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Keywords: component placement
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. June 2015, 137(6): 061006.
Paper No: HT-14-1164
Published Online: June 1, 2015
... analytical solution optimization component placement Plate fin heat sinks cooled with forced air flow are commonly used to thermally manage electronics components in many applications [ 1 ]. Though air-cooling is typical in industrial inverters, there is an increasing trend to adopt liquid or two...