...Zuozhu Yin; Fenglian Sun; Mengjiao Guo In electronic packaging, most researchers are mainly focused on the mechanical properties of Cu–Sn intermetallic compounds (IMCs) at room temperature; few studies have looked into the relationship between hardness, elastic modulus, and plasticity of IMCs...

...Hironori Tohmyoh; Kiichiro Yamanobe; Masumi Saka; Jiro Utsunomiya; Takeshi Nakamura; Yoshikatsu Nakano This paper deals with typical mechanical problems that are encountered in a solderless press-fit assembly process. First, the elastic-plastic properties of two types of press-fit pins...

...David M. Pierce; Sheri D. Sheppard; Arlo F. Fossum; Paul T. Vianco; Mike K. Neilsen A unified creep plasticity damage (UCPD) constitutive model was developed to predict the fatigue of 95.5Sn–3.9Ag–0.6Cu solder joints. Compression, stress-strain and creep properties were generated in previous...

...David M. Pierce; Sheri D. Sheppard; Paul T. Vianco; Jerome A. Regent; J. Mark Grazier A general fatigue life prediction methodology, based on a unified creep plasticity damage (UCPD) model, was developed for predicting fatigue cracks in 95.5Sn–3.9Ag–0.6Cu (wt %) solder interconnects...

...Russell Whitenack; Chandra Desai; Mostafa Rassaian The disturbed state concept (DSC) with the hierarchical single surface (HISS) plasticity model have been proposed and validated previously for a wide range of problems in electronic packaging. In this paper, detailed analyses are performed...

...Juan Gomez; Cemal Basaran Strain gradient plasticity theories that have emerged during recent years to provide an explanation for size dependent behavior exhibited by some materials have also created a need for additional material parameters. In this study on Pb ∕ Sn solder alloys’ material length...

...M. Uschitsky; E. Suhir Mechanical reliability of epoxy molding compounds in plastic packages of integrated circuits (IC) is greatly affected by the compound ability to absorb moisture. Accordingly, the objective of the study is to evaluate the effect of moisture sorption on the mechanical...