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Keywords: coolants
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021008.
Published Online: April 2, 2009
...T. L. Bergman Heat transfer enhancement associated with use of a nanofluid coolant is analyzed for small electronic heat sinks. The analysis is based on the ε -NTU heat exchanger methodology, and is used to examine enhancement associated with use of H 2 O – Al 2 O 3 nanofluids in a heat sink...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031003.
Published Online: July 29, 2008
..., and coolant flow rate. It was found that the high thermal conductivity copper of the direct bonded copper (DBC) layer is the most feasible location for the channels. Based on a new analytical heat transfer model developed for microchannels in IPEM structures, several design configurations were proposed...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 466–478.
Published Online: March 27, 2006
... cooling experiments to study the effects of different coolants. De-ionized water was used as the liquid coolant in one case and air in the other. The effects of separation distance and flow conditions on the heat transfer and on the fluid flow characteristics were investigated in detail for both coolants...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 546–553.
Published Online: January 24, 2005
...C. P. Tso; K. W. Tou; H. Bhowmik Both transient and steady-state experiments are performed to study the single-phase heat transfer characteristics on an array of four in-line, flush-mounted simulated chips in a vertical rectangular channel. Water is the coolant media, and the flow covers the wide...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 381–390.
Published Online: December 17, 2004
... is to optimize micro-channel dimensions in pursuit of acceptable values for the thermal/fluid parameters corresponding to a given heat flux, coolant, and overall dimensions of the heat generating device to which the heat sink is attached. The proposed optimization methodology yields an acceptable design region...