... CTE or nonconsidering residual strain, especially for temperature above T g . 02 12 2010 30 09 2011 09 12 2011 09 12 2011 electronics packaging encapsulation plates (structures) polymers stress-strain relations viscoelasticity thermomechanical analysis...

... electronics packaging solders stress-strain relations Solder alloys are extensively used in electronic packaging because of their favorable wetting properties and low melting temperature. However, most electronic packaging solder alloys operate at thermally activated condition at room temperature...

... 06 2010 chip scale packaging cracks elastoplasticity finite element analysis fracture mechanics solders stress-strain relations thermal analysis Weibull distribution The problem of solder joint fatigue failure has been modeled by employing empirical Coffin–Manson type models...

...-free solder strain rate effect tensile strength split Hopkinson tensile bar electronic products fractography integrated circuit packaging integrated circuit reliability solders stress-strain relations tensile strength tin compounds 19 06 2008 13 03 2009 16 06 2009...

... and strain maintenance. Time-independent strains are obtained from the stress-strain relations at the instantaneously strained parts, while the time-dependent strains are obtained from the stress-time relations during the strain maintaining periods. Based on the obtained time-independent and time-dependent...

... arrays copper alloys cracks creep testing fatigue testing finite element analysis integrated circuit interconnections integrated circuit packaging integrated circuit reliability life testing silver alloys solders stress-strain relations tin alloys As technology progresses, both...

... and tangential vectors of the interface in Fig. 12 , and k n , k t , k θ , and k t θ are the stiffness coefficients of the interface. Combining Eqs. 5 , 6 with Eqs. 7 , 8 , the constitutive stress-strain relations of the continuum are obtained as 9 ( σ t...

...-strain relations tin alloys As technology progresses, more consumer and military products are making use of electronics to augment or enhance performance, and thus the use of electronics is increasing worldwide. Concurrently, there is an increased awareness to limit the use of “toxic” materials...

... for VQFN with Sn–Ag–Cu solder joint under cyclic bending load at both 25°C and 125°C. 23 01 2007 27 08 2007 bending strength copper alloys electronics packaging fatigue testing finite element analysis silver alloys soldering solders stress-strain relations surface finishing tin...

... as the loading frequency is reduced. 14 03 2006 23 06 2006 fatigue testing creep solders finite element analysis stress-strain relations electronics packaging eutectic alloys stress effects shear deformation creep testing tin alloys silver alloys copper alloys...

... the modulus of the interconnection materials, reducing the span of the PCB, or using either a very thin or a very thick PCB. 05 11 2004 30 03 2005 impact testing printed circuit testing stress-strain relations reliability electronic packaging drop impact finite element parametric...

... balls. 08 06 2004 21 12 2004 ball grid arrays creep solders soldering assembling printed circuit manufacture stress relaxation stress-strain relations tin alloys lead alloys silver alloys integrated circuit packaging finite element analysis creep strain rate 62%Sn–36...

.... 01 November 2002 15 12 2003 soldering alloys fatigue chip scale packaging deformation thermal shock stress-strain relations viscoplasticity interface phenomena failure analysis Solder joint fatigue failure was one of the common failure mechanisms occurring in electronic...

... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD September 1, 2000, Associate Editor: B. Michel. 01 September 2000 14 03 2003 piezoelectric devices piezoelectric thin films micromechanical devices finite element analysis stress analysis stress-strain relations...

... scale packaging plastic deformation ball grid arrays flip-chip devices fatigue ductility stress-strain relations lead bonding integrated circuit interconnections finite element analysis Wafer Level Packaging Chip Scale Package Wire Interconnect Technology The function and design...

...-strain relations finite element analysis thermal expansion creep displacement measurement A powerful optomechanics technique such as moire´ interferometry has been used for many years to measure whole field displacements in the electronic packaging industry to calibrate and compare numerical...

... reliability failure analysis stress analysis finite element analysis Rayleigh-Ritz methods viscoplasticity stress-strain relations 10 October 2000 Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received...

... then be determined using ( 16 ) and ( 18 ). thin films multilayers internal stresses fracture mechanics stress-strain relations crack-edge stress field analysis Many engineering devices are constructed by bonding multi-layers of different materials. For example, multi-layered structures...

..., 2000. Associate Editor: B. Michel. 22 July 1999 28 June 2000 optical glass glass fibres optical fibres bending stress-strain relations Two-point bending is one of the simplest technique for strength measurements of optical glass fibers. In the technique, the bending...

...X. Q. Shi,; W. Zhou,; H. L. J. Pang, and; Z. P. Wang [S1043-7398(00)01601-7] eutectic alloys soldering thermomechanical treatment stress-strain relations mechanical properties The authors mistakenly stated that the paper “On Constitutive Response of 63/37 Pn/Sb Eutectic Solder...