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Journal Articles

Big MEMS for Thermal Measurement

Accepted Manuscript
Haiyu He, Yuxi Wang, Zhiyao Jiang, Bai Song
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer.
Paper No: HT-24-1133
https://doi.org/10.1115/1.4066504
Published Online: September 12, 2024
View Article titled, Big MEMS for Thermal Measurement
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Topics: Microelectromechanical systems, Thermal conductivity, Dimensions, Wire, Carbon fibers, Flow (Dynamics), Heat, Heat capacity, Metals, Nanomaterials
Journal Articles

Flow Boiling in Flexible Polymer Microgaps for Embedded Cooling in High-Power Applications

Daniel Lorenzini, Wenming Li, Yogendra Joshi
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. April 2023, 145(4): 041603.
Paper No: HT-22-1470
https://doi.org/10.1115/1.4056594
Published Online: February 3, 2023
View Article titled, Flow Boiling in Flexible Polymer Microgaps for Embedded Cooling in High-Power Applications
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Topics: Boiling, Cooling, Flow (Dynamics), Fluids, Plasma desorption mass spectrometry, Vapors, Temperature, Computer simulation, Computational fluid dynamics, Heat
Journal Articles

Design and Evaluation of a MEMS-Based Stirling Microcooler

Dongzhi Guo, Jinsheng Gao, Alan J. H. McGaughey, Gary K. Fedder, Matthew Moran, Shi-Chune Yao
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. November 2013, 135(11): 111003.
Paper No: HT-12-1144
https://doi.org/10.1115/1.4024596
Published Online: September 23, 2013
View Article titled, Design and Evaluation of a MEMS-Based Stirling Microcooler
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Topics: Cooling, Cycles, Design, Heat, Heat transfer, Microcoolers, Microelectromechanical systems, Porosity, Silicon, Temperature
Journal Articles

Theoretical Two-Dimensional Modeling of Gas Conduction Between Finite Parallel Plates in High Vacuum

Taishan Zhu, Wenjing Ye
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. May 2012, 134(5): 051013.
https://doi.org/10.1115/1.4005704
Published Online: April 13, 2012
View Article titled, Theoretical Two-Dimensional Modeling of Gas Conduction Between Finite Parallel Plates in High Vacuum
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Topics: Flow (Dynamics), Heat, Heat conduction, Heat flux, Heat transfer, Microelectromechanical systems, Modeling, Plates (structures), Sensors, Simulation
Journal Articles

Raman Thermometry Measurements and Thermal Simulations for MEMS Bridges at Pressures From 0.05 Torr to 625 Torr

Leslie M. Phinney, Justin R. Serrano, Edward S. Piekos, John R. Torczynski, Michael A. Gallis, Allen D. Gorby
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. July 2010, 132(7): 072402.
https://doi.org/10.1115/1.4000965
Published Online: April 28, 2010
View Article titled, Raman Thermometry Measurements and Thermal Simulations for MEMS Bridges at Pressures From 0.05 Torr to 625 Torr
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Topics: Bridges (Structures), Finite element analysis, Heat transfer, Microelectromechanical systems, Pressure, Simulation, Temperature, Temperature measurement, Heat conduction, Temperature profiles
Journal Articles

Investigation Into the Similarity Solution for Boundary Layer Flows in Microsystems

Suhil Kiwan, M. A. Al-Nimr
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. April 2010, 132(4): 041011.
https://doi.org/10.1115/1.4000886
Published Online: February 22, 2010
View Article titled, Investigation Into the Similarity Solution for Boundary Layer Flows in Microsystems
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Topics: Boundary layers, Flow (Dynamics), Heat transfer, Temperature, Fluids, Microelectromechanical systems, Stagnation flow
Journal Articles

A Micro-Insulation Concept for MEMS Applications

Rui Yao, James Blanchard
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. May 2009, 131(5): 052401.
https://doi.org/10.1115/1.3084121
Published Online: March 16, 2009
View Article titled, A Micro-Insulation Concept for MEMS Applications
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Topics: Heat conduction, Insulation, Thermal conductivity, Heat, Microelectromechanical systems, Temperature, Pressure
Journal Articles

Time-Resolved Micro-Raman Thermometry for Microsystems in Motion

Justin R. Serrano, Sean P. Kearney
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. December 2008, 130(12): 122401.
https://doi.org/10.1115/1.2976552
Published Online: September 16, 2008
View Article titled, Time-Resolved Micro-Raman Thermometry for Microsystems in Motion
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Topics: Actuators, Microelectromechanical systems, Temperature, Temperature measurement, Signals, Lasers, Probes
Journal Articles

Measurement of the Thermal Conductivity and Heat Capacity of Freestanding Shape Memory Thin Films Using the 3 ω Method

Ankur Jain, Kenneth E. Goodson
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. October 2008, 130(10): 102402.
https://doi.org/10.1115/1.2945904
Published Online: August 8, 2008
View Article titled, Measurement of the Thermal Conductivity and Heat Capacity of Freestanding Shape Memory Thin Films Using the 3 ω Method
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Topics: Heat capacity, Microfabrication, Temperature, Thermal conductivity, Thin films, Nickel titanium alloys, Shape memory effects, Metals, Silicon nitride ceramics, Microelectromechanical systems
Journal Articles

Experimental Study on Fundamental Phenomena of Boiling Using Heat Transfer Surfaces With Well-Defined Cavities Created by MEMS (Effect of Spacing Between Cavities)

Takato Sato, Yasuo Koizumi, Hiroyasu Ohtake
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. August 2008, 130(8): 084501.
https://doi.org/10.1115/1.2927399
Published Online: May 29, 2008
View Article titled, Experimental Study on Fundamental Phenomena of Boiling Using Heat Transfer Surfaces With Well-Defined Cavities Created by MEMS (Effect of Spacing Between Cavities)
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Topics: Boiling, Bubbles, Cavities, Heat transfer, Microelectromechanical systems, Nucleation (Physics), Temperature, Nucleate boiling
Journal Articles

Publisher's Note: “Phase-Change Heat Transfer in Microsystems” [ Journal of Heat Transfer, 2007, 129(2), pp. 101–107 ]

Ping Cheng, Hui-Ying Wu, Fang-Jun Hong
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Errata
J. Heat Mass Transfer. May 2007, 129(5): 683.
https://doi.org/10.1115/1.2740784
Published Online: May 1, 2007
View Article titled, Publisher's Note: “Phase-Change Heat Transfer in Microsystems” [ Journal of Heat Transfer, 2007, 129(2), pp. 101–107 ]
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Topics: Heat transfer, Microelectromechanical systems
Journal Articles

Raman Thermometry of Polysilicon Microelectro-mechanical Systems in the Presence of an Evolving Stress

Mark R. Abel, Samuel Graham, Justin R. Serrano, Sean P. Kearney, Leslie M. Phinney
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. March 2007, 129(3): 329–334.
https://doi.org/10.1115/1.2409996
Published Online: May 31, 2006
View Article titled, Raman Thermometry of Polysilicon Microelectro-mechanical Systems in the Presence of an Evolving Stress
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Topics: Calibration, Polysilicon, Spectral linewidth, Stress, Temperature, Temperature measurement, Uncertainty, Thermal stresses, Raman spectroscopy, Microelectromechanical systems
Journal Articles

Thermal-Fluid MEMS Devices: A Decade of Progress and Challenges Ahead

I. Hassan
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technology Review
J. Heat Mass Transfer. November 2006, 128(11): 1221–1233.
https://doi.org/10.1115/1.2352792
Published Online: March 30, 2006
View Article titled, Thermal-Fluid MEMS Devices: A Decade of Progress and Challenges Ahead
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Topics: Flow (Dynamics), Fluids, Heat transfer, Microchannels, Microelectromechanical systems, Micropumps, Microsensors, Temperature, Heat flux, Design
Journal Articles

Thermal-Hydraulic Performance of MEMS-based Pin Fin Heat Sink

Ali Koşar, Yoav Peles
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. February 2006, 128(2): 121–131.
https://doi.org/10.1115/1.2137760
Published Online: August 8, 2005
View Article titled, Thermal-Hydraulic Performance of MEMS-based Pin Fin Heat Sink
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Topics: Fins, Flow (Dynamics), Friction, Heat sinks, Heat transfer, Heat transfer coefficients, Microelectromechanical systems, Pressure drop, Reynolds number, Thermal resistance
Journal Articles

Coupled Field Analyses in MEMS With Finite Element Analysis

Ravi Chandra Sikakollu, Lemmy Meekisho, Andres LaRosa
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Article
J. Heat Mass Transfer. January 2005, 127(1): 34–37.
https://doi.org/10.1115/1.1804204
Published Online: February 15, 2005
View Article titled, Coupled Field Analyses in MEMS With Finite Element Analysis
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Topics: Actuators, Boundary-value problems, Finite element analysis, Microelectromechanical systems, Dimensions, Thermal stresses, Temperature
Journal Articles

Microelectromechanical System-Based Evaporative Thermal Management of High Heat Flux Electronics

Cristina H. Amon, S.-C. Yao, C.-F. Wu, C.-C. Hsieh
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Article
J. Heat Mass Transfer. January 2005, 127(1): 66–75.
https://doi.org/10.1115/1.1839586
Published Online: February 15, 2005
View Article titled, Microelectromechanical System-Based Evaporative Thermal Management of High Heat Flux Electronics
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Topics: Coolants, Cooling, Drops, Electronics, Engineering prototypes, Flow (Dynamics), Flux (Metallurgy), Heat, Heat flux, Heat transfer
Journal Articles

A MEMS Piston-Cylinder Device Actuated by Combustion

Dae Hoon Lee, Dae-Eun Park, Euisik Yoon, Sejin Kwon
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Papers
J. Heat Mass Transfer. June 2003, 125(3): 487–493.
https://doi.org/10.1115/1.1565095
Published Online: May 20, 2003
View Article titled, A MEMS Piston-Cylinder Device Actuated by Combustion
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Topics: Combustion, Combustion chambers, Microelectromechanical systems, Heat losses, Cylinders, Pressure, Design, Manufacturing, Quenching (Metalworking), Heat transfer
Journal Articles

Nanosecond Laser Repair of Adhered MEMS Structures

James W. Rogers, Leslie M. Phinney
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Notes
J. Heat Mass Transfer. April 2002, 124(2): 394–396.
https://doi.org/10.1115/1.1447936
Published Online: August 6, 2001
View Article titled, Nanosecond Laser Repair of Adhered MEMS Structures
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Topics: Adhesion, Lasers, Maintenance, Stiction, Fluence (Radiation measurement), Microcantilevers, Microelectromechanical systems, Nd-YAG lasers
Journal Articles

Temperature-Dependent Thermal Conductivity of Single-Crystal Silicon Layers in SOI Substrates

M. Asheghi, M. N. Touzelbaev, K. E. Goodson, Y. K. Leung, S. S. Wong
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. February 1998, 120(1): 30–36.
https://doi.org/10.1115/1.2830059
Published Online: February 1, 1998
View Article titled, Temperature-Dependent Thermal Conductivity of Single-Crystal Silicon Layers in SOI Substrates
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Topics: Crystals, Heat conduction, Silicon, Silicon-on-insulator, Temperature, Thermal conductivity, Phonons, Semiconductor wafers, Transistors, Cantilevers