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Keywords: printed circuit board
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Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2013, 135(3): 034501.
Paper No: EP-11-1100
Published Online: June 4, 2013
... composed of a printed circuit board (PCB), air gap, and a system casing. Exploiting the laminar organization and thinness of the laminate an approximate solution is derived. The solution is used to produce a guide for thermal design analysts, which is concerned with the sensitivity of the heat source...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011006.
Published Online: March 9, 2011
...K. C. Yung; H. Liem; H. S. Choy; W. K. Lun This paper reports the thermal performance of a high-brightness light-emitting diode (LED) array package with a novel placement method on a printed circuit board (PCB). The precise heat transfer analysis and modeling using computational fluid dynamics (CFD...
Journal Articles
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041106.
Published Online: November 14, 2008
...Wataru Nakayama An analytical model is developed to estimate the heat transfer performance of printed circuit board (PCBs). The PCB under study is the substrate for a ball-grid-array (BGA) package. Under the BGA, the PCB has a belt of densely populated through-vias that penetrate the laminate...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021001.
Published Online: April 15, 2008
...Pavel Simacek; Suresh G. Advani; Kossi Zonvide; Leonard W. Barrett Manufacturing of printed circuit boards or chip-packaging substrates involves the use of resin-filled reinforcement materials, known as prepregs, to bond together laminates with patterned copper layers and serve as dielectric...