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Keywords: heat losses
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 14–21.
Published Online: April 30, 2004
... of heat source location on maximum power dissipation is presented for both horizontal and vertical orientations. Heat losses due to radiation, natural convection and board conduction are quantified. As long as the heat sources are more than 2 cm apart, they do not influence each other on the FR4 board...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 456–460.
Published Online: September 17, 2003
... that permits the computation of heat loss from an extended surface based on variable heat transfer coefficient, fin geometry, and surface curvature. The influence of these parameters on fin efficiency for typical fins is reported. Contributed by the Electronic and Photonic Packaging Division...