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Keywords: heat conduction
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. November 2024, 146(11): 111401.
Paper No: HT-24-1089
Published Online: July 4, 2024
...@mit.edu e-mail:  lienhard@mit.edu 27 03 2024 29 05 2024 04 07 2024 heat conduction shape factor interior exterior symmetry conformal mapping regular polygons N -fold symmetry École Supérieure de Physique et de Chimie Industrielles de la Ville de Paris...
Topics: Shapes
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. September 2024, 146(9): 091401.
Paper No: HT-23-1434
Published Online: June 6, 2024
... conductance from transient data [ 12 ]. Woodbury et al. describe the use of nonlinear estimation methods in solving transient inverse heat conduction problems with multiple unknown heat fluxes [ 11 ]. As mentioned previously, nonlinear estimation, along with infrared thermography, was used by Fieberg...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. September 2024, 146(9): 091101.
Paper No: HT-23-1417
Published Online: March 20, 2024
... is unknown. This paper investigates the application of inverse heat conduction problem (IHCP) methods to characterize the heat flux from the band heater. Three experiments with different heating times (5, 10, and 20 s) and no flowrate were conducted to measure the transient temperature under the 400 W band...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. March 2023, 145(3): 031401.
Paper No: HT-22-1395
Published Online: December 9, 2022
...John H. Lienhard, V Two-dimensional steady-state heat conduction is possible outside closed boundaries on which two isothermal segments at different temperatures are separated by two adiabatic segments. Remarkably, previous research showed that the conduction shape factor for the region exterior...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. July 2022, 144(7): 071401.
Paper No: HT-21-1638
Published Online: May 11, 2022
... conductivity modified transient plane source transient measurement method thermal contact resistance heat conduction The modified transient plane source (MTPS) method was first described in 2006 [ 1 ] as a geometry modification of previous work presented in 2000 by Mathis [ 2 ]. It has been in use...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. January 2022, 144(1): 013501.
Paper No: HT-20-1525
Published Online: November 8, 2021
...Siddharth Saurav; Sandip Mazumder The Fourier and the hyperbolic heat conduction equations were solved numerically to simulate a frequency-domain thermoreflectance (FDTR) experiment. Numerical solutions enable isolation of pump and probe laser spot size effects and use of realistic boundary...
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. January 2015, 137(1): 012402.
Paper No: HT-13-1026
Published Online: January 1, 2015
... promotes coupling in physical space. The solution procedure is benchmarked against a traditional sequential solution procedure for thermal transport in silicon. Significant acceleration in computational time, between 10 and 300 times, over the sequential procedure is found for heat conduction problems...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. October 2014, 136(10): 101302.
Paper No: HT-13-1376
Published Online: July 29, 2014
... The physical problem considered here involves heat conduction through a multilayered plate, heated through its top surface by a heat flux q ( x , y , t ), as illustrated by Figs. 1( a ) and 1( b ) . The top and bottom surfaces of this plate exchanges heat by convection with the surrounding environment...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. October 2014, 136(10): 102401.
Paper No: HT-13-1369
Published Online: July 15, 2014
... Conductivity of Vitreous Silica ,” Phys. Rev. B , 59 , pp. 13707 – 13711 . 10.1103/PhysRevB.59.13707 [27] Torii , D. , Nakano , T. , and Ohara , T. , 2008 , “ Contribution of Inter- and Intramolecular Energy Transfers to Heat Conduction in Liquids ,” J. Chem. Phys. , 128 , p. 044504...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. September 2014, 136(9): 091303.
Paper No: HT-13-1416
Published Online: June 27, 2014
.... multilayer heat conduction analytical solution computation While numerical methods are becoming increasingly popular because of advances in computational technology, analytical methods for determining the temperature distribution in composite materials remain of interest because they provide...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. September 2014, 136(9): 094502.
Paper No: HT-13-1494
Published Online: June 17, 2014
.... The particular configuration is a classical heat conduction problem with a wide range of practical applications. We consider both the classical problem, i.e., estimating the shape factor of a given configuration, and the inverse problem, i.e., calculating the optimum shape that maximizes the heat transfer rate...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. June 2014, 136(6): 064501.
Paper No: HT-13-1164
Published Online: March 7, 2014
.... Tzou. 26 03 2013 13 01 2014 Mathematical models are developed for heat conduction in creeping flow of a liquid over a microstructured superhydrophobic surface, where because of hydrophobicity, a gas is trapped in the cavities of the microstructure. As gas is much lower in thermal...
Topics: Temperature
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. January 2014, 136(1): 013001.
Paper No: HT-13-1378
Published Online: October 21, 2013
... – 197 . 10.1080/01457630701686735 [60] Nakayama , W. , 2008 , “ Heat Conduction in Printed Circuit Boards: A Mesoscale Modeling Approach ,” ASME J. Electron. Packag. , 130 ( 4 ), p. 041106 . 10.1115/1.2993126 [61] 1995 , “ Integrated Circuit Test Method, Environment Conditions...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. March 2013, 135(3): 034501.
Paper No: HT-11-1457
Published Online: February 8, 2013
... transverse to the thermal flux, two-dimensional heat conduction is considered for estimation of the effective thermal conductivity of regular arrays, which is separated into three components, namely, no thermal-interaction (NTI) effect, longitudinal thermal-interaction (LTI) effect, and transverse thermal...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. December 2012, 134(12): 121301.
Published Online: October 10, 2012
.... A. , 1972 , “ A Problem of Transient Heat Conduction in a Semibounded Body With an Internal Cylindrical Heat Source ,” J. Eng. Phys. , 23 , pp. 1051 – 1054 . 10.1007/BF00828846 [6] Thiyagarajan , R. , and Yovanovich , M. M. , 1974 , “ Thermal Resistance of a Buried Cylinder With Constant...
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