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Keywords: electronics cooling
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. April 2024, 146(4): 042301.
Paper No: HT-23-1304
Published Online: January 29, 2024
... 15 12 2023 29 01 2024 jet-in-crossflow hotspot treatment electronics cooling vertical and angled jet rib structured channel pure jet impingement pure crossflow CFD In the growing and rapidly advancing world of computing machines and clusters, the electrical...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. November 2022, 144(11): 111601.
Paper No: HT-21-1599
Published Online: August 23, 2022
... evaporation rate for screen mesh wicks is discussed. thin-film evaporation model liquid–vapor meniscus capillary pressure phase change screen wicks ansys fluent multiphase CFD VOF model electronics cooling heat pipes thermosyphons evaporation-driven flow heat and mass transfer Heat...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. October 2021, 143(10): 102901.
Paper No: HT-21-1059
Published Online: September 8, 2021
...-mail:  vafai@engr.ucr.edu 31 01 2021 09 04 2021 08 09 2021 electronics cooling 3D IC heat spreader high-conductivity insert optimization Thermal management is the key point for the advancement of the micro-electronic components [ 1 – 8 ]. As the number of devices mounted...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. March 2020, 142(3): 031901.
Paper No: HT-18-1589
Published Online: January 13, 2020
... of CPUs can be controlled to about 51 °C even at condenser-cooling wind temperature of 30 °C with wind flowrate of 41.88 m 3 /h. e-mail:  xuezhihu9@hotmail.com 11 09 2018 20 10 2019 13 01 2020 loop heat pipe two-phase device electronics cooling temperature control thermal...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. October 2014, 136(10): 101801.
Paper No: HT-13-1483
Published Online: July 15, 2014
... of the optimal designs to confirm the accuracy of results obtained by the quasi-3D simulation package used in this paper. electronics cooling microheat exchanger multi-objective optimization conjugate heat transfer single-phase flow microchannel Cooling systems for new generation portable...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. August 2014, 136(8): 081503.
Paper No: HT-13-1452
Published Online: April 23, 2014
... on Nucleate Boiling Heat Transfer ,” Open Transp. Phenom. J. , 2 , pp. 24 – 34 . [15] Hosseini , R. , Gholaminejad , A. , and Nabil , M. , 2011 , “ Concerning the Effect of Surface Material on Nucleate Boiling Heat Transfer of R-113 ,” Electron. Cool. Therm. Control , 1 , pp. 22 – 27...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. June 2014, 136(6): 061703.
Paper No: HT-13-1088
Published Online: March 11, 2014
... This work demonstrates an innovative microfabricated air-cooling technology that employs an electrohydrodynamic (EHD) corona discharge (i.e., ionic wind pump) for electronics cooling applications. A single, microfabricated ionic wind pump element consists of two parallel collecting electrodes between which...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. May 2014, 136(5): 051401.
Paper No: HT-13-1053
Published Online: February 26, 2014
.... Editor: Ali Khounsary. 29 01 2013 13 11 2013 This work focuses on a comparison of second law based component design on one hand and second law based system design on the other within the context of electronics cooling. Typical electronics cooling components such as a heat sink...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. May 2014, 136(5): 051502.
Paper No: HT-13-1245
Published Online: February 26, 2014
.... Editor: Sujoy Kumar Saha. 16 05 2013 10 12 2013 Boiling can provide several orders of magnitude higher performance than a traditional air cooled system in electronics cooling applications. It can dissipate large quantities of heat while maintaining a low surface temperature...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. January 2014, 136(1): 011401.
Paper No: HT-13-1158
Published Online: October 25, 2013
... demonstrates, for the first time, the effectiveness of combining a VAT-based nonlocal thermal-fluid-solid model with population-based optimization methods, such as PSO, to design heat sinks for electronics cooling applications. The VAT-based nonlocal modeling method provides heat sink design capabilities...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. November 2013, 135(11): 111009.
Paper No: HT-12-1188
Published Online: September 23, 2013
... , “ Piezoelectric Fans: Heat Transfer Enhancements or Electronics Cooling ,” ASME-JSME Thermal Engineering and Summer Heat Transfer Conference 2008 , Jacksonville, FL , Aug. 10–14, HT-2008-56405. [4] Açikalin , T. , Sauciuc , I . , and Garimella , S. V. , 2005 , “ Piezoelectric Actuators for Low...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. November 2013, 135(11): 111012.
Paper No: HT-12-1301
Published Online: September 23, 2013
... transfer rate by 13% is observed, increasing to positive enhancements for Sr(H/D) > 0.1 up to a maximum enhancement of 48% at Sr(H/D) = 0.6. impinging jet pulsating flow hot spot high density electronics cooling boundary layer redevelopment A recent review by Garimella et al. [ 1...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. November 2013, 135(11): 111016.
Paper No: HT-12-1338
Published Online: September 23, 2013
... suppressed to some extent. It was also observed that synthetic jets can help to uniformize the heat sink temperature distribution. synthetic jet microchannel flow boiling instability two-phase flow electronics cooling Flow boiling heat transfer in microchannels has shown great potential...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. September 2013, 135(9): 091601.
Paper No: HT-12-1290
Published Online: July 26, 2013
... cm chip. electronics cooling forced convection free-molecular flow kinetic theory Arrays of microscale fins have been successfully used as heat exchangers for high-heat flux systems [ 1–3 ], leading to interest in scaling these systems down to the nanoscale [ 4–6 ]. As fins reach...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. June 2013, 135(6): 061202.
Paper No: HT-12-1653
Published Online: May 16, 2013
... tailored to specific applications. porous media sintered materials direct simulation microtomography reverse engineering electronics cooling thermal and fluid transport Naturally occurring and engineered porous media find use in a wide range of construction materials, prosthetics...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. June 2013, 135(6): 061401.
Paper No: HT-12-1537
Published Online: May 16, 2013
... between 0.127–1.016 mm, indicating the dominance of nucleate boiling. The OMM geometry is promising to provide exceptional performance that is particularly attractive in meeting the challenges of high heat flux removal in electronics cooling applications. flow boiling stable boiling electronics...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. March 2013, 135(3): 031401.
Paper No: HT-12-1189
Published Online: February 14, 2013
... for estimating conductivity of small scale bodies. nanoscale electronics cooling conductive heat trees constructal theory Tree-shaped structures play a prominent role in Nature because they can be found in the structures of many natural flows like pulmonary and vascular tissues to river beds [ 1...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. January 2013, 135(1): 011012.
Paper No: HT-12-1146
Published Online: December 6, 2012
... ,” Proceedings of the 9th AIAA/ISSMO Symposium on Multidisciplinary Analysis and Optimization , Buckhead , Atlanta, GA , Sept. 4 – 6 . [3] Ndao , S. , Peles , Y. , and Jensen , M. K. , 2009 , “ Multi-Objective Thermal Design Optimization and Comparative Analysis of Electronics Cooling...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. December 2012, 134(12): 122901.
Published Online: October 5, 2012
... in the channels. microchannel oscillation reduction inlet orifice signal analysis two-phase flow electronics cooling The removal of high heat flux from electronics devices continues to be a problem, especially for defense applications. For electronics cooling, it is desirable to maintain...