... than ethanol. Incipience in the cavities with noncircular cross-section showed similar behavior to cylindrical cavities whose diameter was equal to the width of the noncircular cavity. Messina and Park [ 18 ] used a photographic etching method to create precise arrays of pits on copper surfaces. Pit...

...) on the outside surface of a smooth copper tube were measured at the saturation temperature of 6.7 °C; water flows inside the tube and provides heat to the refrigerants to boil (thus, water-heated boiling). Measurements showed that the refrigerant of a higher vapor pressure has a higher heat transfer coefficient...

... of such devices. Three sintered copper wick samples employed in commercial heat pipes are characterized in this work in terms of their thermal transport properties––porosity, effective thermal conductivity, permeability, and interfacial heat transfer coefficient. The commercially available samples of nearly...

...Kleber Vieira de Paiva; Marcia Barbosa Henriques Mantelli; Leonardo Kessler Slongo This work presents a theoretical and experimental analysis of a copper mini heat pipe (MHP), fabricated from a sandwich formed between cylindrical wires and flat plates, which are welded by means of diffusion process...

... nanoparticles, which are known for their good heat transfer characteristics in bulk regime, reported drastic enhancement in thermal conductivity. The present paper investigates into the pool boiling characteristics of metallic nanofluids, in particular of Cu - H 2 O nanofluids, on flat copper heater surface...

... and the critical heat flux >500 W/cm 2 over 2 mm × 2 mm heating areas are demonstrated. Copper oxide nanostructures formed on the micropost surfaces significantly enhance the critical heat flux without compromising the effective heat transfer coefficient. An approximate numerical model is developed to help...

... applications. 21 12 2009 25 04 2011 11 08 2011 11 08 2011 chemically reactive flow copper design engineering flow measurement heat exchangers maintenance engineering nickel pipe flow thermal resistance velocity measurement fouling 90/10 Cu/Ni tube heat transfer...

... 03 05 2011 boiling convection copper dielectric liquids electrochemistry electrodeposition undercooling subcooled boiling microporous copper electrochemical deposition electronic cooling dielectric liquids Many studies have been conducted to investigate pool boiling...

...Jessica Sheehan; Avram Bar-Cohen cooling copper evaporation flow visualisation infrared imaging microchannel flow microfabrication micro-optomechanical devices sapphire two-phase flow 28 04 2011 28 04 2011 2011 American Society of Mechanical Engineers ...

...Yulong Ji; Hsiu-hung Chen; Qingsong Yu; Xuehu Ma; H. B. Ma 27 04 2011 27 04 2011 coatings contact angle cooling copper hydrophobicity monolayers organic compounds self-assembly wetting 2011 American Society of Mechanical Engineers ...

...T. Grosan; I. Pop The classical problem of forced convection boundary layer flow and heat transfer past a needle with variable wall temperature using nanofluids is theoretically studied. The similarity equations are solved numerically for two types of metallic or nonmetallic, such as copper (Cu...

... 2010 01 02 2011 01 02 2011 alumina aluminium convection copper copper compounds gold liquid theory nanofluidics nickel organic compounds thermal conductivity titanium compounds viscosity water nanofluid convective heat transfer coefficient thermal conductivity...

...Calvin H. Li; Ting Li; Paul Hodgins; G. P. Peterson Spherical glass and copper beads have been used to create bead packed porous structures for an investigation of two-phase heat transfer bubble dynamics under geometric constraints. The results demonstrated a variety of bubble dynamics...

...Mohamed S. El-Genk; Amir F. Ali Experiments are performed to investigate saturation boiling of degassed PF-5060 dielectric liquid on microporous copper dendrite surface layers deposited on 10 × 10 mm 2 Cu substrates. The electrochemically deposited surface layers are of different thicknesses...

... for Ra = 10 4 and at θ = 30 deg for Ra = 10 5 and 10 6 . Eastman , J. A. , Choi , S. U. S. , Yu , W. , and Thompson , L. J. , 2001 , “ Anomalously Increased Effective Thermal Conductivity of Ethylene Glycol-Based Nanofluids Containing Copper Nanoparticles ,” Appl. Phys. Lett...

... and reduced the heat capacity measurement errors. Heat capacities of copper thin films with thicknesses from 20 nm to 340 nm are measured in the temperature range from 300 K to 420 K in vacuum of 1 mPa. The specific heat of the 340 nm Cu film is close to the literature data of bulk Cu. For the thinner films...

...Wen-Jei Yang; Nengli Zhang; Daniel L. Vrable This paper introduces a novel heat transfer enhancement surface, referred to as metal-graphite composite surface. It is comprised of high thermal conductivity graphite microfibers interspersed within a metal matrix (copper or aluminum) to enhance...

...R. Kathiravan; Ravi Kumar; Akhilesh Gupta; Ramesh Chandra Copper nanoparticles with an average size of 10 nm are prepared by the sputtering method and are characterized using different techniques, viz., X-ray diffraction spectrum, atomic force microscopy, and transmission electron microscopy...

...Je-Young Chang; Ravi S. Prasher; Suzana Prstic; P. Cheng; H. B. Ma This paper reports the test results of vapor chambers using copper post heaters and silicon die heaters. Experiments were conducted to understand the effects of nonuniform heating conditions (hot spots) on the evaporative thermal...

..., aluminum, copper, silver, Constantan, and silicon; covering a range of Reynolds number (220–900), Ekman number ( 7.08 × 10 − 5 – ∞ ) , nozzle-to-target spacing ( β = 0.25 – 1.0 ) , disk thicknesses to nozzle diameter ratio ( b ∕ d n = 0.25 – 1.67 ) , and Prandtl number (1.29–124.44) using ammonia ( N H 3...