...Fei Chong Ng; Mohamad Aizat Abas Recent advances in the micro-electronics industry have increased the demand for smaller and more compact package devices with higher performance. This paper presents an analytical multiparametric design optimization approach for the miniaturization of flip-chip...

... − h ∕ H min h ∕ H max − h ∕ H min The problem is a multi-objective design optimization problem, where the objectives are maximizing the total heat transfer rate, Q , minimizing the pressure drop, Δ P , and minimizing the material used for protrusions, S...

... Design Optimization Ball Grid Array Current trends in electronics packaging which include increasing power density and shrinking package size have caused significant challenges in packaging design at every packaging level, from the chip level to the system level. The overall electronics...