... that comparisons of test results may not reflect relative performances under service conditions. This was illustrated with for a set of model BGA components with 20 mil (0.5 mm) diameter SAC305 solder balls, which were reflow soldered onto printed circuit boards using a eutectic SnPb solder paste and tested...

...) of chip during realignment 29 11 2009 25 09 2010 08 12 2010 08 12 2010 chip-on-board packaging Couette flow flip-chip devices interconnections reflow soldering solders viscosity wafer bonding flip chip no flow viscous misalignment self-alignment solder...

... of the various approaches are mutually consistent. 29 12 2004 29 09 2005 flip-chip devices reflow soldering solders surface tension eutectic alloys As demands on the performance of computers, communication systems, and optoelectronic products rapidly increase, electronic packaging...

...W. K. Chiang; Y. C. Chan This paper presents the reliability of anisotropic conductive film (ACF) joint tested under reflow soldering and environmental test effect. The ACF joint behaved differently under different reflow soldering profiles. The lower reflow temperature resulted in more reliable...

... underfills into the flip chip bonding between solders and electroless Ni pads and investigated the integrity of the reflowed solder interconnects. The reliability of these types of flip chip packages under thermal cycling was conducted. Computational modeling was performed to explain the experimental results...

... of the package was 892 h, and the average ultimate service time of the package was 1053 h. 17 08 2004 13 01 2005 metallisation reliability integrated circuit packaging reflow soldering testing tin aluminium alloys nickel alloys vanadium alloys copper alloys dies (machine tools...

... 04 01 2005 solders cooling flip-chip devices melting microassembling directional solidification integrated circuit packaging voids (solid) lead alloys tin alloys silver alloys reflow soldering In a flip chip assembly, the solder joints connecting the chip and its circuit...

...°C. An electrolytic Ni ∕ solder system has a relatively higher shear load, a lower dissolution rate of the Ni layer, and is more protective for the Cu layer during extended times of reflow. 05 08 2003 22 12 2004 ball grid arrays reflow soldering solders reliability nickel...

... Microelectronics Micro Lead Frame Packaging Perzyna Rigid Plastic Solder Joints Shape Standoff Height Surface Evolver Viscoplastic Von Mises Warpage ball grid arrays integrated circuit reliability viscoelasticity reflow soldering surface tension wetting finite element analysis 18 04...

... , “ Voiding in BGA at Solder Bumping Stage ,” ISHM Proceedings of Microelectronics and Packaging Conference , Philadelphia, PA, pp. 462 – 471 . Chan , Y. C. , Xie , D. J. , and Lai , J. K. L. , 1995 , “ Characteristics of Porosity in Solder Pastes during Infrared Reflow Soldering ,” J...

... issues. Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received June 2003. Associate Editor: K. Kishimoto. 01 June 2003 30 04 2004 reflow soldering surface tension wetting thermomechanical...

.... The final component of the solder paste is the vehicle system which provides suspending power for alloy particles and designated paste rheology (Hwang 1 ). reflow soldering surface mount technology printed circuit manufacture modelling heat transfer melting solidification cooling...

... 2003 bubbles reflow soldering voids (solid) surface tension viscosity flip-chip devices microassembling integrated circuit packaging The reliability of solder bumps has become more critical as the components become smaller. Figure 1 shows a typical flip-chip assembly commonly...

... will cause the interface in the solder joint to be more sensitive to stress 1 2 . Plastic BGA Solder Joint Cooling Rate Cu-Sn Intermetallics Intermetallic Compound Growth copper alloys tin alloys reflow soldering ball grid arrays plastic packaging annealing chemical interdiffusion...

... 14 03 2003 plastic packaging assembling circuit reliability failure analysis ball grid arrays surface mount technology reflow soldering printed circuit manufacture wetting thermal stability inspection Defect PBGA Assembly Soldering Profile Surface Mount Technology...

.... 03 December 2001 14 03 2003 flip-chip devices reflow soldering inspection quality control light interferometry ultrasonic applications spectral analysis data acquisition time-domain analysis signal processing Consumer demands are driving the current trend...

... . Kitano , M. , Kawai , S. , Nishimura , A. , and Nishi , K. , 1989 , “ A Study of Package Cracking During the Reflow Soldering Process ” (in Japanese), Trans. Jpn. Soc. Mech. Eng., Ser. A , 55 ( 510 ), pp. 356 – 363 . Hattori , T. , Nishimura , A. , and Murakami , G...

...Noriyasu Kawamura; Takashi Kawakami; Kikuo Kishimoto; Masaki Omiya; Toshikazu Shibuya Plastic encapsulated semiconductor packages may crack at the corner regions of die pads or chips if internal delamination occurs at an elevated temperature during the reflow soldering process. Thus, the structural...

... flip-chip devices integrated circuit interconnections encapsulation integrated circuit packaging plastic packaging shear strength heat treatment interface structure reflow soldering surface chemistry As the trend in requirements of electronic packaging is toward higher I/O, greater...

... Editor: S. M. Heinrich. 26 07 2002 integrated circuit reliability ball grid arrays reflow soldering thermal stress cracking plastic packaging integrated circuit modelling integrated circuit packaging Reliability is one of the major concerns for ball grid array (BGA...