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Keywords: liquid cooling
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Journal Articles
Ali Heydari, Ahmad R. Gharaibeh, Mohammad Tradat, Qusai Soud, Yaman Manaserh, Vahideh Radmard, Bahareh Eslami, Jeremy Rodriguez, Bahgat Sammakia
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041102.
Paper No: EP-24-1007
Published Online: June 17, 2024
...), where the storage, storing, and processing of data have grown quickly as a result of evolving technological trends and rising demand for online services, which has led to an increase in the amount of waste heat generated by IT equipment. Through the implementation of hybrid air and liquid cooling...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041101.
Paper No: EP-24-1006
Published Online: May 24, 2024
...-mail: agharai1@binghamton.edu 04 01 2024 22 04 2024 24 05 2024 multichip module liquid cooling heat sink data centers heat transfer The world is being inundated with an overwhelming amount of digital data from numerous sources, including social media, blog posts...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021008.
Paper No: EP-12-1104
Published Online: March 28, 2013
..., 2012; final manuscript received January 15, 2013; published online March 28, 2013. Assoc. Editor: Giulio Lorenzini. 28 11 2012 15 01 2013 Liquid cooling incorporating microchannels are used to cool electronic chips in order to remove more heat load. However, such microchannels...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Design Innovations
J. Electron. Packag. June 2009, 131(2): 025002.
Published Online: April 3, 2009
.... , Chau , D. , and Chrysler , G. A. C. G. , 2006 , “ Thin Film Thermoelectric Cooler Thermal Validation and Product Thermal Performance Estimation ,” ITHERM 2006 . Bar-Cohen , A. , Arik , M. , and Ohadi , M. , 2006 , “ Direct Liquid Cooling of High Flux Micro and Nano...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 466–478.
Published Online: March 27, 2006
.... Cooling capabilities of different cooling arrangements were compared and the results from simulations and experiments were combined to create response surfaces and to find the optimal values of the design parameters. The liquid cooling results presented here are for turbulent flow conditions. Similar...
