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Keywords: power cycling
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Journal Articles

Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling

S. B. Park, Rahul Joshi, Izhar Ahmed, Soonwan Chung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2008, 130(4): 041004.
https://doi.org/10.1115/1.2993146
Published Online: November 17, 2008
...S. B. Park; Rahul Joshi; Izhar Ahmed; Soonwan Chung Experimental and numerical techniques are employed to assess the thermomechanical behavior of ceramic and organic flip chip packages under power cycling (PC) and accelerated thermal cycling (ATC). In PC, nonuniform temperature distribution...
View Articletitled, Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling
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Topics: Ball-Grid-Array packages, Ceramics, Computational fluid dynamics, Deformation, Finite element analysis, Flip-chip devices, Interferometry, Manufacturing, Reliability, Solder joints
Journal Articles

Shorter Field Life in Power Cycling for Organic Packages

S. B. Park, Izhar Z. Ahmed
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 28–34.
https://doi.org/10.1115/1.2429706
Published Online: May 1, 2006
...S. B. Park; Izhar Z. Ahmed The importance of power cycling as a mean of reliability assessment was revisited for flip chip plastic ball grid array (FC-PBGA) packages. Conventionally, reliability was addressed empirically through accelerated thermal cycling (ATC) because of its simplicity...
View Articletitled, Shorter Field Life in Power Cycling for Organic Packages
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Topics: Computational fluid dynamics, Finite element analysis, Flip-chip devices, Manufacturing, Reliability, Solders, Temperature, Ball-Grid-Array packaging, Structural analysis, Cycles
Journal Articles

Transient Thermal Analysis for Board-Level Chip-Scale Packages Subjected to Coupled Power and Thermal Cycling Test Conditions

Tong Hong Wang, Chang-Chi Lee, Yi-Shao Lai, Yu-Cheng Lin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 281–284.
https://doi.org/10.1115/1.2229229
Published Online: October 7, 2005
... are utilized to deal with time-varying thermal boundary conditions brought by thermal cycling. It is obvious from the analysis that the presence of power cycling leads to a significant deviation of the junction temperature from the thermal cycling profile. However, for components away from the die...
View Articletitled, Transient Thermal Analysis for Board-Level Chip-Scale Packages Subjected to Coupled Power and Thermal Cycling Test Conditions
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Topics: Boundary-value problems, Temperature, Thermal analysis, Transients (Dynamics), Vehicles, Finite element analysis, Junctions