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Keywords: fan-out wafer-level package
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011004.
Paper No: EP-19-1023
Published Online: September 19, 2019
...Hsien-Chie Cheng; Yan-Cheng Liu This study presents a comprehensive assessment of the process-induced warpage of molded wafer for chip-first, face-down fan-out wafer-level packaging (FOWLP) during the fan-out fabrication process. A process-dependent simulation methodology is introduced, which...
