... channel design for an array of generic power amplifier units. Several different channel insert configurations are investigated as miniheat exchangers using both copper fins and graphite foam. Experiments were conducted measuring the chip temperatures as well as the inlet liquid temperature. CFD...

... plate channel design for an array of generic power amplifier modules. In the current study two materials, graphite foam and a microfibrous material, are investigated as mini-heat exchangers to be implemented in the cooling channel of the base plate. Computational simulations have been conducted on some...

...Victor Adrian Chiriac; Tien-Yu Tom Lee The latest commercial applications for microelectronics use GaAs material for RF power amplifier (PA) devices. This leads to the necessity of identifying low cost packaging solutions with high standards for reliability, electrical, and thermal performance...