... management strategies in 3D stacks. 3D chip stacks thermal management through-silicon-vias (TSVs) 3D integration integrated circuit packaging thermal management (packaging) three-dimensional integrated circuits 2011 American Society of Mechanical Engineers ...

... 2011 14 09 2011 cooling graphs integrated circuit packaging thermoelectricity Thermoelectric cooler design COP performance 3D TEC system analysis In recent years, cooling high heat flux systems such as computer microprocessors, logic memory, and power supplies have...

...- induced stresses dominate. 31 03 2010 06 06 2011 14 09 2011 14 09 2011 finite element analysis integrated circuit packaging integrated circuit reliability Raman spectroscopy three-dimensional integrated circuits 3D packaging has spurred significant research...

... 07 2009 09 08 2010 09 12 2010 09 12 2010 aluminium alloys gold alloys integrated circuit metallisation integrated circuit packaging lead bonding scanning electron microscopy surface topography ball bonding bonding parameters gold aluminide surface topographical...

... 2009 03 05 2010 25 06 2010 25 06 2010 delays integrated circuit packaging microprocessor chips minimisation thermal management (packaging) In earlier microprocessor generations, the required instructions for the core processor were stored and channeled via the bus from...

... of an experimental model of an active cooling method to cool a 25 W stack-dice to approximately 13 ° C utilizing a multidimensional configured thermoelectric will be presented. 16 01 2010 18 05 2010 23 06 2010 23 06 2010 cooling integrated circuit packaging integrated circuit...

... packaging technologies in electronic systems, and related engineering analysis techniques for design and reliability engineering applications. The book consists of four parts (1 to 4) with a total of 15 chapters. integrated circuit design integrated circuit packaging integrated circuit reliability...

... circuit packaging joining processes anisotropic conductive adhesives (ACAs) copper anti-oxidant silane coupling agent electrical contact resistance reliability Electrically conductive adhesives (ECAs) have been extensively used for interconnection and joining materials...

... computational model for the simulation of practical epoxy molding compound encapsulation. 12 08 2007 28 09 2009 04 03 2010 04 03 2010 encapsulation finite difference methods integrated circuit packaging moulding plastic packaging semiconductor process modelling two-phase flow...

... accuracy. Special attention is made to analyze and eliminate the possible sources of measurement inaccuracy. A number of measurement examples prove the usability of the developed measuring instrument. 19 01 2009 20 05 2009 25 02 2010 25 02 2010 integrated circuit packaging...

... package. Furthermore, the simulation results reveal that the heat dissipation efficiency of the proposed CIS package exceeds that of the traditional package by 245%. 18 04 2008 15 05 2009 12 11 2009 12 11 2009 CMOS image sensors integrated circuit packaging microfabrication...

... geometry are proposed. 02 10 2008 14 06 2009 12 11 2009 12 11 2009 integrated circuit interconnections integrated circuit packaging solders Empirical life models have been used for decades to predict the fatigue life of solder joints. The microelectronics packaging...

... reflow chip scale package soft film cavitation unstable void growth wafer level film (WLF) cohesive failure die-attach desorption diffusion integrated circuit packaging moisture vapour pressure 18 09 2008 22 03 2009 31 07 2009 2009 American Society of Mechanical...

... reflow electronic package multiscale analysis diffusion integrated circuit packaging moisture numerical analysis vapour pressure 09 01 2008 22 03 2009 31 07 2009 2009 American Society of Mechanical Engineers ...

...-free solder strain rate effect tensile strength split Hopkinson tensile bar electronic products fractography integrated circuit packaging integrated circuit reliability solders stress-strain relations tensile strength tin compounds 19 06 2008 13 03 2009 16 06 2009...

... 0017-9310 10.1016/S0017-9310(03)00044-9 , 46 ( 15 ), pp. 2737 – 2753 . 25 08 2008 22 12 2008 03 04 2009 computational fluid dynamics heat sinks integrated circuit packaging micropumps thermal management (packaging) hot spots liquid cooling As the power...

... arrays copper alloys cracks creep testing fatigue testing finite element analysis integrated circuit interconnections integrated circuit packaging integrated circuit reliability life testing silver alloys solders stress-strain relations tin alloys As technology progresses, both...

... the equations for various surfaces to calculate the maximum junction temperature for a given multilayer body. Finally validation of the analytical solution is carried out using previously developed numerical model. 18 11 2007 15 05 2008 12 02 2009 integrated circuit packaging integrated...

... analytical solution spreading resistance heat sinks integrated circuit packaging plates (structures) thermal conductivity thermal management (packaging) thermal resistance 10 03 2008 06 05 2008 11 02 2009 2009 American Society of Mechanical Engineers ...

... integrated circuit packaging integrated circuit reliability light interferometry plastic packaging thermal expansion thermomechanical treatment power cycling accelerated thermal cycling Moiré interferometry flip chip PBGA CBGA finite element analysis computational fluid dynamics...