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Journal Articles

Thermal Performance Optimization of the Three-Dimensional Integrated Circuits Employing the Integrated Chip-Size Double-Layer or Multi-Layer Microchannels

Sainan Lu, Kambiz Vafai
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. March 2023, 145(3): 032501.
Paper No: HT-22-1442
https://doi.org/10.1115/1.4055245
Published Online: December 9, 2022
View Article titled, Thermal Performance Optimization of the Three-Dimensional Integrated Circuits Employing the Integrated Chip-Size Double-Layer or Multi-Layer Microchannels
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Topics: Copper, Flat heat pipes, Heat sinks, Integrated circuits, Microchannels, Nanofluids, Optimization, Temperature, Weight (Mass)
Journal Articles

Optimization of the Thermal Performance of Three-Dimensional Integrated Circuits Utilizing Rectangular-Shaped and Disk-Shaped Heat Pipes

Sainan Lu, Kambiz Vafai
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. June 2022, 144(6): 061901.
Paper No: HT-21-1801
https://doi.org/10.1115/1.4053803
Published Online: March 4, 2022
View Article titled, Optimization of the Thermal Performance of Three-Dimensional Integrated Circuits Utilizing Rectangular-Shaped and Disk-Shaped Heat Pipes
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Topics: Disks, Heat, Heat pipes, Heat sinks, Integrated circuits, Temperature, Flat heat pipes, Temperature distribution
Journal Articles

Design and Optimization of a Composite Heat Spreader to Improve the Thermal Management of a Three-Dimensional Integrated Circuit

Andisheh Tavakoli, Kambiz Vafai
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. October 2021, 143(10): 102901.
Paper No: HT-21-1059
https://doi.org/10.1115/1.4050922
Published Online: September 8, 2021
View Article titled, Design and Optimization of a Composite Heat Spreader to Improve the Thermal Management of a Three-Dimensional Integrated Circuit
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Topics: Boundary-value problems, Flat heat pipes, Temperature, Thermal conductivity, Heat sinks, Composite materials, Integrated circuits, Optimization, Heat, Cooling
Journal Articles

Parametric Analysis of Microfluidic Cooling Systems for Three-Dimensional-Stacked Silicon Microelectronics by Inferential Statistic Approaches

Tomas Moreno-Torres, Daniel Lorenzini, Yogendra Joshi, Abel Hernandez-Guerrero, J. Luis Luviano-Ortiz
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. April 2021, 143(4): 044502.
Paper No: HT-20-1769
https://doi.org/10.1115/1.4049639
Published Online: February 2, 2021
View Article titled, Parametric Analysis of Microfluidic Cooling Systems for Three-Dimensional-Stacked Silicon Microelectronics by Inferential Statistic Approaches
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Topics: Computer simulation, Cooling systems, Density, Experimental design, Heat, Microfluidics, Pressure drop, Silicon, Temperature, Fins
Journal Articles

Thermophysical and Geometrical Effects on the Thermal Performance and Optimization of a Three-Dimensional Integrated Circuit

Fatemeh Tavakkoli, Siavash Ebrahimi, Shujuan Wang, Kambiz Vafai
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. August 2016, 138(8): 082101.
Paper No: HT-15-1825
https://doi.org/10.1115/1.4033138
Published Online: May 3, 2016
View Article titled, Thermophysical and Geometrical Effects on the Thermal Performance and Optimization of a Three-Dimensional Integrated Circuit
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Topics: Flat heat pipes, Heat, Heat sinks, Integrated circuits, Optimization, Temperature, Thermal conductivity, Design, Silicon, Power density
Journal Articles

Thermal Characterization of Interlayer Microfluidic Cooling of Three-Dimensional Integrated Circuits With Nonuniform Heat Flux

Yoon Jo Kim, Yogendra K. Joshi, Andrei G. Fedorov, Young-Joon Lee, Sung-Kyu Lim
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. April 2010, 132(4): 041009.
https://doi.org/10.1115/1.4000885
Published Online: February 19, 2010
View Article titled, Thermal Characterization of Interlayer Microfluidic Cooling of Three-Dimensional Integrated Circuits With Nonuniform Heat Flux
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Topics: Cooling, Heat flux, Microfluidics, Flow (Dynamics), Pressure drop, Integrated circuits, Fluids, Thermal management, Refrigerants
Journal Articles

Correlating Equations for Impingement Cooling of Small Heat Sources With Single Circular Liquid Jets

D. J. Womac, S. Ramadhyani, F. P. Incropera
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. February 1993, 115(1): 106–115.
https://doi.org/10.1115/1.2910635
Published Online: February 1, 1993
View Article titled, Correlating Equations for Impingement Cooling of Small Heat Sources With Single Circular Liquid Jets
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Topics: Heat, Impingement cooling, Jets, Nozzles, Coolants, Cooling, Electronic equipment, Forced convection, Heat transfer, Integrated circuits
Journal Articles

Maximum Temperatures in Diamond Heat Spreaders Using the Surface Element Method

J. V. Beck, A. M. Osman, G. Lu
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. February 1993, 115(1): 51–57.
https://doi.org/10.1115/1.2910668
Published Online: February 1, 1993
View Article titled, Maximum Temperatures in Diamond Heat Spreaders Using the Surface Element Method
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Topics: Diamonds, Flat heat pipes, Temperature, Geometry, Algebra, Composite materials, Copper, Electronic equipment, Heat conduction, Heat sinks
Journal Articles

Thermosyphon Boiling in Vertical Channels

A. Bar-Cohen, H. Schweitzer
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. November 1985, 107(4): 772–778.
https://doi.org/10.1115/1.3247503
Published Online: November 1, 1985
View Article titled, Thermosyphon Boiling in Vertical Channels
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Topics: Boiling, Heat transfer, Heat flux, Ceramics, Cooling, Cooling systems, Flow (Dynamics), Integrated circuits, Plates (structures), Pool boiling