1445–1452.
Published Online: February 9, 2007
... management (packaging) flat evaporator novel design electronic cooling miniature loop heat pipe mLHP thermal control Compact electronic devices such as notebooks with high performance microprocessors have been developed to meet the extensive data and graphic processing requirements...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Heat Mass Transfer. August 2007, 129(8): 1052–1059.
Published Online: January 18, 2007
... applications. spray cooling thermal management fins heat sink evaporation cooling thermal management (packaging) heat sinks microchannel flow sprays nozzles 21 07 2006 18 01 2007 2007 American Society of Mechanical Engineers ...